SOLID-STATE SWITCH ARCHITECTURE FOR MULTI-MODE OPERATION OF A THERMOELECTRIC DEVICE

Abstract

A solid-state switch architecture for multi-mode operation of a thermoelectric device and a method of operating such a device are provided herein. The switch architecture includes one or more inputs operable to receive power from one or more power supplies. The switch architecture also includes multiple outputs operable to provide power to respective channels of the thermoelectric device. The switch architecture also includes multiple solid-state switches operable to connect the one or more inputs to the outputs and a controller operable to toggle the solid-state switches to provide multiple modes of operation of the thermoelectric device. In this way, the thermoelectric device can be operated in a more efficient way while decreasing the size and increasing the reliability of the switch architecture. Also, this may allow the use of standard and less expensive power supplies. This may result in a significant reduction in cost and an increase in reliability.

Description

RELATED APPLICATIONS

This application claims the benefit of provisional patent application Ser. No. 62/470,003, filed Mar. 10, 2017, the disclosure of which is hereby incorporated herein by reference in its entirety.

FIELD OF THE DISCLOSURE

The present disclosure relates to thermoelectric devices and their operation.

BACKGROUND

Thermoelectric devices are solid state semiconductor devices that, depending on the particular application, can be either Thermoelectric Coolers (TECs) or Thermoelectric Generators (TEGs). TECs are solid state semiconductor devices that utilize the Peltier effect to transfer heat from one side of the device to the other, thereby creating a cooling effect on the cold side of the device. Because the direction of heat transfer is determined by the polarity of an applied voltage, thermoelectric devices can be used generally as temperature controllers. Similarly, TEGs are solid state semiconductor devices that utilize the Seebeck effect to convert heat (i.e., a temperature difference from one side of the device to the other) directly into electrical energy. A thermoelectric device includes at least one N-type leg and at least one P-type leg. The N-type legs and the P-type legs are formed of a thermoelectric material (i.e., a semiconductor material having sufficiently strong thermoelectric properties). In order to effect thermoelectric cooling, an electrical current is applied to the thermoelectric device. The direction of current transference in the N-type legs and the P-type legs is parallel to the direction of heat transference in the thermoelectric device. As a result, cooling occurs at the top surface of the thermoelectric device, and the heat is released at the bottom surface of the thermoelectric device.

Thermoelectric systems that use thermoelectric devices are advantageous compared to non-thermoelectric systems because they lack moving mechanical parts, have long lifespans, and can have small sizes and flexible shapes. However, there remains a need for thermoelectric devices with increased performance and longer lifespans.

SUMMARY

A solid-state switch architecture for multi-mode operation of a thermoelectric device and a method of operating such a device are provided herein. In some embodiments, a switch architecture for multi-mode operation of a thermoelectric device includes one or more inputs operable to receive power from one or more power supplies. The switch architecture also includes multiple outputs operable to provide power to respective channels of the thermoelectric device. The switch architecture also includes multiple solid-state switches operable to connect the one or more inputs to the outputs and a controller operable to toggle the solid-state switches to provide multiple modes of operation of the thermoelectric device. In this way, the thermoelectric device can be operated in a more efficient way while decreasing the size and increasing the reliability of the switch architecture. Also, this may allow the use of standard and less expensive power supplies. This may result in a significant reduction in cost and an increase in reliability.

In some embodiments, the controller is operable to toggle the solid-state switches to provide power to at least a subset of the outputs in series. In some embodiments, the controller is operable to toggle the solid-state switches to provide power to at least a subset of the outputs in parallel.

In some embodiments, the controller is operable to toggle the solid-state switches to provide power to at least a subset of the outputs to provide a high capacity mode of operation of the thermoelectric device. In some embodiments, the controller is operable to provide the high capacity mode of operation of the thermoelectric device when a temperature of a region being cooled by the thermoelectric device exceeds a steady state range including a set point temperature.

In some embodiments, the controller is operable to toggle the solid-state switches to provide power to at least a subset of the outputs to provide a high efficiency mode of operation of the thermoelectric device. In some embodiments, the controller is operable to provide the high efficiency mode of operation of the thermoelectric device when the temperature of the region being cooled by the thermoelectric device is within the steady state range including the set point temperature.

In some embodiments, the thermoelectric device includes multiple thermoelectric coolers and the channels of the thermoelectric device are disposed on an interconnect board that enables selective control of multiple different subsets of the thermoelectric coolers.

