Sputtering Target Material

Abstract

An object of the present invention is to improve the mechanical strength of a sputtering target, and in order to achieve such an object, there is provided a sputtering target material including: in at. %, 10 to 50% of B; 0 to 20% in total of one or more elements selected from Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag; and the balance of at least one of Co and Fe, and unavoidable impurities, in which a hydrogen content is 20 ppm or less.

Description

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to a sputtering target material useful for producing an alloy thin film in a magnetic tunneling junction (MTJ) element, an HDD, a medium for magnetic recording, or the like.

Background Art

A magnetic random-access memory (MRAM) includes a magnetic tunneling junction (MTJ) element. Such a magnetic tunneling junction (MTJ) element has a structure such as CoFeB/MgO/CoFeB and exhibits features such as a high tunnel magnetoresistance (TMR) signal and a low switching current density (Jc).

A CoFeB thin film of a magnetic tunneling junction (MTJ) element is formed by sputtering a CoFeB target. Examples of known CoFeB sputtering target materials include a sputtering target material produced by sintering an atomized powder as disclosed in Japanese Patent Laid-Open Publication No. 2004-346423 (Patent Literature 1).

CITATION LIST

Patent Literature

[PTL 1] Japanese Patent Laid-Open Publication No. 2004-346423

SUMMARY OF THE INVENTION

Technical Problem

A method in which an atomized powder is sintered to produce a sputtering target material in such a manner as in Patent Literature 1 is an effective technique. However, only the method described in Patent Literature 1 does not make it possible to produce a favorable target material. In other words, there is a problem in that only simple sintering of an atomized powder results in a decrease in the strength of a sputtering target material.

Solution to Problem

As a result of intensively advancing development in order to solve the problem described above, the present inventors found that the mechanical strength of a sputtering target can be improved by reducing the content of hydrogen in a sputtering target material. Thus, the present invention was accomplished.

The present invention encompasses the following inventions:

[1] A sputtering target material comprising in at. %: 10 to 50% of B; 0 to 20% in total of one or more elements selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag; and the balance of at least one of Co and Fe, and unavoidable impurities, wherein a hydrogen content is 20 ppm or less.
[2] The sputtering target material according to the above [1], wherein the sputtering target material comprises, in at. %, 5 to 20% in total of one or more elements selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag.
[3] The sputtering target material according to the above [1], wherein the sputtering target material has a bending strength of 200 MPa or more.

Advantageous Effects of Invention

According to the present invention, a sputtering target material having excellent mechanical strength is provided.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will be described in detail below. Unless otherwise specified, “%” in the present invention means at. %.

In a sputtering target material according to the present invention, the content of B is 10 to 50%. An alloy thin film formed in sputtering does not sufficiently become amorphous when the content of B is less than 10%, while the strength of a sputtering target material decreases even if the content of hydrogen is 20 ppm or less when the content of B is more than 50%. Therefore, the content of B is adjusted to 10 to 50%. The content of B is preferably 20 to 50%.

In the sputtering target material according to the present invention, the total content of one or more elements selected from the group (hereinafter may be referred to as “element group”) consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag is 0 to 20%. When only one kind of an element is selected from the above element group, “total content of one or more elements selected from the above element group” means the content of the one element. The strength of the sputtering target material decreases even if the content of hydrogen is 20 ppm or less when the total content of one or more elements selected from the above element group is more than 20%. Therefore, the content of one or more elements selected from the above element group is adjusted to 20% or less. The total content of one or more elements selected from the above element group is preferably 12% or less, and still more preferably 10% or less. When the sputtering target material according to the present invention does not contain one or more elements selected from the above element group, the total content thereof is 0%. When the sputtering target material according to the present invention contains one or more elements selected from the above element group, the total content thereof can be adjusted in a range of from more than 0 to 20% as appropriate, and is, for example, 5% or more.

The sputtering target material according to the present invention comprises the balance of at least one of Co and Fe, and unavoidable impurities.

Co and Fe are elements that impart magnetism. The total content of Co and Fe is 30% or more. When the sputtering target material according to the present invention contains only one of Co and Fe, “total content of Co and Fe” means the content of the one. The total content of Co and Fe is preferably 40% or more, and still more preferably 50% or more.

In the sputtering target material according to the present invention, the content of hydrogen is 20 ppm or less. Hydrogen is an element that is unavoidably present in a powder (for example, an atomized powder such as a gas-atomized powder) used as a raw material of the sputtering target material. However, the strength of the sputtering target material decreases when the content of hydrogen remaining in the sputtering target material is more than 20 ppm. Therefore, the content of hydrogen is adjusted to 20 ppm or less. The content of hydrogen is preferably 10 ppm or less. The sputtering target material according to the present invention may contain up to 1000 ppm of other unavoidable impurities.

The sputtering target material in which the content of hydrogen is 20 ppm or less can be produced by: removing coarse particles having a particle diameter of 500 μm or more from an atomized powder of an alloy comprising 10 to 50% of B, 0 to 20% in total of one or more elements selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag, and the balance of at least one of Co and Fe, and unavoidable impurities; then removing fine particles from the powder from which the coarse particles have been removed, to prepare a powder that satisfies any of particle size conditions A, B, and C; and then sintering the powder that satisfies any of the particle size conditions A, B, and C.

