MEMS-BASED LEVERS AND THEIR USE FOR ALIGNMENT OF OPTICAL ELEMENTS
A MEMS based alignment technology based on mounting an optical component on a released micromechanical lever configuration that uses multiple flexures rather than a single spring. The optical component may be a lens. The use of multiple flexures may reduce coupling between lens rotation and lens translation, and reduce effects of lever handle warping on lens position. The device can be optimized for various geometries.
This application claims the benefit of the filing date of U.S. Provisional Application No. 61/347,247, filed May 21, 2010, entitled “MEMS-Based Levers and Their Use for Alignment of Optical Elements,” the disclosure of which is incorporated by reference.
BACKGROUND OF THE INVENTIONThe present application relates to the field of fiber optic communication and, more particularly, to optical packaging techniques used to optically couple laser sources to optical fibers or other waveguides.
Optical modules that are used for long haul and metropolitan fiber optic telecommunication links, such as lasers, modulators, splitters, add/drop multiplexers and receivers generally contain many small components such as mirrors, beamsplitters, detectors, and other precision components that have to be carefully aligned and attached in place to achieve optical coupling. Such fiber optic links use single mode fiber that has a mode size of a few microns. Thus precision alignment is required for all these components, adding greatly to the cost of such modules and lowering the manufacturing yield.
U.S. patent application Ser. No. 12/698,086, filed Feb. 1, 2010, the disclosure of which is incorporated by reference herein, discusses a packaging technology that allows precise positioning of optical components using a MEMS-based platform. The optical coupling between the active element such as a laser and the PLC waveguide was done by precise alignment of a microlens that is mounted on an adjustable holder that forms a lever with an anchor point and a handle. Moving the handle causes the microlens to move some small fraction of the distance traveled by the handle. Thus alignment is considerably eased.
BRIEF SUMMARY OF THE INVENTIONIn one aspect the invention provides a mechanism for positioning an optical component, comprising: a first flexure coupled to a base; a structure coupled to the first flexure, the structure generally in the form of a quadrilateral, the structure including a first pair of the pairs of flexures having a first direction of orientation and a second pair of the pairs of flexures having a second direction of orientation, the structure including a mount for an optical component; and an elongate arm extending generally from the structure.
In another aspect the invention provides a device for use in an optical assembly, comprising: a multi-part lever structure coupled to a substrate by a base, the multi-part lever structure including a first flexure coupled to the base, an elongate arm, and at least a second flexure and a first member coupling the elongate arm to the first flexure; and a lens coupled to the multi-part lever structure.
In another aspect the invention provides a structure for use in optically aligning two optical components, comprising: an elongate arm; a first flexure extending from the elongate arm in a first direction; a second flexure extending from the elongate arm in a second direction, the second direction being different than the first direction; a first member extending from the first flexure, with a mount for an optical component coupled to the first member; a second member extending from the second flexure; a third flexure, a third member, and a fourth flexure coupling the second member and the first member; and a fifth flexure coupling the second member to a base.
In another aspect the invention provides a device for use in aligning optical components, comprising: a platform for receiving an optical component; a first flexure element coupling the platform to a base; an arm coupled to the platform, the arm including a second flexure element, the arm including a free end.
In another aspect the invention provides a device for use in aligning optical components, comprising: a platform for receiving an optical component; means for flexibly coupling the platform to a base; and an elongate arm coupled to the platform.
These and other aspects of the invention are more fully comprehended considering the discussion herein.
The present patent is illustrated by way of examples.
Aspects of the invention provide an arrangement for actuating the position of an optical component using MEMS-based levers and handles in such as way as not to interfere with the placement of other optical or electrical elements close to the adjustable component. In some aspects the position of the component can be adjusted precisely in all three axes, and with significant leverage (or reduction in movement) in the axes perpendicular to the optical axis. This allows coarse motions at the handle to be mechanically demagnified at the position of the lens or other optical component.
As described in U.S. patent application Ser. No. 12/698,086, to fabricate such a MEMS based lever, fairly standard processes can be used. An SOI silicon wafer is patterned from the top to define the lever and the lens holder. The oxide underneath is etched away to suspend the lever. The lens is mounted on the lever using solder or epoxy. Once the part has been aligned, the lever is locked down close to the position of the handle.
When the lever is moved in the X direction, as shown in
When the lever is moved in Z, as shown in
Finally, when the handle is moved in Y, or out of the plane in
Compared to the simple case of
The multi-part lever structure is coupled to the substrate by a base 325. The multi-part lever structure includes a base flexure 329 coupled to the base, an end member 331 with a handle 334 at one end, and a quadrilateral structure between the first flexure and the end member. As illustrated in
The quadrilateral structure may be in the form of a parallelogram, as for example illustrated in
In a normally biased position, the first flexure and the second flexure are roughly parallel to one another, and roughly in the same plane as and orthogonal to the third and fourth flexures, which are also roughly parallel to one another. In operation, displacement of the handle in directions parallel to the third and fourth flexures results in bending of the first and second flexures, and change in position of the lens in direction of displacement of the handle.