In some embodiments, a cartridge includes the switch architecture and the thermoelectric device.

In some embodiments, each of the solid-state switches is a transistor. In some embodiments, each of the solid-state switches is a metal-oxide-semiconductor field-effect transistor (MOSFET).

In some embodiments, a method of operating a switch architecture for multi-mode operation of a thermoelectric device includes determining a first mode of operation of the thermoelectric device and toggling one or more of the solid-state switches to provide the first mode of operation of the thermoelectric device.

In some embodiments, the method also includes determining a second mode of operation of the thermoelectric device that is different than the first mode of operation and toggling one or more of the solid-state switches to provide the second mode of operation of the thermoelectric device.

In some embodiments, toggling the one or more of the solid-state switches includes toggling the one or more of the solid-state switches to provide power to at least a subset of outputs in series. In some embodiments, toggling the one or more of the solid-state switches includes toggling the one or more of the solid-state switches to provide power to at least a subset of outputs in parallel.

In some embodiments, toggling the one or more of the solid-state switches includes toggling the one or more of the solid-state switches to provide power to at least a subset of the outputs to provide a high capacity mode of operation of the thermoelectric device. In some embodiments, determining the first mode of operation or the second mode of operation includes determining the high capacity mode of operation of the thermoelectric device when a temperature of a region being cooled by the thermoelectric device exceeds a steady state range including a set point temperature.

In some embodiments, toggling the one or more of the solid-state switches includes toggling the one or more of the solid-state switches to provide a high efficiency mode of operation of the thermoelectric device. In some embodiments, determining the first mode of operation or the second mode of operation includes determining when the temperature of the region being cooled by the thermoelectric device is within the steady state range including the set point temperature.

Those skilled in the art will appreciate the scope of the present disclosure and realize additional aspects thereof after reading the following detailed description of the preferred embodiments in association with the accompanying drawing figures.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the disclosure, and together with the description serve to explain the principles of the disclosure.

FIG. 1 illustrates a thermoelectric refrigeration system having a cooling chamber, a heat exchanger including at least one Thermoelectric Module (TEM) disposed between a cold side heat sink and a hot side heat sink, and a controller that controls the TEM according to some embodiments of the present disclosure;

FIGS. 2A-2C illustrate an architecture for driving multiple channels of a device in parallel;

FIGS. 3A-3C illustrate an architecture for driving multiple channels of a device in series;

FIG. 4 illustrates a solid-state switch architecture for multi-mode operation of a thermoelectric device, according to some embodiments disclosed herein;

FIG. 5A illustrates a configuration of the solid-state switch architecture of FIG. 4 for driving multiple channels of the device in parallel, according to some embodiments disclosed herein;

FIG. 5B illustrates a configuration of the solid-state switch architecture of FIG. 4 for driving multiple channels of the device in series, according to some embodiments disclosed herein;

FIG. 6 illustrates a process for operating the solid-state switch architecture for multi-mode operation of a thermoelectric device of FIG. 4, according to some embodiments disclosed herein; and

FIG. 7 is an illustration of a device that includes multiple TECs in multiple channels disposed on an interconnect board that enables selective control of multiple different subsets of the TECs in the array of TECs, according to some embodiments disclosed herein.

DETAILED DESCRIPTION

The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.

It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the

Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including” when used herein specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Before discussing specific embodiments, an example system where such embodiments might be used is discussed. FIG. 1 illustrates a thermoelectric refrigeration system 10 having a cooling chamber 12, a heat exchanger 14 including at least one Thermoelectric Module (TEM) 22 (referred to herein singularly as TEM 22 or plural as TEMs 22) disposed between a cold side heat sink 20 and a hot side heat sink 18, and a controller 16 that controls the TEM 22 according to some embodiments of the present disclosure. When a TEM 22 is used to provide cooling it may sometimes be referred to as a Thermoelectric Cooler (TEC) 22.

The TEMs 22 are preferably thin film devices. When one or more of the TEMs 22 are activated by the controller 16, the activated TEMs 22 operate to heat the hot side heat sink 18 and cool the cold side heat sink 20 to thereby facilitate heat transfer to extract heat from the cooling chamber 12. More specifically, when one or more of the TEMs 22 are activated, the hot side heat sink 18 is heated to thereby create an evaporator and the cold side heat sink 20 is cooled to thereby create a condenser, according to some embodiments of the current disclosure.

