BLISTER-PREVENTING NONSLIP SMART SOCK
The present invention relates to a blister-preventing nonslip smart sock. The blister-preventing nonslip smart sock includes: a sock body in which a foot accommodation portion is formed; a plurality of first nonslip points which are provided on the inner surface of the foot accommodation portion; and a plurality of second nonslip points which are provided on the outer surface of the foot accommodation portion. The blister-preventing nonslip smart sock has the advantage of enabling mass production because it has a simple configuration. Furthermore, the blister-preventing nonslip smart sock has the advantage of preventing the sock from being taken off undesirably or preventing a blister from being caused because pluralities of nonslip points are provided on the inner and outer surfaces of the foot accommodation portion of the sock body, thereby preventing a slip from occurring when a user
This application claims the benefit of Korean Patent Application No. 10-2018-0057512 filed on May 19, 2018, which is hereby incorporated by reference herein in its entirety.
BACKGROUND 1. Technical FieldThe present invention relates to a blister-preventing nonslip smart sock.
2. Description of the Related ArtKorean Patent No. 1686547 (issued on Dec. 8, 2016 and entitled “Nonslip Sports Sock”) discloses a nonslip sports sock. As shown in
The conventional technology is configured such that the wet urethane sheet is turned upside down so that the cells are inverted such that the cells have an inverted roly-poly shape with a wide upper portion and a narrow lower portion, in which the diameter of the portions that come into contact with a foot is larger, based on the fact that the cells having a roly-poly shape with a wide lower portion and a narrow upper portion are formed on the wet urethane sheet, and the upper portions of the cells are formed to communicate with the outside. It is asserted that the conventional technology has an excellent effect even in an environment including sweat and water by preventing a water film phenomenon in such a manner as to act as a reservoir for temporary storing sweat generated from a user's foot. However, the conventional technology has a fundamental defect in that a fabrication process is complex because the configuration of the conventional technology is complex.
SUMMARYThe present invention has been conceived to overcome the above-described problems, and an object of the present invention is to provide a blister-preventing nonslip smart sock that has a simple configuration and is fabricated by a simple fabrication process, thereby enabling the mass production thereof.
In order to accomplish the above object, the present invention provides a blister-preventing nonslip smart sock including: a sock body in which a foot accommodation portion is formed; a plurality of first nonslip points which are provided on the inner surface of the foot accommodation portion; and a plurality of second nonslip points which are provided on the outer surface of the foot accommodation portion.
The blister-preventing nonslip smart sock may further include: conductive ring members each of which includes a ring member body configured to accommodate the outer circumference of a corresponding one of the first nonslip points so that the top surface of the first nonslip point is open and configured such that the bottom surface thereof is attached to the inner surface of the sock body, and a conductive terminal integrated with the bottom surface of the ring member body and configured to be exposed through the sock body; and nonslip conductive members each of which includes a conductive member body configured to be provided on the outer surface of the sock body, and a conductive member configured to be inserted under the top surface of the conductive member body to be electrically connected to the conductive terminal.
A plurality of dimples may be formed on the edge portion of the bottom surface of the conductive member body; and the nonslip conductive members may be formed by blending 5 to 35 parts by weight of a conductive filler with respect to 100 parts by weight of any one selected from among a polyethylene resin, a polyimide resin, a polyurethane resin, and a silicone resin, and the conductive filler may include at least one of conductive carbon, carbon fiber, carbon nanofiber, silver powder, nickel powder, and copper powder.
Each of the first nonslip points may include extension tabs formed on the outer circumference thereof; and the blister-preventing nonslip smart sock may further include micro-thumbtacks each of which includes a thumbtack body configured to be inserted under the top surface of a corresponding one of the extension tabs and a support portion provided on the top surface of the thumbtack body and configured to be thermally compressed onto the top surface of the extension tab.
The blister-preventing nonslip smart sock may further include removal-preventing connection members which are provided on the outer surface of the sock body in order to connect the second nonslip points.
The above and other objects, features, and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
Embodiments of the present invention will be described below with reference to the accompanying drawings.