The particle size conditions A, B, and C are defined as follows.

The particle size condition A is defined as a condition that the cumulative volume of particles having a particle diameter of 5 μm or less is 10% or less, and the cumulative volume of particles having a particle diameter of 30 μm or less is 40% or less, in the particle size distribution of powder (particle assemblage).

The particle size condition B is defined as a condition that the cumulative volume of particles having a particle diameter of 5 μm or less is 8% or less, and the cumulative volume of particles having a particle diameter of 30 μm or less is 35% or less, in the particle size distribution of a powder (particle assemblage).

The particle size condition C is defined as a condition that the cumulative volume of particles having a particle diameter of 5 μm or less is 5% or less, and the cumulative volume of particles having a particle diameter of 30 μm or less is 30% or less, in the particle size distribution of a powder (particle assemblage).

A powder that satisfies all the particle size conditions A, B, and C is regarded as a powder that satisfies the particle size condition C, and a powder that satisfies the particle size conditions A and B is regarded as a powder that satisfies the particle size condition B. In addition, “particle diameter” and “particle size distribution” mean a particle diameter and a particle size distribution, measured by a laser diffraction/scattering-type particle size distribution measurement apparatus (MICROTRAC).

All of the particle size conditions A, B, and C are conditions for removing coarse particles having a particle diameter of 500 μm or more from a powder (for example, an atomized powder such as a gas-atomized powder) as a raw material of the sputtering target material and then removing fine particles from the powder from which the coarse particles have been removed. In each particle size condition, a particle size distribution is set under the two conditions, i.e., the first condition regarding the amount of particles having a particle diameter of 5 μm or less and the second condition regarding the amount of particles having a particle diameter of 30 μm or less. In the particle size condition A, the cumulative volume of particles having a particle diameter of 5 μm or less is regulated to 10% or less in the first condition, and the cumulative volume of particles having a larger particle size and having a particle diameter of 30 μm or less is regulated to 40% or less in the second condition. In the particle size condition B, the cumulative volume of particles having a particle diameter of 5 μm or less is regulated to 8% or less in the first condition, and the cumulative volume of particles having a particle diameter of 30 μm or less is regulated to 35% or less in the second condition. In the particle size condition C, the cumulative volume of particles having a particle diameter of 5 μm or less is regulated to 5% or less in the first condition, and the cumulative volume of particles having a particle diameter of 30 μm or less is regulated to 30% or less in the second condition. In other words, in the particle size conditions A, B, and C, the cumulative volume of particles having a particle diameter of 5 μm or less is regulated to be decreased to 10% or less, 8% or less, and 5% or less in a stepwise manner, and the cumulative volume of particles having a particle diameter of 30 μm or less is regulated to be decreased to 40% or less, 35% or less, and 30% or less in a stepwise manner. The hydrogen content and bending strength of a sputtering target material produced using a gas-atomized powder that satisfies any of the particle size conditions A, B, and C are shown in Examples.

A powder that satisfies any of the particle size conditions A, B, and C can be prepared by removing coarse particles having a particle diameter of 500 μm or more, which are not suitable for molding, from a powder (for example, an atomized powder such as a gas-atomized powder) as a raw material of the sputtering target material, and then removing fine particles from the powder from which the coarse particles have been removed. Examples of atomization methods for producing the atomized powder include a gas atomization method, a water atomization method, a disk atomization method, and a plasma atomization method. A gas atomization method is preferred. The removal of the coarse particles having a particle diameter of 500 μm or more can be performed by classification using a sieve having an opening of 500 μm or less, for example, an opening of 250 to 500 μm. The removal of the fine particles for preparing the powder that satisfies any of the particle size conditions A, B, and C can be performed by classification using sieves having an opening of 5 μm or less and/or an opening of 30 μm or less. The content of hydrogen can be set at 20 ppm or less by producing a solidified molded product by using the powder that satisfies any of the particle size conditions A, B, and C. A sputtering target material can be produced by processing the solidified molded product into a disk shape by wire cut, turning processing, and plane polishing. The sputtering target material produced in such a manner has improved strength.

The sputtering target material according to the present invention preferably has a bending strength of 200 MPa or more. The sputtering target material according to the present invention has a bending strength of, for example, 210 MPa or more, 220 MPa or more, 230 MPa or more, 240 MPa or more, 250 MPa or more, 260 MPa or more, 270 MPa or more, 280 MPa or more, 290 MPa or more, or 300 MPa or more.

The bending strength is measured as follows. A specimen having a longitudinal length of 4 mm, a width of 25 mm, and a thickness of 3 mm, obtained from a sintered alloy by division by a wire, is evaluated by a three-point bending test, to obtain three-point bending strength as the bending strength. In the three-point bending test conducted at a supporting-point distance of 20 mm, a three-point bending strength is calculated from a stress (N) measured when a pressure is applied downward in a thickness direction to a plane having a longitudinal length of 4 mm and a width of 25 mm, on the basis of the following equation:

three-point bending strength (MPa)=(3×stress (N)×supporting-point distance (mm)/(2×specimen width (mm)×(specimen thickness (mm)²).