Acting as a condenser, the cold side heat sink 20 facilitates heat extraction from the cooling chamber 12 via an accept loop 24 coupled with the cold side heat sink 20. The accept loop 24 is thermally coupled to an interior wall 26 of the thermoelectric refrigeration system 10. The interior wall 26 defines the cooling chamber 12. In one embodiment, the accept loop 24 is either integrated into the interior wall 26 or integrated directly onto the surface of the interior wall 26. The accept loop 24 is formed by any type of plumbing that allows for a cooling medium (e.g., a two-phase coolant) to flow or pass through the accept loop 24. Due to the thermal coupling of the accept loop 24 and the interior wall 26, the cooling medium extracts heat from the cooling chamber 12 as the cooling medium flows through the accept loop 24. The accept loop 24 may be formed of, for example, copper tubing, plastic tubing, stainless steel tubing, aluminum tubing, or the like.

Acting as an evaporator, the hot side heat sink 18 facilitates rejection of heat to an environment external to the cooling chamber 12 via a reject loop 28 coupled to the hot side heat sink 18. The reject loop 28 is thermally coupled to an outer wall 30, or outer skin, of the thermoelectric refrigeration system 10.

The thermal and mechanical processes for removing heat from the cooling chamber 12 are not discussed further. Also, it should be noted that the thermoelectric refrigeration system 10 shown in FIG. 1 is only a particular embodiment of a use and control of a TEM 22. All embodiments discussed herein should be understood to apply to thermoelectric refrigeration system 10 as well as any other use of a TEM 22.

Continuing with the example embodiment illustrated in FIG. 1, the controller 16 operates to control the TEMs 22 in order to maintain a desired set point temperature within the cooling chamber 12. In general, the controller 16 operates to selectively activate/deactivate the TEMs 22, selectively control an amount of power provided to the TEMs 22, and/or selectively control a duty cycle of the TEMs 22 to maintain the desired set point temperature. Further, in preferred embodiments, the controller 16 is enabled to separately or independently control one or more and, in some embodiments, two or more subsets of the TEMs 22, where each subset includes one or more different TEMs 22. Thus, as an example, if there are four TEMs 22, the controller 16 may be enabled to separately control a first individual TEM 22, a second individual TEM 22, and a group of two TEMs 22. By this method, the controller 16 can, for example, selectively activate one, two, three, or four TEMs 22 independently, at maximized efficiency, as demand dictates.

It should be noted that the thermoelectric refrigeration system 10 is only an example implementation and that the systems and methods disclosed herein are applicable to other uses of thermoelectric devices as well.

Thermoelectric systems that use thermoelectric devices are advantageous compared to non-thermoelectric systems because they lack moving mechanical parts, have long lifespans, and can have small sizes and flexible shapes. However, there remains a need for thermoelectric devices with increased performance and longer lifespans.

FIGS. 2A-2C illustrate an architecture for driving multiple channels of a device in parallel. An Alternating Current (AC) or Direct Current (DC) offline power supply 32 outputs power to a DC to DC converter 34 which then provides power to a device 36. As shown, the device 36 contains two channels that are being powered in parallel. This DC to DC converter 34 may be bulky or expensive. FIG. 2A shows an example where the DC to DC converter 34 can provide a variable DC voltage to power the device 36. This type of variability may be expensive and difficult to tune for efficiency. FIGS. 2B and 2C show examples of Pulse Width Modulation (PWM) being used to provide the desired amount of power to the device 36. Since PWM typically switches between some high value and some low (e.g., zero) value, the actual efficiency of the device 36 is determined by that high value and low value and not the average amount of power provided. This can lead to less efficient power levels and heat leakback during the off periods.

FIGS. 3A-3C illustrate an architecture for driving multiple channels of a device in series. Again, an AC or DC offline power supply 32 outputs power to a DC to DC converter 34 which then provides power to the device 36. As shown, the device 36 contains two channels that are being powered in series. Again, this DC to DC converter 34 may be bulky or expensive. FIG. 3A shows an example where the DC to DC converter 34 can provide a variable DC voltage to power the device 36. This type of variability may be expensive and difficult to tune for efficiency. FIGS. 3B and 3C show examples of PWM being used to provide the desired amount of power to the device 36. Again, since PWM typically switches between some high value and some low (e.g., zero) value, the actual efficiency of the device 36 is determined by that high value and low value and not the average amount of power provided. This can lead to less efficient power levels and heat leakback during the off periods.