Referring to
The sock body 10 includes a foot accommodation portion A configured to have a hollow structure, an ankle accommodation portion B configured to be formed in an integrated manner to communicate with the top end of the foot accommodation portion A and to have a hollow structure, and a band opening portion C configured to be provided within the circumference of the top end of the ankle accommodation portion B. In this case, the band opening portion C is provided to prevent the sock 100 from sliding down by pressing an ankle or calf when a user wears the sock 100.
Although the sock body 10 in which the ankle accommodation portion B is long is disclosed in the present embodiment, the present invention may be applied to a case where the ankle accommodation portion B is short or a case where there is no band opening portion C. Furthermore, the ankle accommodation portion B and the band opening portion C are not important components of the present invention, and thus detailed descriptions thereof will be omitted.
The foot accommodation portion A may be divided into a front foot portion A1 including toes and a front sole part, a sole concave portion A2 forming the central portion of a sole, and a back foot portion A3 including a heel part.
The first nonslip points 20 includes a plurality of first nonslip points 20 that are provided on the inner surface of the sock body 10, more specifically the inner surface of the foot accommodation portion A. In this case, the first nonslip points 20 are made of polyethylene, polyimide, polyurethane, or silicone. The first nonslip points 20 are provided throughout all the front foot portion A1, sole concave portion A2, and back foot portion A3 of the foot accommodation portion A.
Furthermore, each of the first nonslip points 20 includes extension tabs WS formed on the outer circumference thereof. In this case, the extension tabs WS are formed by compressing parts of the outer circumference of the first nonslip point 20, and are provided to prevent the first nonslip point 20 from being removed from the inner surface of the sock body 10 due to friction. This has a remarkable effect of reducing the removal rate of conventional nonslip points by 85% or more.
In this case, the first nonslip points 20 and the extension tabs WS are attached to the inner surface of the sock body 10, more specifically the inner surface of the foot accommodation portion A, through thermal compression without an adhesive.
Each of the micro-thumbtacks 80 includes a thumbtack body configured to be inserted under the top surface of the extension tab WS, and a support portion 83 provided on the top surface of the thumbtack body 81 and configured to be thermally compressed onto the top surface of the extension tab WS.
In this case, the thumbtack body 81 is preferably made of a metal material, and the support portion 83 is preferably made of the same material as the first nonslip point 20 and the extension tab WS. It is characterized in that the removal rate of conventional points is reduced by 90% or more by the micro-thumbtacks 80.
Each of the conductive ring members 30 includes a ring member body 31 configured to accommodate the outer circumference of the first nonslip point 20 so that the top surface of the first nonslip point 20 is open and configured such that the bottom surface thereof is attached to the inner surface of the sock body 10, and a conductive terminal 33 integrated with the bottom surface of the ring member body 31 and configured to be exposed through the sock body 10.
In this case, the conductive ring member 30 is preferably made of a copper material.
The second nonslip points 50 includes a plurality of nonslip points 50 that are provided on the outer surface of the sock body 10, more specifically the outer surface of the foot accommodation portion A. In this case, the second nonslip points 50 are made of polyethylene, polyimide, polyurethane, or silicone, and are provided throughout all the front foot portion A1, sole concave portion A2 and back foot portion A3 of the foot accommodation portion A.
Furthermore, the second nonslip points 50 are attached to the outer surface of the sock body 10, more specifically the outer surface of the foot accommodation portion A, through thermal compression without an adhesive.
The nonslip conductive members 60 include a plurality of nonslip conductive members 60 that are provided on the outer surface of the sock body 10, more specifically the outer surfaces of the front foot portion A1 and back foot portion A3 of the foot accommodation portion A. In this case, each of the nonslip conductive members 60 includes a conductive member body 61 configured to be provided on the outer surface of the sock body 10, and a conductive member 63 configured to be inserted under the top surface of the conductive member body 61 to be electrically connected to the conductive terminal 33. The nonslip conductive members 60 according to the present embodiment are preferably provided at locations corresponding to toes, a front sole part, and a heel in order to prevent slippage and to measure a user's body weight, bone density, body water content, and BMI by means of a BMI scale.
Furthermore, a plurality of dimples 61a is formed on the edge portion of the bottom surface of the conductive member body 61 in order to prevent the nonslip conductive member 60 from being removed due to friction. In this case, the dimples 61a are formed by performing compression by using a mold heated to a temperature in the range of 80 to 95° C.
