TOP MOUNT COOLING SYSTEM AND METHOD FOR USE THEREOF

Abstract

An embodiment provides a modular cooling device that is attachable to an enclosure such as a food or beverage cooler or refrigerator. In an embodiment, the modular cooling device includes various modules and is easy to assemble and disassemble. If one of the modules is damaged, it only requires the damaged module to be disassembled for repair or replacement, and the cooling function is restored, which solves inconvenient problems of conventional integrated refrigerators and like systems in terms of assembly, maintenance and repair. Other embodiments are described and claimed.

Description

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. provisional patent No. 62/622,250, filed on Jan. 26, 2018 and having the title TOP MOUNT COOLING SYSTEM AND METHOD FOR USE THEREOF, the entire contents of which are incorporated by reference herein.

FIELD

The subject matter disclosed herein relates to enclosure cooling systems and related techniques. Some of the subject matter disclosed herein relates to closed-loop cooling systems mounted to the top of an enclosure and used for cooling items within the enclosure.

BACKGROUND

With the continuous development of science and technology, refrigerators have become a common daily life electrical product. The application of modern refrigerators is everywhere, but there is a disadvantage in existing refrigerators, that is, whether household, commercial or for public facilities, in that the refrigerators are assembled such that, assembly, re-assembly, maintenance, repair and so on are very troublesome.

BRIEF SUMMARY

In summary, one embodiment provides a cooling device, comprising: a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of a top of an enclosure when mounted to the top of the enclosure by covering an opening defined within the top of the enclosure; the bottom surface including an enclosure air intake and an enclosure air return; an upper part including one or more ambient-side modules; and a shell that covers the lower part and separates the lower part from the upper part; the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure; and the cooling device comprising an interface configured to reversibly attach to the top of the enclosure.

Another embodiment provides a kit, comprising: an attachment mechanism for securing a cooling device to a top of an enclosure that defines an opening for mounting the cooling device thereon; and a cooling device, comprising: a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of the top of the enclosure when mounted to the top of the enclosure by covering the opening defined within the top of the enclosure; the bottom surface including an enclosure air intake and an enclosure air return; an upper part including one or more ambient-side modules; and a shell that covers the lower part and separates the lower part from the upper part; the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure.

A further embodiment provides a system, comprising: an enclosure; and a cooling device, comprising: a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of a top of the enclosure when mounted to the top of the enclosure by covering an opening defined within the top of the enclosure; the bottom surface including an enclosure air intake and an enclosure air return; an upper part including one or more ambient-side modules; and a shell that covers the lower part and separates the lower part from the upper part; the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure; and the cooling device comprising an interface configured to reversibly attach to the top of the enclosure.

The foregoing is a summary and thus may contain simplifications, generalizations, and omissions of detail; consequently, those skilled in the art will appreciate that the summary is illustrative only and is not intended to be in any way limiting.

For a better understanding of the embodiments, together with other and further features and advantages thereof, reference is made to the following description, taken in conjunction with the accompanying drawings. The scope of the invention will be pointed out in the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a side view of an example of a modular cooling system according to an embodiment.

FIG. 2 illustrates another side view of an example modular cooling device according to an embodiment.

FIG. 3 illustrates another side view of an example modular cooling device according to an embodiment.

FIG. 4 illustrates a top view of an example modular cooling device according to an embodiment.

FIG. 5 illustrates a bottom view of an example modular cooling device according to an embodiment.

FIG. 6 illustrates a bottom perspective view of an example modular cooling device according to an embodiment.

FIG. 7 illustrates a perspective view of an example of a modular cooling system according to an embodiment.

FIG. 8 illustrates a perspective view of an example modular cooling device according to an embodiment.

DETAILED DESCRIPTION

It will be readily understood that the components of the embodiments, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations in addition to the described example embodiments. Thus, the following more detailed description of the example embodiments, as represented in the figures, is not intended to limit the scope of the claims, but is merely representative of those embodiments.

Reference throughout this specification to “embodiment(s)” (or the like) means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases “according to embodiments” or “in an embodiment” (or the like) in various places throughout this specification are not necessarily all referring to the same embodiment.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of example embodiments. One skilled in the relevant art will recognize, however, that aspects can be practiced without one or more of the specific details, or with other methods, components, materials, etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obfuscation.