The device in
The relative significance of handle rotation and warping about the different axes may vary depending on embodiments, but incorporation of compliance into the lever arm with a flexure group while having relative stiffness in the corresponding degree of freedom in the lens platform flexure group may be commonly applied to embodiments specifically discussed herein as well as additional embodiments. Many embodiments having a property of handle rotation insensitivity are possible depending on design goals involving sensitivity to various handle rotations, geometric constraints, process constraints, required range of motion, available space, and other considerations.
As shown in
There may be only one element in a flexure group, though the embodiment of
The design of the lens platform flexure group may vary, but for illustrative purposes, action of the device of
Processing steps using lithographic technologies for a multipart lever may be as follows for some embodiments. The starting material that ultimately becomes an optical breadboard including the multipart lever is a raw silicon-on-insulator wafer, obtainable from numerous commercial sources. A substrate is n-type silicon, while in this example there is a one micron thick layer of silicon dioxide on top of the substrate and a 15 micron thick top p+-type silicon layer. The multipart lever will be built from this top silicon layer.
The wafer is lightly oxidized and then metalized to form high speed traces that may be used for electrical contacts for lasers or other components. The top silicon wafer is then etched, stopping at the SiO2 layers and forming the cavity around the multipart handle. The silicon underneath the oxide is then etched with a KOH solution to undercut and release the multipart lever. Note that KOH is selective and will not etch the top p+ doped layer. A final quick oxide etch cleans off any remaining oxide under the mechanical components. Finally another layer of metallization followed by deposition of solder is applied to form the solder structure and, if desired, a metallization on the lever arm. Angled evaporation may be used to allow metallization into a groove under the lever arm.
Once the optical breadboard is completed, one or more laser diodes may be soldered into the assembly, with a mechanical tolerance of about <+/−5 um. A lens for each multipart lever may then be fixed to the holders, using for example either solder or high temperature epoxy. Finally fiber pigtail, or a PLC, may be attached with rough alignment of the input waveguides.
In some embodiments setting position of the multipart lever and locking the position may be accomplished as follows. A deposition of solder may be provided about the arm near the handle. In some embodiments there may be a small metalized pad on the arm and two thick depositions of solder on either side of the arm. Application of current to the solder pads causes localized heating and the solder to melt and lock the handle in position. Once for example lasers, a PLC and lens have been loaded on to the stage, the lasers are activated, and the handle is adjusted to maximize the optical coupling to the PLC. At an acceptable optical coupling, and preferably optimum optical coupling, electrical current is applied to the solder pads, and the solder flows to a position to lock the handle in position. Optical coupling may be evaluated by determining optical output of the PLC, which may be performed for example measuring optical power using an optical power meter or other device. A substantial advantage of having the solder pad at the far end of the assembly is that any mechanical motion that might occur as the solder cools down is demagnified, and the system will see minimal reduction in output coupling. Generally the electrical current to melt the solder is removed after the solder has flowed to position to lock the handle in position, or sufficient heating has been applied to allow the solder to so flow. The solder serves, as one of skill understands, as an adhesive. In various embodiments other adhesives may be used to lock the handle in position, or laser welds or other means may be used.
There are various other ways of fixing the position of the lever after alignment has been achieved. For example, rather than electrically melting the solder to lock the arm, one may use a laser to heat the solder, which may be referred to in the art as laser soldering. One may also use epoxies that can be cured either thermally, with UV light, or a combination. Rather than having solder on both sides of the lever, one may have just one solder ball to one side, and align the part by pushing the lever into the melted solder ball. Finally, one can fix the arm in position by laser welding the silicon directly.
Accordingly, aspects of the invention relate to a MEMS based alignment technology. Although certain embodiments are described, it should be recognized that various aspects of the invention include the novel and non-obvious claims supported by this disclosure.
Claims
1.-30. (canceled)
31. A device for use in aligning optical components, comprising:
- a platform for receiving an optical component;
- means for flexibly coupling the platform to a base;
- an elongate arm coupled to the platform, the elongate arm terminating in a handle; and
- means for flexibly coupling the handle to other portions of the elongate arm.
32. The device of claim 31, where the means for flexibly coupling the platform to the base provides at least a translational degree of freedom and the means for flexibly coupling the handle to other portions of the elongate arm provide at least a rotational degree of freedom.
Type: Application
Filed: Dec 5, 2018
Publication Date: Nov 21, 2019
Inventors: Bardia Pezeshki (Menlo Park, CA), Michael Sherback (Newark, CA), Dinh Ton (Newark, CA)
Application Number: 16/211,130