Examples

The sputtering target material according to the present invention will be specifically described below with reference to Examples.

A molten raw material was weighed for each composition shown in Tables 1, 2, 5, and 6, induction-heating melted in a refractory crucible having an Ar gas atmosphere with a reduced pressure or a vacuum atmosphere, then tapped from a nozzle having a diameter of 8 mm in the lower portion of the crucible, and gas-atomized with an Ar gas. A solidification rate can be controlled by adjusting the injection pressure of the Ar gas. The solidification rate is increased with increasing the injection pressure. The particle size distribution of a gas-atomized powder can be adjusted by controlling the solidification rate. The width of the particle size distribution is decreased with increasing the solidification rate.

A powder that satisfied any of the particle size conditions A, B, and C was prepared by removing coarse particles having a particle diameter of 500 μm or more, which were not suitable for molding, from the obtained gas-atomized powder, and then removing fine particles from the powder from which the coarse particles had been removed. The removal of the coarse particles having a particle diameter of 500 μm or more, which were not suitable for molding, was performed by classification using a sieve having an opening of 500 μm. The removal of the fine particles for preparing the powder that satisfied the particle size condition A was performed by classification using a sieve having an opening of 35 μm. The removal of the fine particles for preparing the powder that satisfied the particle size condition B was performed by classification using a sieve having an opening of 30 μm. The removal of the fine particles for preparing the powder that satisfied the particle size condition C was performed by classification using a sieve having an opening 25 μm. The powder that satisfied any of the particle size conditions A, B, and C was put in a furnace at 110° C. and dried to remove water from the powder. The dried powder was used as a raw powder. The raw powder was degassing-charged into an SC can having an outer diameter of 220 mm, an inner diameter of 210 mm, and a length of 200 mm, and the powder-filled billet was sintered under each condition shown in Table 1 or Table 2 to produce a sintered body.

A molten raw material was weighed for each composition shown in the raw powder columns of Table 3 and Table 7. In a manner similar to the case of each composition shown in Tables 1, 2, 5, and 6, the molten raw material was induction-heating melted in a refractory crucible having an Ar gas atmosphere with a reduced pressure or a vacuum atmosphere, then tapped from a nozzle having a diameter of 8 mm in the lower portion of the crucible, and gas-atomized with an Ar gas. Commercially available powders having a powder size of 150 μm or less were used as pure Ti, pure B, pure V, and pure Cr among the raw powders shown in Table 7. A powder that satisfied any of the particle size conditions A, B, and C was prepared by removing coarse particles having a particle diameter of 500 μm or more, which were not suitable for molding, from the obtained gas-atomized powder, and then classifying the powder from which the coarse particles had been removed, to remove fine particles. The removal of the coarse particles and the fine particles was performed in manners similar to the manners described above. The powder that satisfied any of the particle size conditions A, B, and C was put in a furnace at 110° C. and dried to remove water from the powder. Such dried powders were used as raw powders. The raw powders were mixed at a mixture ratio shown in Table 3 in a V-type mixer for 30 minutes to thereby form a composition shown in Table 3, and the resultant mixture was degassing-charged into an SC can having an outer diameter of 220 mm, an inner diameter of 210 mm, and a length of 200 mm. The powder-filled billet described above was sintered under conditions shown in Table 3 to produce a sintered body. The solidified molded product produced by the method described above was processed into a disk shape having a diameter of 180 mm and a thickness of 7 mm by wire cut, turning processing, and plane polishing, to form a sputtering target material.

Then, a molten raw material was weighed for each composition shown in Table 4, induction-heating melted in a refractory crucible having an Ar gas atmosphere with a reduced pressure or a vacuum atmosphere, then tapped from a nozzle having a diameter of 8 mm in the lower portion of the crucible, and gas-atomized with an Ar gas. Coarse particles having a particle diameter of 500 μm or more, which were not suitable for molding, were removed from the obtained gas-atomized powder, and the powder from which the coarse particles had been removed and from which fine particles were not removed was used as a raw powder. The raw powder was degassing-charged into an SC can having an outer diameter of 220 mm, an inner diameter of 210 mm, and a length of 200 mm. The powder-filled billet described above was sintered under conditions shown in Table 4 to produce a sintered body. The solidified molded product produced by the method described above was processed into a disk shape having a diameter of 180 mm and a thickness of 7 mm by wire cut, turning processing, and plane polishing, to form a sputtering target material.

