HEAT EXCHANGE STRUCTURE OF HEAT DISSIPATION DEVICE

A heat exchange structure of heat dissipation device includes a main body and a thermoelectric cooling chip. The main body has at least one first space in communication with at least one first opening and at least one second opening. The first space has an open side and a cooling fluid therein. The thermoelectric cooling chip has a cold face to contact with at least one heat source and a hot face to mate with the open side of the main body. In the present invention, the thermoelectric cooling chip is directly used instead of the metal-made heat conduction substrate of the conventional water-cooling heat dissipation device and serves to directly actively cool the heat source. The heat of the hot face of the thermoelectric cooling chip is absorbed by the cooling fluid inside the main body to dissipate. Accordingly, the heat dissipation performance is enhanced as a whole.

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Description
BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates generally to a heat exchange structure of heat dissipation device, and more particularly to a heat exchange structure of heat dissipation device, which employs a thermoelectric cooling chip as an active cooling interface for cooling a heat source.

2. Description of the Related Art

A conventional heat dissipation device or thermal module serves to dissipate the heat of a heat source. The conventional heat dissipation device is mainly composed of one single or multiple heat dissipation units assembled with each other. The heat dissipation units include heat sink, vapor chamber, heat pipe, etc. The copper-made or aluminum-made vapor chamber and heat pipe mainly serve to absorb and conduct the heat of the heat source.

Moreover, the conventional heat dissipation device can also employ a water-cooling structure to dissipate the heat of the heat source. The water-cooling structure has a copper-made or aluminum-made heat conduction substrate with better heat conductivity. The heat conduction substrate is disposed on the bottom of the water-cooling structure. One face of the heat conduction substrate is in direct contact with the heat source. Multiple radiating fins or radiating columns are disposed on the other face of the heat conduction substrate for increasing the heat dissipation area. The face with the radiating fins or radiating columns is correspondingly assembled with a main body having a cooling fluid chamber. The cooling fluid filled up in the chamber serves to absorb the heat of the radiating fins or radiating columns to dissipate the heat.

The water-cooling heat dissipation device serves to circulate the cooling fluid to carry away the heat absorbed by the heat conduction substrate and cool the heat conduction substrate so as to achieve heat dissipation effect. However, in the case that the heat source generates high heat and the water-cooling heat dissipation device fails to quickly carry away the heat absorbed by the heat conduction substrate, the heat will accumulate on the heat source. Especially, along with the development of the electronic apparatus with higher and higher performance, the heat generated by the internal electronic components of the electronic apparatus has become higher and higher. Accordingly, although the water-cooling heat dissipation device has a heat dissipation effect better than that of the air-cooling heat dissipation device, the water-cooling heat dissipation device is still hard to solve the heat dissipation problem of the electronic apparatus. Therefore, it has become a critical issue how to provide a water-cooling module with better heat dissipation performance.

SUMMARY OF THE INVENTION

It is therefore a primary object of the present invention to provide a heat exchange structure of heat dissipation device, which can greatly enhance the heat dissipation performance of the water-cooling heat dissipation device.

To achieve the above and other objects, the heat exchange structure of heat dissipation device of the present invention includes a main body and a thermoelectric cooling chip.

The main body has at least one first space in communication with at least one first opening and at least one second opening. The first space has an open side. The thermoelectric cooling chip has a cold face and a hot face. The hot face is mated with the open side of the main body. The cold face is in contact with at least one heat source.

In the heat exchange structure of the heat dissipation device, the thermoelectric cooling chip is directly used instead of the metal-made heat conduction substrate of the conventional water-cooling heat dissipation device. The cold face of the thermoelectric cooling chip serves to directly actively cool the heat source so that the cooling efficiency of the thermoelectric cooling chip is better. The heat of the hot face of the thermoelectric cooling chip is absorbed by the cooling fluid inside the first space of the main body to cool the hot face and dissipate the heat. Accordingly, better cooling performance is achieved.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:

FIG. 1 is a perspective exploded view of a first embodiment of the heat exchange structure of heat dissipation device of the present invention;

FIG. 2 is a sectional assembled view of the first embodiment of the heat exchange structure of heat dissipation device of the present invention;

FIG. 3 is a perspective view showing a state of the first embodiment of the heat exchange structure of heat dissipation device of the present invention;

FIG. 4 is a sectional assembled view of a second embodiment of the heat exchange structure of heat dissipation device of the present invention;

FIG. 5 is a perspective exploded view of a third embodiment of the heat exchange structure of heat dissipation device of the present invention;

FIG. 6 is a sectional assembled view of the third embodiment of the heat exchange structure of heat dissipation device of the present invention;

FIG. 7 is a perspective exploded view of a fourth embodiment of the heat exchange structure of heat dissipation device of the present invention;

FIG. 8 is a sectional assembled view of the fourth embodiment of the heat exchange structure of heat dissipation device of the present invention;

FIG. 9a is a perspective view of the thermoelectric cooling chip of the heat exchange structure of heat dissipation device of the present invention;

FIG. 9b is a perspective view of the thermoelectric cooling chip of the heat exchange structure of heat dissipation device of the present invention; and

FIG. 9c is a perspective view of the thermoelectric cooling chip of the heat exchange structure of heat dissipation device of the present invention.