Refrigerators or coolers that have a cooling system, device or unit integrated therein are inconvenient and complex in terms of assembly, maintenance and repair. Moreover, inclusion of a cooling unit or device within an enclosure or shell that contains contents to be cooled is inefficient and ineffective. Further, inclusion of a cooling unit disposed near the bottom or lateral sides of a shell or enclosure, even if outside of the shell or enclosure, is less efficient because heated air rises around the enclosure or shell.

Accordingly, an embodiment provides a modular cooling device. An embodiment includes a cooling device and refrigerator shell or enclosure. The refrigerator shell and cooling device are detachably connected to one another. In an embodiment, the cooling device is formed as module or detachable component with respect to other components of the refrigerator, e.g., the refrigerator shell.

An embodiment includes a kit, where the kit includes a modular cooling device and an attachment mechanism for securing the cooling device to an enclosure such as a commercial refrigerator or vending machine.

An embodiment includes a cooling device, e.g., sold separately from an enclosure to which it will be mounted at the top.

The description now turns to the figures. The illustrated example embodiments will be best understood by reference to the figures. The following detailed description is intended only by way of example and simply illustrates certain, selected example embodiments that illustrate certain features that may or may not be claimed.

As shown in FIG. 1 an embodiment includes a cooling device 101, e.g., including various mechanical components associated with an air conditioner. The mechanical components for example include, but are not limited to, a condenser module in fluid communication with a compressor module (illustrated in FIG. 2 at 211) that operate in combination to exchange heat with ambient air as the ambient air passes through the ambient intake 103 and exits via the ambient exhaust 104 (example air flow is indicated by the dashed arrows in FIG. 1 and FIG. 7). Also illustrated in FIG. 1 is a drain overflow tube 105 that permits exit of accumulated condensation that may be produced via operation of the cooling device 101.

Illustrated in FIG. 1 is a shell 102, e.g., a refrigerator housing or insulated structure or enclosure in which items to be cooled are contained, for example food or beverage items such as found in a vending machine. In an embodiment, the cooling device 101 and the shell 102 are provided together as a system. In another embodiment, one or more components or parts may be provided separately, e.g., only the cooling device 101 may be provided (configured to be attached to a suitable refrigerator shell 102).

In an embodiment, the cooling device 101 is designed and constructed to interface with refrigerator shell 102 such that the cooling device is detachably connected to the shell 102 at the top thereof, as indicated by the double-headed arrow in FIG. 1. In an embodiment, the cooling device 101 is modular and provided in an arrangement that is particularly suited for top mounting on a shell 102, e.g., a top mounted air conditioner for a vending machine or like shell 102. This greatly improves conventional refrigerators and vending machines, which typically are integrated systems and have cooling components located elsewhere, i.e., are not top mounted but are rather installed near the bottom area of or enclosed within a refrigerator shell (inner or outer shell).

Illustrated in FIG. 2 is another side view of a cooling device 201 according to an embodiment. In this view it can be appreciated that the cooling device 201 includes a compressor module 211 that is in fluid communication with the coil system of condenser module 206. It can be appreciated that the compressor module 211 or pump is modular, and may be disconnected from the ambient side cooling coils (313 in FIG. 3) of the condenser module 206. In the example of FIG. 2, each of the compressor module 211 and the condenser module 206 sit atop a vaporization module 209 (including enclosure side cooling coils in fluid communication with the compressor and/or ambient side coils), which may be covered by an evaporator shell (illustrated in FIG. 8 at 810). The height dimension of the example cooling device 201 of FIG. 2 is about 14.4 inches (365.8 mm).

FIG. 3 provides an illustration of another side view of a cooling device 301. In this example, the compressor module 311 is visible in front of the condenser module 306, a coil of which is indicated at 313. A control module 312 is also visible in the view offered by FIG. 3. The control module 312 includes circuitry, for example programmed (or programmable) logic that acts to execute functionality such as temperature-based feedback and operation control. In the example illustrated in FIG. 3, the vaporization module 309 (including evaporator coils) acts as a support for the upper part of the cooling device 301, including components such as compressor module 311 and condenser module 306. In the example illustrated in FIG. 3, the width and length dimensions of the cooling device are each about 13.78 inches (350 mm).

A top view is shown for an example cooling device 401 in FIG. 4. In this view the ambient exhaust(s) 404 is/are visible, situated to face the top of the cooling device and positioned next to the compressor 411. The ambient exhaust 404 may include one or more exhaust apertures and fans, and may also include one or more fan guards.