	TABLE 1
	Composition
	of sputtering
	target material	Particle		Molding	Molding	Molding	Hydrogen	Bending
	(at. %)	size	Particle	temperature	time	pressure	content	strength
No	Co	Fe	B	condition	size	(° C.)	(h)	(MPa)	(ppm)	(Mpa)	Remarks
1	31.5	58.5	10	A	≤5 μm: 9%	1000	2	100	18	820	Present
					≤30 μm: 38%						Invention
2	33.25	51.75	15	B	≤5 μm: 6%	1000	2	100	10	900	Examples
					≤30 μm: 33%
3	28	52	20	A	≤5 μm: 6%	1000	2	100	13	580
					≤30 μm: 33%
4	18	72	10	A	≤5 μm: 7%	1000	2	100	15	790
					≤30 μm: 37%
5	60	20	20	B	≤5 μm: 3%	1000	2	150	9	630
					≤30 μm: 32%
6	72	8	20	A	≤5 μm: 3%	1000	2	150	14	650
					≤30 μm: 36%
7	90	0	10	C	≤5 μm: 4%	700	3	150	8	880
					≤30 μm: 25%
8	80	0	20	C	≤5 μm: 2%	800	3	150	6	630
					≤30 μm: 21%
9	70	0	30	B	≤5 μm: 6%	1000	3	100	8	480
					≤30 μm: 32%
10	60	0	40	C	≤5 μm: 4%	1100	3	100	4	260
					≤30 μm: 18%
11	50	0	50	C	≤5 μm: 0%	1100	5	150	3	250
					≤30 μm: 25%
12	83	5	12	A	≤5 μm: 10%	800	5	150	15	670
					≤30 μm: 40%
13	5	70	25	B	≤5 μm: 8%	1100	5	150	9	690
					≤30 μm: 35%
14	62	10	28	A	≤5 μm: 8%	800	5	150	14	400
					≤30 μm: 39%
15	48	20	32	A	≤5 μm: 9%	800	5	150	17	300
					≤30 μm: 35%
16	22	40	38	C	≤5 μm: 5%	900	5	150	6	290
					≤30 μm: 30%
17	25	30	45	A	≤5 μm: 8%	1000	4	150	8	280
					≤30 μm: 38%
18	5	45	50	B	≤5 μm: 5%	1000	3	100	15	580
					≤30 μm: 35%
19	70	5	25	A	≤5 μm: 9%	800	5	150	12	660
					≤30 μm: 38%
20	40	40	20	B	≤5 μm: 5%	800	5	150	10	650
					≤30 μm: 31%

	TABLE 2
	Composition
	of sputtering
	target material	Particle		Molding	Molding	Molding	Hydrogen	Bending
	(at. %)	size	Particle	temperature	time	pressure	content	strength
No.	Co	Fe	B	condition	size	(° C.)	(h)	(MPa)	(ppm)	(Mpa)	Remarks
21	60	20	20	C	≤5 μm: 2%	800	5	150	5	630	Present
					≤30 μm: 27%						Invention
22	0	90	10	A	≤5 μm: 10%	800	4	130	12	820	Examples
					≤30 μm: 39%
23	0	80	20	A	≤5 μm: 8%	800	5	130	15	580
					≤30 μm: 39%
24	0	70	30	A	≤5 μm: 10%	700	3	130	15	380
					≤30 μm: 36%
25	0	60	40	A	≤5 μm: 10%	1000	5	130	12	230
					≤30 μm: 39%
26	0	50	50	B	≤5 μm: 7%	1100	5	130	7	250
					≤30 μm: 33%

TABLE 3
	Composition
	of sputtering	Mixed raw	Particle		Molding	Molding	Molding	Hydrogen	Bending
	target material	powder (at. %)	size	Particle	temperature	time	pressure	content	strength
No.	(at. %)	( ): mixture ratio	condition	size	(° C.)	(h)	(MPa)	(ppm)	(Mpa)	Remarks
27	20Co—60Fe—20B	Fe—1Co—20B(25)	A	≤5 μm: 8%	1000	5	150	14	610	Present
		Co—20B(75)		≤30 μm: 36%						Invention
28	40Co—40Fe—20B	Fe—1Co—20B(50)	B	≤5 μm: 7%	1000	5	100	8	640	Examples
		Co—20B(50)		≤30 μm: 34%
29	60Co—20Fe—20B	Fe—1Co—20B(75)	B	≤5 μm: 6%	900	4	130	12	600
		Co—20B(25)		≤30 μm: 32%
30	50Co—20Fe—30B	Fe—1Co—30B(28)	C	≤5 μm: 4%	1000	2	120	8	480
		Co—30B(72)		≤30 μm: 28%
31	15Co—45Fe—40B	Fe—1Co—40B(75)	B	≤5 μm: 6%	1100	3	150	7	230
		Co—40B(25)		≤30 μm: 33%
32	40Co—10Fe—50B	Fe—1Co—40B(20)	B	≤5 μm: 5%	1100	2	150	8	220
		Co—40B(80)		≤30 μm: 31%

	TABLE 4
	Composition
	of sputtering
	target material		Molding	Molding	Molding	Hydrogen	Bending
	(at. %)	Particle	temperature	time	pressure	content	strength
No.	Co	Fe	B	size	(° C.)	(h)	(MPa)	(ppm)	(Mpa)	Remarks
33	31.5	58.5	10	≤5 μm: 11%	1000	2	100	25	150	Comparative
				≤30 μm: 39%						Examples
34	33.25	61.75	5	≤5 μm: 9%	1000	2	100	30	180
				≤30 μm: 41%
35	28	52	20	≤5 μm: 12%	1000	2	100	25	130
				≤30 μm: 34%
36	18	72	10	≤5 μm: 7%	1000	2	100	22	160
				≤30 μm: 42%
37	60	20	20	≤5 μm: 13%	1000	2	100	23	150
				≤30 μm: 29%
38	72	8	20	≤5 μm: 4%	1000	2	100	25	140
				≤30 μm: 43%
39	70	0	30	≤5 μm: 14%	1000	5	150	26	100
				≤30 μm: 45%
NOTE:
The underlined figures fall outside the scope of the present invention.