Thermoelectric devices in cooling applications are operated using DC voltage. To vary the heat pumping, this DC voltage level is increased, decreased, or PWM. Varying the voltage level requires access to the associated power regulator's control loop which may introduce potential instabilities and complexities, or adding secondary DC to DC regulator(s) to the bulk voltage. PWM does not allow for operation of the thermoelectric device at both the maximum Coefficient of Performance (COP) and maximum Q points of its operational curve (since the performance of the device depends on the instantaneous voltage applied to it).

A solid-state switch architecture for multi-mode operation of a thermoelectric device and a method of operating such a device are provided herein. FIG. 4 illustrates a solid-state switch architecture 38 for multi-mode operation of a thermoelectric device 40, according to some embodiments disclosed herein. As illustrated, the switch architecture 38 for multi-mode operation of a thermoelectric device 40 includes one or more inputs operable to receive power from one or more power supplies 42. The switch architecture 38 also includes multiple outputs operable to provide power to respective channels of the thermoelectric device 40.

The switch architecture 38 also includes multiple solid-state switches 44 operable to connect the one or more inputs to the outputs and a controller 46 operable to toggle the solid-state switches 44-1 through 44-N (for simplicity, these are often referred to as switches 44 or switch 44) to provide multiple modes of operation of the thermoelectric device 40. In this way, the thermoelectric device 40 can be operated in a more efficient way while decreasing the size and increasing the reliability of the switch architecture 38. Also, this may allow the use of standard and less expensive power supplies 42. This may result in a significant reduction in cost and an increase in reliability.

In some embodiments, each of the solid-state switches is a transistor. In some embodiments, each of the solid-state switches is a metal-oxide-semiconductor field-effect transistor (MOSFET).

In some embodiments, the proposed solid-state electronic circuit architecture in combination with an associated thermoelectric heat pump device (such as is described below) allows for operation of the device at both the maximum COP and maximum Q modes without the need for varying the bulk voltage level provided by the power supply 42.

In some embodiments, the controller 46 is operable to toggle the solid-state switches to provide power to at least a subset of the outputs in parallel. FIG. 5A illustrates a configuration of the solid-state switch architecture 38 of FIG. 4 for driving multiple channels of the thermoelectric device 40 in parallel, according to some embodiments disclosed herein. In this example, switches 44-1 and 44-N are closed, allowing current to flow through these switches. Conversely, switches 44-2 and 44-3 are open, prohibiting current to flow through these switches. This connects both Channel 1 and Channel N of the thermoelectric device 40 in parallel. In this example, this provides the most current to each of the Channels and may be configured to be a high capacity mode of operation of the thermoelectric device 40. In some embodiments, the controller 46 is operable to provide the high capacity mode of operation of the thermoelectric device 40 when a temperature of a region being cooled by the thermoelectric device 40 exceeds a steady state range including a set point temperature.

In some embodiments, the controller 46 is operable to toggle the solid-state switches 44 to provide power to at least a subset of the outputs in series. FIG. 5B illustrates a configuration of the solid-state switch architecture of FIG. 4 for driving multiple channels of the device in series, according to some embodiments disclosed herein. In this example, switches 44-2 and 44-3 are closed, allowing current to flow through these switches. Conversely, switches 44-1 and 44-4 are open, prohibiting current to flow through these switches. This connects both Channel 1 and Channel N of the thermoelectric device 40 in series. In this example, this provides the least current to each of the Channels and may be configured to be a high efficiency mode of operation of the thermoelectric device 40. In some embodiments, the controller is operable to provide the high efficiency mode of operation of the thermoelectric device when the temperature of the region being cooled by the thermoelectric device is within the steady state range including the set point temperature.

Note that while only two Channels are shown, the embodiments disclosed herein are not limited thereto. For instance, there could be any number of Channels and some could be connected in series while others are connected in parallel. This could enable many different modes of operation of the thermoelectric device 40.