In FIG. 5 a bottom view is shown for an example cooling device 501. The bottom surface of the lower part of the cooling device includes an enclosure air intake 514 and exhaust 515, illustrated in this view. The enclosure air intake 515 brings in air from the enclosure or shell and circulates it over cooling coils of the cooling device 501 to cool the enclosure air. This process is facilitated by one or more fans included in the lower part. The air is kept in a lower part or compartment separate from the ambient air of the ambient side or upper part. The air in the lower part, once cooled, is returned to the enclosure via the enclosure exhaust or return 515. Thus, this bottom surface of the cooling device 501 interfaces with a top side opening of the shell or enclosure (top mounted configuration). Here it can be appreciated that the evaporator shell 510 may include an interface to attach to a shell or enclosure (e.g., shell 102, not shown in FIG. 5). This permits the warm air of the enclosure to be taken in via an enclosure intake 514 and cooled by the cooling device 501 for return to the enclosure (shell) via enclosure air return 515.

A perspective view of the bottom of an example cooling device 601 is illustrated in FIG. 6. The condenser module 606 and compressor module 611 are illustrated and it can be appreciated that these sit atop the vaporization module 609. The intake 614 and return 615 for the air of the shell or enclosure are again visible. Example air flow is indicated by the dashed arrows in FIG. 6, although this could be reversed.

FIG. 7 provides a system view (partially exploded view) in which an example cooling device 701 is positioned above an opening 716 of a shell 702, e.g., a refrigerated vending machine. The modular cooling device 701, including condenser module 706, compressor module 711 and control module 712 are visible in this view, again positioned atop the vaporization module 709. As illustrated, the cooling device 701 may be attached to the shell 702 in a reversible manner, e.g., via one or more attachment mechanisms such as screws. This allows the entire cooling device 701 to be removed from shell 702 easily, e.g., for maintenance.

In an embodiment, a cooling device 801 includes but is not necessarily limited to a condenser module 806, a throttling device module 807, an evaporator shell cover 808, a vaporization module 809, an evaporator shell 810, a compressor 811, and a control unit 812. In the example shown in FIG. 8, the evaporator shell 810 includes an overhang or lip 816 that includes apertures for attachment mechanisms such as screws, which may be used to affix the cooling device to a shell (not illustrated in FIG. 8), e.g., via overhang or lip 816.

In an embodiment, the vaporization module 809 includes an evaporator and evaporator fan, installed in the evaporator shell 810. The evaporator shell cover 808 covers the evaporator and evaporator fan from the top, separating a lower part of the cooling device 801 from an upper part thereof that includes the condenser module 806, the compressor 811, control module 812 and the like, as illustrated. The evaporator shell 810 and the evaporator shell cover 808, which may be formed of one or more pieces of material, are affixed with or comprise a thermal insulation material, e.g., provided on both inside and outside surfaces thereof, for example to insulate and prevent water droplets from forming on the surfaces of the evaporator shell 810 and the evaporator shell cover 808. The evaporator has an enclosure or shell facing air inlet (e.g., 514) and air outlet or return (e.g., 515). The air inlet is for sucking the air from the shell or refrigerator into the evaporator; the air outlet is for returning air cooled by the cooling device 801 back to the shell or refrigerator. Evaporator fan(s) can use large air flow blowers to rapidly reduce temperature inside the shell. The vaporization module 809 is separated from the condenser module 806 but is in fluid communication therewith via evaporator coils that connect to the upper part, e.g., directly or indirectly to compressor 811.

Compared with conventional refrigerators and cooling systems, an embodiment provides a modular system that is easy to assemble and disassemble. If one of the modules of an embodiment is damaged, it only requires that the damaged module be removed from the other modules for repair or replacement in order to ensure that the refrigerator can function again. Additionally, the top mounted feature and air flow configuration offer maximum efficiency in terms of cooling.

It is worth noting that while specific elements are illustrated in the figures, and a particular ordering or organization of elements or steps has been illustrated, these are non-limiting examples. In certain contexts, two or more elements may be combined into an equivalent element, an element may be split into two or more equivalent elements, or certain elements may be re-ordered or re-organized or omitted as appropriate, as the explicit illustrated examples are used only for descriptive purposes and are not to be construed as limiting.