	TABLE 5
	Composition of sputtering target material (at. %)
	Others
No.	Co	Fe	B	Ti	Zr	Hf	V	Nb	Ta	Cr	Mo	W	Mn	Ni	Cu	Others	Total of others
40	65	0	30	5	0	0	0	0	0	0	0	0	0	0	0	—	5
41	65	5	20	5	1	1	1	1	1	0	0	0	0	0	0	—	10
42	55	15	10	9	1	1	1	1	1	1	1	1	1	1	0	Pt: 1	20
43	45	30	15	0	10	0	0	0	0	0	0	0	0	0	0	—	10
44	10	45	30	0	15	0	0	0	0	0	0	0	0	0	0	—	15
45	10	50	20	0	10	1	1	1	1	1	1	1	1	1	1	—	20
46	25	60	10	0	0	4	0	0	0	0	0	0	0	0	0	Re: 1	5
47	5	70	10	0	0	15	0	0	0	0	0	0	0	0	0	—	15
48	0	70	10	0	0	10	0	2	2	2	2	2	0	0	0	—	20
49	10	35	50	0	0	0	5	0	0	0	0	0	0	0	0	—	5
50	0	45	40	0	0	0	10	0	0	0	0	0	0	0	0	Ru: 5	15
51	41	4	40	0	0	0	15	0	0	0	0	0	0	0	0	—	15
52	72	8	10	0	0	0	0	5	0	0	0	0	0	0	0	Rh: 5	15
53	61	9	15	0	0	0	0	15	0	0	0	0	0	0	0	—	15
54	47	13	20	0	0	0	0	10	0	0	10	0	0	0	0	—	20
55	42	28	20	0	0	0	0	0	10	0	0	0	0	0	0	—	10
56	29	34	17	10	0	0	0	0	10	0	0	0	0	0	0	—	20
57	16	46	18	10	0	1	0	0	0	1	1	7	0	0	0	—	20
58	13	45	22	5	0	0	0	0	0	5	0	0	0	0	0	Ir: 10	20
59	12	44	24	0	10	0	0	0	0	10	0	0	0	0	0	—	20
60	0	60	10	0	10	0	0	0	0	20	0	0	0	0	0	—	30
61	0	50	30	0	15	0	0	0	0	0	5	0	0	0	0	—	20
62	35	35	10	0	0	10	0	0	0	0	10	0	0	0	0	—	20
63	22	48	10	0	0	10	0	0	0	0	5	0	0	0	0	Pd: 5	20
64	19	41	20	0	0	15	0	0	0	0	0	5	0	0	0	—	20
65	41	19	20	0	0	0	10	0	0	0	0	2	3	3	2	—	20
66	37	23	20	0	0	0	10	0	10	0	0	0	0	0	0	—	20
67	40	20	20	0	0	0	15	0	0	0	0	0	5	0	0	—	20
68	55	15	10	0	0	0	0	20	0	0	0	0	0	0	0	—	20
69	56	14	10	0	0	0	0	10	0	0	0	0	10	0	0	—	20
70	5	65	10	0	0	0	0	15	0	0	0	0	0	5	0	—	20
		Particle	Particle	Molding		Molding
		size	size	temper-	Molding	pres-	Hydrogen	Bending
		condi-	≤5	≤30	ature	time	sure	content	strength
	No.	tion	μm	μm	(° C.)	(h)	(MPa)	(ppm)	(MPa)	Remarks
	40	A	10	36	1000	2	100	20	1500	Present
	41	B	6	33	980	2	100	8	800	Invention
	42	C	3	29	1000	2	100	3	700	Examples
	43	A	9	36	1050	2	100	15	1300
	44	B	8	33	1050	2	100	8	1000
	45	C	4	35	1050	3	100	7	800
	46	A	9	40	900	3	100	15	1200
	47	B	8	34	950	3	100	8	1000
	48	C	1	10	1000	3	100	8	900
	49	A	10	36	1100	4	100	15	1600
	50	B	6	33	1080	4	100	10	1500
	51	C	5	29	1050	4	100	3	1400
	52	C	5	15	1200	4	120	3	1000
	53	A	10	37	1230	4	120	7	1000
	54	B	7	31	1250	4	120	13	800
	55	A	9	38	1300	4	120	15	1000
	56	B	7	34	1280	4	120	8	900
	57	C	3	15	1150	4	120	4	900
	58	A	10	37	1120	5	120	14	1200
	59	B	6	31	1110	5	120	7	1500
	60	C	1	21	1100	5	120	8	1300
	61	A	10	39	1230	5	150	10	1500
	62	B	6	33	1240	5	150	6	1300
	63	C	0	5	1260	4	150	3	1300
	64	A	9	39	1200	10	150	3	1300
	65	B	8	35	1270	10	150	7	1000
	66	C	5	23	1190	10	120	5	1000
	67	A	10	39	1170	3	120	11	1100
	68	B	7	34	1160	4	120	9	1200
	69	C	1	18	1150	3	120	3	1100
	70	A	10	39	1200	10	150	15	1500