Furthermore, the nonslip conductive members 60 are formed by blending 5 to 35 parts by weight of a conductive filler with respect to 100 parts by weight of a polyethylene resin, a polyimide resin, a polyurethane resin, or a silicone resin. The electric conductivity of the nonslip conductive members 60 ranges from 0.05 to 0.15 MS/s. Furthermore, the conductive filler includes at least one of conductive carbon (graphite), carbon fiber, carbon nanofiber (CNF), silver powder, nickel powder, and copper powder.
The removal-preventing connection members 90 are provided on the outer surface of the sock body 10 in order to connect the second nonslip points 50. In this case, the removal-preventing connection members 90 are provided to prevent the second nonslip points 50 from being removed due to friction, and are preferably made of the same material as the second nonslip points 50.
The blister-preventing nonslip smart sock according to the present invention has the advantage of enabling mass production because it has a simple configuration. Furthermore, the blister-preventing nonslip smart sock according to the present invention has the advantage of preventing the sock from being taken off undesirably or preventing a blister from being caused because pluralities of nonslip points are provided on the inner and outer surfaces of the foot accommodation portion of the sock body, thereby preventing a slip from occurring between the inner surface of the foot accommodation portion of the sock body and the sole of a foot and between the outer surface of the sock body and the insole of a shoe when a user walks or runs. Moreover, the blister-preventing nonslip smart sock according to the present invention has the advantages of discharging the static electricity of a human body to the outside and providing the convenience of use to enable weight, bone density, body water amount, Body Mass Index (BMI), etc. to be measured without the removal of the sock when weight is measured using a BMI scale because the nonslip conductive members are provided on the outer surface of the foot accommodation portion of the sock body so that the nonslip conductive members are electrically connected to the conductive ring members that are provided on the inner surface of the foot accommodation portion of the sock body.
Although the present invention has been described in conjunction with one embodiment above, it will apparent that the present invention is not limited to the embodiment, but all embodiments obtained through modification based on the technical spirit of the present invention fall within the scope of the present invention.
Claims
1. A blister-preventing nonslip smart sock comprising:
- a sock body in which a foot accommodation portion is formed;
- a plurality of first nonslip points which are provided on an inner surface of the foot accommodation portion;
- a plurality of second nonslip points which are provided on an outer surface of the foot accommodation portion;
- conductive ring members each of which includes a ring member body configured to accommodate an outer circumference of a corresponding one of the first nonslip points so that a top surface of the first nonslip point is open and configured such that a bottom surface thereof is attached to an inner surface of the sock body, and a conductive terminal integrated with a bottom surface of the ring member body and configured to be exposed through the sock body; and
- nonslip conductive members each of which includes a conductive member body configured to be provided on an outer surface of the sock body, and a conductive member configured to be inserted under a top surface of the conductive member body to be electrically connected to the conductive terminal.
2. The blister-preventing nonslip smart sock of claim 1, wherein:
- a plurality of dimples is formed on an edge portion of a bottom surface of the conductive member body; and
- the nonslip conductive members are formed by blending 5 to 35 parts by weight of a conductive filler with respect to 100 parts by weight of any one selected from among a polyethylene resin, a polyimide resin, a polyurethane resin, and a silicone resin, and the conductive filler includes at least one of conductive carbon, carbon fiber, carbon nanofiber, silver powder, nickel powder, and copper powder.
3. The blister-preventing nonslip smart sock of claim 1, wherein:
- each of the first nonslip points includes extension tabs formed on an outer circumference thereof; and
- the blister-preventing nonslip smart sock further comprises micro-thumbtacks each of which includes a thumbtack body configured to be inserted under a top surface of a corresponding one of the extension tabs and a support portion provided on a top surface of the thumbtack body and configured to be thermally compressed onto the top surface of the extension tab.
4. The blister-preventing nonslip smart sock of claim 1, further comprising removal-preventing connection members which are provided on the outer surface of the sock body in order to connect the second nonslip points.
Type: Application
Filed: May 14, 2019
Publication Date: Nov 21, 2019
Inventor: Hyunwoo KO (Anyang-si)
Application Number: 16/411,227