 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 1, 2 and 3. FIG. 1 is a perspective exploded view of a first embodiment of the heat exchange structure of heat dissipation device of the present invention. FIG. 2 is a sectional assembled view of the first embodiment of the heat exchange structure of heat dissipation device of the present invention. FIG. 3 is a perspective view showing a state of the first embodiment of the heat exchange structure of heat dissipation device of the present invention. According to the first embodiment, the heat exchange structure 1 of heat dissipation device of the present invention includes a main body 11 and a thermoelectric cooling chip (thermoelectric module; Peltier cooler; Peltier cell; heat pump) 12.

The main body 11 has at least one first space 111 in communication with at least one first opening 112 and at least one second opening 113. The first space 111 has an open side 1111 and a cooling fluid 2.

The thermoelectric cooling chip 12 has a cold face 121 and a hot face 122. The hot face 122 is mated with the open side 1111 of the main body 1. The cold face 121 is in contact with at least one heat source 3. Multiple heat dissipation structures 1221 extend from the hot face 122. The heat dissipation structures 1221 are composed of multiple radiating fins.

In this embodiment, the main body 11 of the heat dissipation device is a water-cooling head structure. The main body 11 is the case of the water-cooling head structure. The thermoelectric cooling chip 12 is employed instead of the conventional heat conduction copper substrate. The thermoelectric cooling chip 12 blocks the open side 1111 of the main body 11 and the hot face 122 of the thermoelectric cooling chip 12 faces the first space 111. When dissipating the heat, the cooling fluid 2 flows through the first opening 112 into the first space 111. Then, the cooling fluid 2 flows through the second opening 113 out of the first space 111 to leave the main body 11. The cold face 121 of the thermoelectric cooling chip 12 is in direct contact with the heat source 3 to absorb the heat of the heat source 3 and cool the heat source 3. The heat of the hot face 122 of the cooing chip 12 is conducted to the heat dissipation structures 1221. Then, the cooling fluid 2 in the first space 111 of the main body 11 heat-exchanges with the heat dissipation structures 1221 to cool the heat dissipation structures 1221. The cooling efficiency provided by the cold face 121 of the thermoelectric cooling chip 12 is better than the cooling efficiency of an ordinary water-cooling heat dissipation device. Therefore, as a whole, the heat dissipation efficiency is greatly enhanced. In this embodiment, the main body 11 is externally connected to a pump 4 and at least one water tank unit 5. The pump 4 is connected to the main body 11 and the water tank unit 5 respectively via a first tube body 6 and a second tube body 7. The water tank unit 5 is connected to the main body 11 via a third tube body 8. The pump 4 serves to drive the cooling fluid 2 to flow into and out of the first space 111 of the main body 11. The water tank unit 5 serves to cool the cooling fluid 2.

Please now refer to FIG. 4, which is a sectional assembled view of a second embodiment of the heat exchange structure of heat dissipation device of the present invention. The second embodiment is partially identical to the first embodiment in structure and thus will not be redundantly described hereinafter. The second embodiment is different from the first embodiment in that the first space 111 has at least one first chamber 111a and a second chamber 111b. The first and second chambers 111a, 111b are up and down arranged corresponding to each other. The first and second chambers 111a, 111b respectively communicate with the first and second openings 112, 113. A pump 4 is disposed in the first chamber 111a. The second chamber 111a has the open side 1111. The thermoelectric cooling chip 12 blocks the open side 1111 and the hot face 122 of the thermoelectric cooling chip 12 faces the second chamber 111b.

In this embodiment, the main body 11 is a water-cooling heat dissipation device. The pump 4 is disposed in the first chamber 111a. The pump 4 serves to drive the cooling fluid 2 to flow into the first chamber 111a and out of the second chamber 111b of the main body 11 to heat-exchange with the hot face 122 of the thermoelectric cooling chip 12.

Please now refer to FIGS. 5 and 6. FIG. 5 is a perspective exploded view of a third embodiment of the heat exchange structure of heat dissipation device of the present invention. FIG. 6 is a sectional assembled view of the third embodiment of the heat exchange structure of heat dissipation device of the present invention. The third embodiment is partially identical to the first embodiment in structure and thus will not be redundantly described hereinafter. The third embodiment is different from the first embodiment in that the main body 11 has a first section 11a and a second section 11b. The first and second sections 11a, 11b are horizontally positioned and correspondingly connected with each other. The second section 11b has a second space 111c. A pump 4 is disposed in the first space 111 of the first section 111a. The thermoelectric cooling chip 12 is correspondingly mated with the second space 111c of the second section 11b to block the second space 111c. The first opening 112 is disposed on the first section 11a in communication with the first space 111. The second opening 113 is disposed on the second section 11b in communication with the second space 111c. The pump 4 disposed in the first space 111 mainly serves to guide the cooling fluid 2 in the first and second spaces 111, 111c to circulate and heat-exchange. The heat conducted to the hot face 122 of the thermoelectric cooling chip 12 mated with the second section 11b is absorbed by the cooling fluid 2. The cold face 121 of the thermoelectric cooling chip 12 provides a cooling temperature lower than that of the cooling fluid 2 to absorb the heat of the heat source 3 and cool the heat source 3. This can achieve better heat dissipation efficiency.