	TABLE 6
	Composition of sputtering target material (at. %)
	Others
No.	Co	Fe	B	Ti	Zr	Hf	V	Nb	Ta	Cr	Mo	W	Mn	Ni	Cu	Others	Total of others
71	25	35	20	0	0	0	0	0	20	0	0	0	0	0	0	—	20
72	20	20	40	0	0	0	0	0	10	0	0	0	0	10	0	—	20
73	40	10	30	0	0	0	0	0	10	0	0	0	0	0	0	Pt: 10	20
74	40	20	20	0	0	0	0	0	0	20	0	0	0	0	0	—	20
75	30	10	50	0	0	0	0	0	0	10	0	0	0	0	0	—	10
76	41	18	30	0	0	0	0	0	0	5	0	0	0	0	0	Re: 2,	11
																Ru: 1,
																Rh: 2,
																Ir: 1
77	40	30	10	0	0	0	0	0	0	0	20	0	0	0	0	—	20
78	15	40	20	0	0	0	0	0	0	0	5	0	0	0	0	Pd: 5,	20
																Pt: 5,
																Ag: 5
79	15	40	30	0	0	0	0	0	0	0	15	0	0	0	0	—	15
80	25	45	10	0	0	0	0	0	0	0	0	20	0	0	0	—	20
81	15	65	10	0	0	0	0	0	0	0	0	10	0	0	0	—	10
82	50	15	10	0	0	0	0	0	0	0	0	15	0	0	0	—	15
83	20	50	10	0	0	0	0	0	0	0	0	0	0	0	20	—	20
84	34	32	20	0	0	0	0	0	0	0	1	1	1	1	4	Re:1,	14
																Ru: 1,
																Ir: 1,
																Pd:1,
																Pt:1,
																Ag: 1
85	36	29	20	0	0	0	0	0	0	0	0	0	0	0	10	Ag: 5	15
86	30	40	10	0	0	0	0	0	0	0	0	0	0	0	0	Re: 20	0
87	40	40	10	0	0	0	0	0	0	0	0	0	0	0	0	Ru: 10	0
88	49	20	10	21	0	0	0	0	0	0	0	0	0	0	0	—	21
89	28	30	20	0	0	0	0	10	12	0	0	0	0	0	0	—	22
90	44	5	30	0	0	0	0	0	10	0	0	0	11	0	0	—	21
		Particle	Particle	Molding		Molding
		size	size	Temper-	Molding	pres-	Hydrogen	Bending
		condi-	≤5	≤30	ature	time	sure	content	strength
	No.	tion	μm	μm	(° C.)	(h)	(MPa)	(ppm)	(MPa)	Remarks
	71	B	8	31	1220	8	150	5	1400	Present
	72	C	4	30	1200	7	150	3	1400	Invention
	73	A	10	39	1250	7	150	14	1400	Examples
	74	C	3	25	1250	7	150	3	1300
	75	B	8	35	1270	7	100	10	1300
	76	C	0	6	1000	5	100	7	1500
	77	B	8	33	900	5	100	3	1300
	78	A	9	36	800	5	130	13	1200
	79	A	9	36	1150	7	130	13	1500
	80	A	10	39	1150	7	130	15	1500
	81	B	8	33	1150	7	130	7	1600
	82	B	7	32	1100	3	130	7	1300
	83	B	7	33	1000	3	130	7	1200
	84	C	3	28	1000	3	130	4	1300
	85	C	3	20	1000	3	130	3	1000
	86	C	2	18	900	2	130	3	1000
	87	A	10	35	900	2	130	13	900
	88	A	9	36	1000	2	130	20	100	Comparative
	89	B	6	33	1150	2	150	8	100	Examples
	90	C	4	28	1050	2	120	5	100
	NOTE:
	The underlined figures fall outside the scope of the present invention.