FIG. 6 illustrates a process for operating the solid-state switch architecture 38 for multi-mode operation of a thermoelectric device 40 of FIG. 4, according to some embodiments disclosed herein. First, the controller 46 determines a first (or subsequent) mode of operation of the thermoelectric device 40 (step 100). Then, the controller 46 toggles one or more of the solid-state switches 44 to provide the first (or subsequent) mode of operation of the thermoelectric device 40 (step 102). As shown in FIG. 6, this process can then repeat as the controller 46 determines a subsequent (e.g., a second) mode of operation of the thermoelectric device 40. In some embodiments, these modes of operation of the thermoelectric device 40 could be any mode discussed in US Patent Publication US 2013/0291560, entitled “CARTRIDGE FOR MULTIPLE THERMOELECTRIC MODULES”, which is hereby incorporated herein by reference in its entirety.

In some embodiments, the thermoelectric device 40 includes multiple thermoelectric coolers and the channels of the thermoelectric device are disposed on an interconnect board that enables selective control of multiple different subsets of the thermoelectric coolers.

FIG. 7 is an illustration of a device that includes multiple TECs in multiple channels disposed on an interconnect board that enables selective control of multiple different subsets of the TECs in the array of TECs, according to some embodiments disclosed herein. In the embodiment of FIG. 7, a cartridge 48 includes TECs 50a through 50f (more generally referred to herein collectively as TECs 50 and individually as TEC 50) disposed on an interconnect board 52. The TECs 50 are thin film devices. Some non-limiting examples of thin film TECs are disclosed in U.S. Pat. No. 8,216,871, entitled METHOD FOR THIN FILM THERMOELECTRIC MODULE FABRICATION, which is hereby incorporated herein by reference in its entirety.

The interconnect board 52 includes electrically conductive Channels 54a through 54d (more generally referred to herein collectively as Channels 54 and individually as Channel 54) that define four subsets of the TECs 50a through 50f. In particular, the TECs 50a and 50b are electrically connected in series with one another via the Channel 54a and, as such, form a first subset of the TECs 50. Likewise, the TECs 50c and 50d are electrically connected in series with one another via the Channel 54b and, as such, form a second subset of the TECs 50. The TEC 50e is connected to the Channel 54d and, as such, forms a third subset of the TECs 50, and the TEC 50f is connected to the Channel 54c and, as such, forms a fourth subset of the TECs 50. The controller 46 can, in no particular order, selectively control the first subset of TECs 50 (i.e., the TECs 50a and 50b) by controlling a current applied to the Channel 54a, selectively control the second subset of the TECs 50 (i.e., the TECs 50c and 50d) by controlling a current applied to the Channel 54b, selectively control the third subset of the TECs 50 (i.e., the TEC 50e) by controlling a current applied to the Channel 54d, and selectively control the fourth subset of the TECs 50 (i.e., the TEC 50f) by controlling a current applied to the Channel 54c. Thus, using the TECs 50a and 50b as an example, the controller 46 can selectively activate/deactivate the TECs 50a and 50b by either removing current from the Channel 54a (deactivate) or by applying a current to the Channel 54a (activate), selectively increase or decrease the current applied to the Channel 54a while the TECs 50a and 50b are activated, and/or control the current applied to the Channel 54a.

In some embodiments, the interconnect board 52 includes openings 56a and 56b (more generally referred to herein collectively as openings 56 and individually as opening 56) that expose bottom surfaces of the TECs 50a through 50f. When disposed between a hot side heat sink and a cold side heat sink, the openings 56a and 56b enable the bottom surfaces of the TECs 50a through 50f to be thermally coupled to the appropriate heat sink.

In accordance with embodiments of the present disclosure, during operation, the controller 46 can selectively activate or deactivate any combination of the subsets of the TECs 50 by applying or removing current from the corresponding Channels 54a through 54d. Further, the controller 46 can control the operating points of the active TECs 50 by controlling the amount of current provided to the corresponding Channels 54a through 54d. For example, if only the first subset of the TECs 50 is to be activated and operated at Q_COPmax during steady state operation, then the controller 46 provides the current I_COPmax to the Channel 54a to thereby activate the TECs 50a and 50b and operate the TECs 50a and 50b at Q_COPmax and removes current from the other Channels 54b through 54d to thereby deactivate the other TECs 50c through 50f.

In the embodiment shown with reference to FIG. 7, the cartridge 48 includes the TECs 50a through 50f. In accordance with embodiments of the present disclosure, the cartridge 48 may include any number of TECs 50.

