METHOD FOR MANUFACTURING LIGHT STRIP AND WINDING RACK FOR MANUFACTURING THE SAME
A method for manufacturing a light strip at least includes: winding a plurality of wires, removing an insulation layer, and attaching and fixing LED chips. The step of winding the wires includes providing a winding rack having a wire fixing portion at both ends of the winding rack, forming the winding rack with a hollow portion along a longitudinal direction, and winding the wires around the winding rack, wherein each of the wires has an insulation layer, and the wires are repeatedly wound across the hollow portion. The step of removing the insulation layer includes removing a part of the insulation layer from each of the wires to expose a core wire therein. The step of attaching and fixing the LED chips is attaching and fixing the LED chips on the core wires of the wires. Accordingly, the LED chips are firmly and electrically connected to the wires.
This Application claims priority to U.S. provisional application Ser. No. 62/565,327, filed Sep. 29, 2017 entitled LIGHT STRIP ASSEMBLY, and U.S. provisional application Ser. No. 62/584,619, filed Nov. 10, 2017, entitled LIGHT STRIP ASSEMBLY, now pending.
FIELD OF THE DISCLOSUREThe present disclosure relates to a method for manufacturing a light strip and a winding rack for manufacturing a light strip, and in particular, to a method for automatic production of an LED light strip and a winding rack for manufacturing a light strip.
BACKGROUND OF THE DISCLOSURELED light strips are often used in festive occasions or special occasions as decorations; however, conventional methods for manufacturing the LED light strips cannot achieve automatic production, leading to low productivity and high costs.
SUMMARY OF THE DISCLOSUREThe present disclosure is to provide a method for manufacturing a light strip that can automatically manufacture an LED light strip so as to lower the costs associated therewith.
In order to solve the technical issue mentioned above, according to one of the technical solutions of the present disclosure, a method for manufacturing a light strip is provided and includes at least the following steps:
winding a plurality of wires: providing a winding rack having a wire fixing portion at both ends of the winding rack, forming a hollow portion at the winding rack along a longitudinal direction, and winding the plurality of the wires around the winding rack. Each of the wires has an insulation layer, and the wires are repeatedly wound across the hollow portion;
removing the insulation layer: removing a part of the insulation layer from each of the wire along the hollow portion to expose a core wire therein; and
attaching and fixing a plurality of LED chips on the core wires of the wires so that the LED chips are firmly and electrically connected to the wires.
Another purpose of the present disclosure is to provide a winding rack for manufacturing a light strip that can participate in automatic production of the LED light strip to lower costs.
In order to solve the above technical issue, according to one of the technical solutions of the present disclosure, a winding rack for manufacturing a light strip is provided. The winding rack has cross sections that are substantially the same along a longitudinal direction, a top surface, at least one hollow portion along the longitudinal direction and a plurality of anti-slip strips configured around the winding rack and partially exposed to the top surface.
These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure.
The present disclosure will become more fully understood from the detailed description and the accompanying drawings, in which:
Referring to
As shown in
In
Referring to
Then, LED chips C are attached and fixed to the core wires C1 and C2 of the wires W1 and W2, so that the LED chips C are fixedly connected to the wires W1 and W2. Specifically, the process of attaching and fixing the LED chips C include the steps S30, S40 and S50.
Referring to
Referring to
Referring to
A purpose of the step of testing and maintaining S60 is to inspect whether the LED chips C are able to emit light by being electrically connected to the wires W1 and W2, before being fixedly welded. If the LED chips C fail to emit light, they should be checked and replaced.
In the step of dispensing glue S70, referring to
In the step of solidifying the glue S80, the glue g is usually solidified by baking with, for example, an oven.
In the step of extracting the light strip S90, the plurality of the wires W1 and W2 are unwound from the winding rack 10.
Referring to
As shown in
The feature of the present disclosure is that the LED light strip can be automatically manufactured to lower the costs associated therewith.
The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.
The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.
Claims
1. A method for manufacturing a light strip, comprising:
- winding a plurality of wires: providing a winding rack having a wire fixing portion at both ends of the winding rack, forming a hollow portion at the winding rack along a longitudinal direction, winding the plurality of the wires around the winding rack, wherein each of the wires has an insulation layer, and the wires are repeatedly wound across the hollow portion;
- removing the insulation layer: removing a part of the insulation layer from each of the wires along the hollow portion to expose a core wire therein; and
- attaching and fixing a plurality of LED chips on the core wires of the wires to have the LED chips firmly and electrically connected to the wires.
2. The method of claim 1, wherein the wire fixing portion includes a concave portion and a winding pin, the concave portion is formed at an end of the winding rack, and the winding pin is fixed in the concave portion, and wherein an end of the wires is fixedly wound to the winding pin.
3. The method of claim 1, wherein the winding rack further has a plurality of anti-slip strips configured around the winding rack to prevent the wires from slipping.
4. The method of claim 3, wherein two of the anti-slip strips are opposite to each other at two sides of the hollow portion of the winding rack and partially exposed on the top surface of the winding rack.
5. The method of claim 1, wherein the removal of the insulation layer is performed by radiating the plurality of the wires along the hollow portion with a laser ray.
6. The method of claim 1, wherein the hollow portion is a partially open groove.
7. The method of claim 1, wherein the attaching and fixing of the plurality of LED chips includes the steps of:
- spreading a conductive material: coating the conductive material on each of the core wires exposed from each of the wires;
- attaching the chips: placing the plurality of LED chips on the conductive material; and
- fixing the chips in position: fixedly connecting the LED chips on the wires; and
- wherein the method of claim 1 further includes: dispensing glue: covering the LED chips in the glue along the hollow portion; solidifying the glue: solidifying the glue; and extracting the light strip: unwinding the plurality of the wires from the winding rack.
8. The method of claim 7, wherein the conductive material is a solder paste and in the step of fixing the chips in position, the solder paste is baked along the hollow portion at a predetermined temperature to fixedly connect the LED chips to the wires.
9. The method of claim 7, wherein the conductive material is a solder paste, and the step of spreading the conductive material includes providing a carrier to fix the plurality of the winding racks wound with the wires to the carrier side by side, the carrier having a pair of positioning seats, each positioning seat forming a plurality of insertion concaves, and two ends of each of the winding racks being respectively placed in the insertion concaves to print the conductive material on the wires in a printing manner.
10. The method of claim 9, wherein the attachment of the chips includes obtaining chip placing positions where the insulated layers are removed from the wires by visual determination, and holding and moving the LED chips by a suction head to the chip placing positions.
11. The method of claim 1, wherein the fixing of the chips includes baking the positions where the LED chips are disposed by a hot air device along the hollow portion.
12. A winding rack for manufacturing a light strip, comprising cross sections that are substantially the same along a longitudinal direction, a top surface, at least one hollow portion along the longitudinal direction, and a plurality of anti-slip strips configured around the winding rack and partially exposed from the top surface.
13. The winding rack of claim 12, wherein the winding rack further comprises a top wire seat movably inserted in the winding rack.
Type: Application
Filed: Jul 6, 2018
Publication Date: Apr 4, 2019
Inventor: Nai-Chen Tsai (New Taipei City)
Application Number: 16/029,357