As used herein, the singular “a” and “an” may be construed as including the plural “one or more” unless clearly indicated otherwise.

This disclosure has been presented for purposes of illustration and description but is not intended to be exhaustive or limiting. Many modifications and variations will be apparent to those of ordinary skill in the art. The example embodiments were chosen and described in order to explain principles and practical application, and to enable others of ordinary skill in the art to understand the disclosure for various embodiments with various modifications as are suited to the particular use contemplated.

Thus, although illustrative example embodiments have been described herein with reference to the accompanying figures, it is to be understood that this description is not limiting and that various other changes and modifications may be affected therein by one skilled in the art without departing from the scope or spirit of the disclosure.

Claims

1. A cooling device, comprising:

a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of a top of an enclosure when mounted to the top of the enclosure by covering an opening defined within the top of the enclosure;

the bottom surface including an enclosure air intake and an enclosure air return;

an upper part including one or more ambient-side modules; and

a shell that covers the lower part and separates the lower part from the upper part;

the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure; and

the cooling device comprising an interface configured to reversibly attach to the top of the enclosure.

2. The cooling device of claim 1, wherein:

the one or more ambient-side modules include a compressor module in fluid communication with the condenser module; and

the one or more enclosure side modules include: coils in fluid communication with the compressor module; and one or more fans that promote air intake from the enclosure into the lower part and return of cooled air to the enclosure from the lower part.

3. The cooling device of claim 2, wherein the compressor module is disposed at a first lateral side of the cooling device and the condenser module is disposed at a second lateral side of the cooling device.

4. The cooling device of claim 1, wherein the one or more ambient-side modules include a control module comprising instructions that control the operation of the cooling device based on temperature within the enclosure.

5. The cooling device of claim 4, wherein the control module is disposed proximate to the condenser module.

6. The cooling device of claim 1, wherein the shell comprises an evaporator shell cover including insulating material.

7. The cooling device of claim 1, wherein the shell comprises an evaporator shell side part that extends around the side surfaces of the lower part of the cooling device.

8. The cooling device of claim 1, wherein the one or more ambient-side modules of the upper part are reversibly connected to the lower part.

9. The cooling device of claim 1, wherein the upper part is reversibly connected to the lower part.

10. The cooling device of claim 1, wherein the lower part is about 13 inches in length and width.

11. The cooling device of claim 1, wherein the cooling device is about 14.5 inches in height.

12. A kit, comprising:

an attachment mechanism for securing a cooling device to a top of an enclosure that defines an opening for mounting the cooling device thereon; and

a cooling device, comprising: a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of the top of the enclosure when mounted to the top of the enclosure by covering the opening defined within the top of the enclosure; the bottom surface including an enclosure air intake and an enclosure air return; an upper part including one or more ambient-side modules; and a shell that covers the lower part and separates the lower part from the upper part;

the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure.

13. The kit of claim 12, wherein:

the one or more ambient-side modules include a compressor module in fluid communication with the condenser module; and

the one or more enclosure side modules include: coils in fluid communication with the compressor module; and one or more fans that promote air intake from the enclosure into the lower part and return of cooled air to the enclosure from the lower part.

14. A system, comprising:

an enclosure; and

a cooling device, comprising: a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of a top of the enclosure when mounted to the top of the enclosure by covering an opening defined within the top of the enclosure; the bottom surface including an enclosure air intake and an enclosure air return; an upper part including one or more ambient-side modules; and a shell that covers the lower part and separates the lower part from the upper part;

the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure; and

the cooling device comprising an interface configured to reversibly attach to the top of the enclosure.

15. The system of claim 14, wherein:

the one or more ambient-side modules include a compressor module in fluid communication with the condenser module; and

the one or more enclosure side modules include: coils in fluid communication with the compressor module; and one or more fans that promote air intake from the enclosure into the lower part and return of cooled air to the enclosure from the lower part.

16. The system of claim 14, wherein the enclosure is a vending machine.

17. The system of claim 14, wherein the lower part is about 13 inches in length and width.

18. The system of claim 14, wherein the cooling device is about 14.5 inches in height.

19. The system of claim 14, wherein the enclosure and the interface of the cooling device include fixing holes corresponding to each other.

20. The system of claim 19, wherein the enclosure and the cooling device are connected to each other by a fastener and the fixing holes to achieve a detachable connection.