In some embodiments, the cartridge 48 includes the switch architecture 38 and the thermoelectric device 40 (e.g., TECs 50). This would enable to the cartridge 48 to be used with a standard power supply 42 that could be less complex and less expensive. Additionally, since the switch architecture 38 is solid-state, the inclusion in the cartridge 48 would not have much of an impact on the size or durability of cartridge 48.

Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.

Claims

1. A switch architecture for multi-mode operation of a thermoelectric device comprising:

one or more inputs operable to receive power from one or more power supplies;

a plurality of outputs operable to provide power to a respective plurality of channels of the thermoelectric device;

a plurality of solid-state switches operable to connect the one or more inputs to the plurality of outputs; and

a controller operable to toggle the plurality of solid-state switches to provide multiple modes of operation of the thermoelectric device.

2. The switch architecture of claim 1 wherein the controller is operable to toggle the plurality of solid-state switches to provide power to at least a subset of the plurality of outputs in series.

3. The switch architecture of claim 2 wherein the controller is operable to toggle the plurality of solid-state switches to provide power to at least a subset of the plurality of outputs in parallel.

4. The switch architecture of claim 3 wherein the controller is operable to toggle the plurality of solid-state switches to provide power to at least a subset of the plurality of outputs to provide a high capacity mode of operation of the thermoelectric device.

5. The switch architecture of claim 4 wherein the controller is operable to provide the high capacity mode of operation of the thermoelectric device when a temperature of a region being cooled by the thermoelectric device exceeds a steady state range including a set point temperature.

6. The switch architecture of claim 5 wherein the controller is operable to toggle the plurality of solid-state switches to provide power to at least a subset of the plurality of outputs to provide a high efficiency mode of operation of the thermoelectric device.

7. The switch architecture of claim 6 wherein the controller is operable to provide the high efficiency mode of operation of the thermoelectric device when the temperature of the region being cooled by the thermoelectric device is within the steady state range including the set point temperature.

8. The switch architecture of claim 7 wherein the thermoelectric device comprises a plurality of thermoelectric coolers and the plurality of channels of the thermoelectric device are disposed on an interconnect board that enables selective control of multiple different subsets of the plurality of thermoelectric coolers.

9. The switch architecture of claim 8 wherein a cartridge comprises the switch architecture and the thermoelectric device.

10. The switch architecture of claim 9 wherein each of the plurality of solid-state switches is a transistor.

11. The switch architecture of claim 10 wherein each of the plurality of solid-state switches is a metal-oxide-semiconductor field-effect transistor.

12. A method of operating a switch architecture for multi-mode operation of a thermoelectric device comprising:

determining a first mode of operation of the thermoelectric device; and

toggling one or more of a plurality of solid-state switches to provide the first mode of operation of the thermoelectric device.

13. The method of claim 12 further comprising:

determining a second mode of operation of the thermoelectric device that is different than the first mode of operation; and

toggling one or more of the plurality of solid-state switches to provide the second mode of operation of the thermoelectric device.

14. The method of claim 13 wherein toggling the one or more of the plurality of solid-state switches comprises toggling the one or more of the plurality of solid-state switches to provide power to at least a subset of a plurality of outputs in series.

15. The method of claim 14 wherein toggling the one or more of the plurality of solid-state switches comprises toggling the one or more of the plurality of solid-state switches to provide power to at least a subset of a plurality of outputs in parallel.

16. The method of claim 15 wherein toggling the one or more of the plurality of solid-state switches comprises toggling the one or more of the plurality of solid-state switches to provide power to at least a subset of the plurality of outputs to provide a high capacity mode of operation of the thermoelectric device.

17. The method of claim 16 wherein determining the first mode of operation or the second mode of operation comprises determining the high capacity mode of operation of the thermoelectric device when a temperature of a region being cooled by the thermoelectric device exceeds a steady state range including a set point temperature.

18. The method of claim 17 wherein toggling the one or more of the plurality of solid-state switches comprises toggling the one or more of the plurality of solid-state switches to provide a high efficiency mode of operation of the thermoelectric device.

19. The method of claim 18 wherein determining the first mode of operation or the second mode of operation comprises determining when the temperature of the region being cooled by the thermoelectric device is within the steady state range including the set point temperature.

20. The method of claim 19 wherein each of the plurality of solid-state switches is a metal-oxide-semiconductor field-effect transistor.