	TABLE 7
	Composition of sputtering target material (at. %)
	Others
No.	Co	Fe	B	Ti	Zr	Hf	V	Nb	Ta	Cr	Mo	W	Mn	Ni	Cu	Others	Total of others
91	50	0	30	10	0	0	0	0	0	0	0	0	0	0	0	—	10
92	55	5	20	0	0	0	0	0	10	0	0	0	0	0	0	—	10
93	55	15	10	0	0	0	0	0	0	0	10	0	0	0	0	—	10
94	45	30	15	0	0	0	0	0	0	0	0	0	0	10	0	—	10
95	15	45	30	0	5	0	0	5	0	0	0	0	0	0	0	—	10
96	20	50	20	0	0	0	10	0	0	0	0	0	0	0	0	—	10
97	20	50	10	0	0	5	5	0	0	0	5	0	0	5	0	—	20
98	10	70	10	0	0	0	0	0	0	0	0	0	0	0	0	Re: 10	10
99	20	50	10	0	0	0	0	0	0	0	0	20	0	0	0	—	20
100	15	15	50	0	0	0	0	0	0	0	0	0	10	5	5	—	20
101	0	45	40	0	5	0	0	5	0	0	0	0	0	0	0	Pd: 5	15
102	46	4	40	0	0	0	0	0	0	10	0	0	0	0	0	—	10
103	52	8	10	0	0	0	0	0	0	0	0	0	0	0	0	Ru: 20	20
104	71	9	15	0	0	0	0	0	0	0	0	0	0	0	0	Pt: 5	5
105	52	13	20	0	0	0	0	0	0	0	0	0	0	0	0	Ag: 5	5
106	32	28	20	1	1	1	1	1	1	1	1	1	1	1	1	Re: 1	20
																Ru: 1
																Ir: 1
																Pd: 1
																Pt: 1
																Ag: 1
	Mixed raw
	powders		Mold-		Mold-
	(at %)	Particle	Particle	ing	Mold-	ing
	( ):	size	size	temper-	ing	pres-	Hydrogen	Bending
	mixture	condi-	≤5	≤30	ature	time	sure	content	strength
No.	ratio	tion	μm	μm	(° C.)	(h)	(MPa)	(ppm)	(MPa)	Remarks
91	Co: 33,	A	10	38	950	2	150	15	1200	Present
	B: 1,									Invention
	Ti (90),									Examples
	pure
	Ti (10)
92	Co: 20,	B	8	32	1000	3	130	10	1200
	B: 10,
	Ta: (93)
	Fe: 20,
	B: 10,
	Ta: (7)
93	Co: 10,	B	6	31	900	5	150	9	1000
	B: 10,
	Mo: (82)
	Fe: 10,
	B: 10,
	Mo: (18)
94	Co: 15,	C	4	25	1000	5	130	3	1000
	B: 10,
	Ni: (83)
	Fe: 15,
	B: 10,
	Ni: (17)
95	Co: 30,	C	4	20	1050	3	120	3	1000
	B: 5,
	Zr: 5,
	Nb: (26)
	Fe: 30,
	B: 5,
	Zr: 5,
	Nb: (74)
96	Co: 22,	A	9	36	1050	2	120	14	1000
	B: 8,
	V: (29),
	Fe: 15,
	B: 5,
	V: (65),
	pure
	B: (1),
	pure
	V: (5)
97	Co: 10,	A	10	39	1200	7	150	14	1300
	B: 5
	Hf: 5,
	V: 5,
	Mo: 5,
	Ni: (29)
	Fe: 10,
	B: 5,
	Hf: 5,
	V: 5,
	Mo: 5,
	Ni (71)
98	Co: 10,	B	7	34	1200	7	150	10	1300
	B: 10,
	Re: (13)
	Fe: 10,
	B: 10,
	Re: (87)
99	Co: 10,	B	7	34	1200	7	120	10	1200
	B: 20,
	W: (29)
	Fe: 10,
	B: 20,
	W: (71)
100	Co: 31,	C	3	25	900	5	120	5	1000
	Fe: 38,
	B: (56),
	pure
	B: (10),
	Mn: (16),
	Ni: (9),
	Cu: (9)
101	Fe: 24.7,	A	9	30	1200	10	120	15	1300
	B: 6.3,
	Zr: 6.3,
	Nb: 6.3,
	Pd (95),
	B: (5)
102	Co: 5.7,	B	6	33	1200	10	130	13	1300
	Fe: 37.9,
	B: (61),
	pure
	Co: (20),
	pure
	Fe: (1),
	pure
	B: (1),
	pure
	Cr: (13)
103	Co: 10,	C	3	24	1050	3	130	5	1000
	B: 20,
	Ru: (80)
	Fe: 10,
	B: 20,
	Ru (20)
104	Co: 10,	A	9	39	1100	3	120	16	1200
	B: 5,
	Pt: (87)
	Fe: 40,
	B: 5,
	Pt: (13)
105	Co: 21,	B	7	35	1000	2	120	9	1100
	B: 4.4,
	Ag: (82)
	Co: 75,
	Fe: 15,
	B: 8,
	Ag: (18)
106	Co: 20,	C	5	19	800	2	120	3	900
	B: 1,
	Ti: 1,
	Zr: 1,
	Hf: 1,
	V: 1,
	Nb: 1,
	Ta: 1,
	Cr: 1,
	Mo: 1,
	W: 1,
	Mn: 1,
	Ni: 1,
	Cu: 1,
	Re: 1,
	Ru: 1,
	IR: 1,
	Pd: 1,
	Pt: 1,
	Ag (53)
	Fe: 20,
	B: 1,
	Ti: 1,
	Zr: 1,
	Hf: 1,
	V: 1,
	Nb: 1,
	Ta: 1,
	Cr: 1,
	Mo: 1,
	W: 1,
	Mn: 1,
	Ni: 1,
	Cu: 1,
	Re: 1,
	Ru: 1,
	IR: 1,
	Pd: 1,
	Pt: 1,
	Ag (47)

Nos. 1 to 32 shown in Tables 1 to 3 and Nos. 40 to 87 and Nos. 91 to 106 shown in Tables 5 to 7 are present invention examples, while Nos. 33 to 39 shown in Table 4 and Nos. 88 to 90 shown in Table 6 are Comparative Examples.