Please now refer to FIGS. 7 and 8. FIG. 7 is a perspective exploded view of a fourth embodiment of the heat exchange structure of heat dissipation device of the present invention. FIG. 8 is a sectional assembled view of the fourth embodiment of the heat exchange structure of heat dissipation device of the present invention. The fourth embodiment is partially identical to the first embodiment in structure and thus will not be redundantly described hereinafter. The fourth embodiment is different from the first embodiment in that multiple heat dissipation structures 1221 extend from the hot face 122. The heat dissipation structures 1221 are composed of multiple radiating fins. At least one flow way 1222 is defined between the radiating fins. A pump 4 is correspondingly disposed at one end of the radiating fins. The pump 4 serves to guide the cooling fluid 2 to flow toward the radiating fins to heat-exchange. The cooling fluid 2 will flow through the flow way 1222 toward the second opening 113 and flow out of the main body 11 to circulate and cool.

Please now refer to FIGS. 9a, 9b and 9c. FIG. 9a is a perspective view of the thermoelectric cooling chip of the heat exchange structure of heat dissipation device of the present invention. FIG. 9b is a perspective view of the thermoelectric cooling chip of the heat exchange structure of heat dissipation device of the present invention. FIG. 9c is a perspective view of the thermoelectric cooling chip of the heat exchange structure of heat dissipation device of the present invention. In this embodiment, multiple heat dissipation structures 1221 extend from the hot face 122 of the thermoelectric cooling chip 12 for enhancing the heat exchange efficiency. The heat dissipation structures 1221 can be multiple radiating columns as shown in FIG. 9a. Alternatively, the heat dissipation structures 1221 can be multiple radiating fins as shown in FIG. 9b. Still alternatively, the heat dissipation structures 1221 can be a combination of multiple radiating columns and multiple radiating fins as shown in FIG. 9c.

The present invention employs the thermoelectric cooling chip 12 with direct cooling effect instead of the copper-made substrate of the water-cooling heat dissipation device for conducting the heat. The thermoelectric cooling chip 12 serves to directly absorb the heat of the heat source 3 to cool the heat source 3. Therefore, the step of heat conduction is omitted and the heat source 3 is directly cooled. This can effectively enhance the heat dissipation performance of the water-cooling heat dissipation device as a whole and prevent the heat from accumulating on the heat source 3.

In this embodiment, the unit for guiding the cooling fluid of the water-cooling heat dissipation device is exemplified with a pump. However, the unit for guiding the cooling fluid is not limited to the pump. In practice, the unit for guiding the cooling fluid can be alternatively any other structure unit capable of driving the cooling fluid.

The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in such as the form or layout pattern or practicing step of the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims

1. A heat exchange structure of heat dissipation device comprising:

a main body having at least one first space in communication with at least one first opening and at least one second opening, the first space having an open side and a cooling fluid; and
a thermoelectric cooling chip having a cold face and a hot face, the hot face being mated with the open side of the main body, the cold face being in contact with at least one heat source.

2. The heat exchange structure of heat dissipation as claimed in claim 1, wherein the first space has at least one first chamber and a second chamber, the first and second chambers being up and down arranged corresponding to each other, the first and second chambers respectively communicating with the first and second openings, a pump being disposed in the first chamber.

3. The heat exchange structure of heat dissipation as claimed in claim 1, wherein multiple heat dissipation structures extend from the hot face, the heat dissipation structures being composed of multiple radiating columns.

4. The heat exchange structure of heat dissipation as claimed in claim 1, wherein the main body has a first section and a second section, the first and second sections being horizontally positioned and correspondingly connected with each other, the second section having a second space, a pump being disposed in the first space of the first section, the thermoelectric cooling chip being correspondingly mated with the second space of the second section.

5. The heat exchange structure of heat dissipation as claimed in claim 1, further comprising a pump and at least one water tank unit, the pump being connected to the main body and the water tank unit respectively via a first tube body and a second tube body, the water tank unit being connected to the main body via a third tube body, the pump serving to drive the cooling fluid to flow into and out of the first space of the main body, the water tank unit serving to cool the cooling fluid.

Patent History
Publication number: 20190041104
Type: Application
Filed: Aug 7, 2017
Publication Date: Feb 7, 2019
Inventor: Jian-Wu Yin (New Taipei City)
Application Number: 15/669,976
Classifications
International Classification: F25B 21/02 (20060101);