The particle size distribution of a powder was measured and confirmed by a laser diffraction/scattering-type particle size distribution measurement apparatus (MICROTRAC). Examples of the molding method include, but are not particularly limited to, HIP, hot press, SPS, and hot extrusion. The content of hydrogen was measured by an inert gas fusion-nondispersive infrared absorption method. The mechanical strength (bending strength) of a specimen having a longitudinal length of 4 mm, a width of 25 mm, and a thickness of 3 mm, obtained by division by a wire, was evaluated by a three-point bending test. In the three-point bending test conducted under the condition of a supporting-point distance of 20 mm, a three-point bending strength was calculated from a stress (N) measured when a pressure was applied downward in a thickness direction to a plane having a longitudinal length of 4 mm and a width of 25 mm, on the basis of the following equation. The calculated three-point bending strength was regarded as a bending strength (MPa).

Three-point bending strength (MPa)=(3×stress (N)×supporting-point distance (mm))/(2×specimen width (mm)×(specimen thickness (mm)²)

Nos. 1 to 26 and Nos. 40 to 87 which are present invention examples are sputtering target materials having compositions shown in Tables 1, 2, 5, and 6, while Nos. 27 to 32 and Nos. 91 to 106 which are present invention examples are sputtering target materials produced from plural raw powders shown in Tables 3 and 7. Each sputtering target material was able to achieve a bending strength of 200 MPa or more because of satisfying the condition of the present invention, in which sputtering target material comprises: 10 to 50% of B; 0 to 20% in total of one or more elements selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag; and the balance of at least one of Co and Fe, and unavoidable impurities, wherein a hydrogen content is 20 ppm or less.

In contrast, in Comparative Example No. 33 shown in Table 4, a hydrogen content increased to 25 ppm, and a bending strength decreased to 150 MPa because the cumulative volume of particles having a particle diameter of 5 μm or less in the particle size distribution of a gas-atomized powder used as a raw material of the sputtering target material was 11% and satisfied none of the particle size conditions A to C. In Comparative Example No. 34, a hydrogen content increased to 30 ppm, and a bending strength decreased to 180 MPa because the content of B was less than 10%, and the cumulative volume of particles having a particle diameter of 30 μm or less in the particle size distribution of a gas-atomized powder used as a raw material of the sputtering target material was 41%. In Comparative Example Nos. 35 and 37, hydrogen contents increased to 25 ppm and 23 ppm, and bending strengths decreased to 130 MPa and 150 MPa because the cumulative volumes of particles having a particle diameter of 5 μm or less in the particle size distributions of gas-atomized powders used as raw materials of the sputtering target materials were 12% and 13% and satisfied none of the particle size conditions A to C.

In Comparative Example Nos. 36 and 38, hydrogen contents increased to 22 ppm and 25 ppm, and bending strengths decreased to 160 MPa and 140 MPa because the cumulative volumes of particles having a particle diameter of 30 μm or less in the particle size distributions of gas-atomized powders used as raw materials of the sputtering target materials were 42% and 43% and satisfied none of the particle size conditions A to C. In Comparative Example No. 39, a hydrogen content increased to 26 ppm, and a bending strength decreased to 100 MPa because the cumulative volumes of particles having particle diameters of 5 μm or less and 30 μm or less in the particle size distribution of a gas-atomized powder used as a raw material of the sputtering target material were 14% and 45% and satisfied none of the particle size conditions A to C. The strengths in Comparative Examples are found to be very poor. Comparative Example Nos. 88 to 90 shown in Table 6 are found to result in low strength and brittleness because of comprising more than 20% in total of one or more elements selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag.

According to the present invention, a sputtering target material of which the mechanical strength is improved by decreasing the content of hydrogen in the sputtering target material to 20 ppm or less is provided as described above. The sputtering target material according to the present invention is a sputtering target material useful for producing an alloy thin film in an MTJ element, an HDD, a medium for magnetic recording, or the like and exhibits a very excellent effect.

Claims

1. A sputtering target material comprising in at. %: 10 to 50% of B; 0 to 20% in total of one or more elements selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag; and the balance of at least one of Co and Fe, and unavoidable impurities, wherein a hydrogen content is 20 ppm or less.

2. The sputtering target material according to claim 1, wherein the sputtering target material comprises, in at. %, 5 to 20% in total of one or more elements selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag.

3. The sputtering target material according to claim 1, wherein the sputtering target material has a bending strength of 200 MPa or more.