METHOD FOR PACKAGING DISPLAY PANELS, DISPLAY PANEL PACKAGING BOX, AND PACKAGING BOX BODY
Disclosed are a method for packaging a display panel, a display panel packaging box, and a packaging box body (100). The method includes: placing and fixing one display panel in a packaging box body (100), and the part of the display panel having a driving circuit board faces a first direction, the part of the display panel having a panel module faces a second direction, the first direction is opposite to the second direction; and placing and fixing another display panel in the packaging box body (100), and the part of the another display panel having the panel module faces the first direction, the part of the another display panel having the driving circuit board facing the second direction.
The disclosure generally relates to the technical field of packaging, and more particularly relates to a method for packaging a display panel, a display panel packaging box, and a packaging box body.
BACKGROUNDThe current packaging devices for packaging display panels normally place the display panels in a same direction during packaging, the parts of the display panels having the driving circuit boards are stacked together at one side, and the parts of the display panels having the panel modules are stacked together at the other side. However, the element defined on the driving circuit board normally has a height greater than the height of the element defined on the display module, when there are a lot of display panels stacked together, the height of the part of the display panels having the driving circuit boards is greater than that of the part of the display panels having the panel modules. When a shock test for verifying a reliability of the stacked display panels is carried out, a chip on film (COF) configured to connect the driving circuit board and the panel component is prone to stand against a pull during the test, as such a soft circuit board, such as the COF, may be damaged. Further, the height difference between two parts of the stacked display panels also limits a loading quantity of the display panels in the packaging box.
SUMMARYThe present disclosure provides a method for packaging a display panel, a display panel packaging box, and a packaging box body, which can prevent a soft circuit board, such as a chip on film, located between two adjacent display panels, from standing against pull, and can ensure the loading quantity of the display panel.
One aspect, the exemplary embodiment of the present disclosure provides a method for packaging the display panels, the method includes:
placing and fixing one display panel in a packaging box body, allowing the part of the display panel having a driving circuit board faces a first direction, the part of the display panel having a panel module faces a second direction, the first direction is opposite to the second direction; and
placing and fixing another display panel in the packaging box body, allowing the part of the another display panel having the panel module faces the first direction, the part of the another display panel having the driving circuit board faces the second direction.
The method further includes: placing a buffer element after placing each of the display panels, allowing the buffer element to be located between two adjacent display panels.
Another aspect, the exemplary embodiment of the present disclosure provides a display panel packaging box, which includes:
a packaging box body, the packaging box body includes:
a plurality of fixing elements, a part of the fixing elements are configured to fix a panel module of one display panel, another part of the fixing elements are configured to fix a driving circuit board of another display panel, allowing the driving circuit boards of two adjacent display panel are staggered with each other.
The fixing elements includes:
a plurality of first protrusions, defined on a side wall of the box body;
a plurality of second protrusions, defined on the side wall of the packaging box body and staggered with the first protrusions, the first protrusion and the second protrusion adjacent to the first protrusion cooperatively fix the panel module of one display panel, the second protrusion and the next first protrusion adjacent to the second protrusion cooperatively fix the driving circuit board of the next display panel, allowing the driving circuit boards of two adjacent display panels are staggered with each other.
The packaging box further includes a cover which is configured to seal the packaging box body.
The packaging box further includes a plurality of buffer elements, the buffer element is placed between two display panels, and is configured to separate two display panels.
The buffer element is a foam pad.
The buffer element is an air bubble buffer bag.
The packaging box body further includes:
a plurality of first receiving grooves, located at a bottom of the packaging box body, the first receiving grooves are configured to fix the part of the display panel having the driving circuit board; and
a plurality of second receiving grooves, located at the bottom of the packaging box body, the second receiving grooves are staggered with the first receiving grooves, the second receiving grooves are configured to fix the part of the display panel having the panel module, a width of the second receiving groove is greater than a width of the first receiving groove.
Another aspect, the exemplary embodiment of the present disclosure provides a packaging box body, which includes:
a plurality of first protrusions, defined on a side wall of the box body;
a plurality of second protrusions, defined on the side wall of the box body and staggered with the first protrusions, the first protrusion and the second protrusion adjacent to the first protrusion are configured to fix a panel module of one display panel, the second protrusion and the next first protrusion adjacent to the second protrusion are configured to fix a driving circuit board of the next display panel, as such the driving circuit boards of two adjacent display panels are staggered with each other.
a plurality of first receiving grooves, located at a bottom of the packaging box body, the first receiving grooves are configured to fix the part of the display panel having the driving circuit board; and
a plurality of second receiving grooves, located at the bottom of the packaging box body, the second receiving grooves are staggered with the first receiving grooves, the second receiving grooves are configured to fix the part of the display panel having the panel module, a width of the second receiving groove is greater than a width of the first receiving groove.
The exemplary embodiment of the present disclosure provides a packaging method for packaging display panels, a display panel packaging box, and a packaging box body. Two adjacent display panels are reversely stacked, as such the driving circuit boards are staggered with each other, which can prevent the COF from standing against a pull and from being damaged which would be induced by a height of the part of the display panels having the driving circuit boards is greater than the height of the part of the display panels having the panel modules. Therefore, the yield rate of the stacked display panels is improved. This kind of stack allows that two parts of the stacked display panels are almost at a same altitude, such that the loading quantity of the display panels in each packaging box can be improved to make a good use of the packaging box, and the cost is reduced.
To better illustrate the technical solutions that are reflected in various embodiments according to this disclosure or that are found in the prior art, the accompanying drawings intended for the description of the embodiments herein or for the prior art will now be briefly described, it is evident that the accompanying drawings listed in the following description show merely some embodiments according to this disclosure, and that those having ordinary skill in the art will be able to obtain other drawings based on the arrangements shown in these drawings without making inventive efforts.
The realizing of the aim, functional characteristics, advantages of the present disclosure are further described in detail with reference to the accompanying drawings and the embodiments.
DETAILED DESCRIPTIONThe technical solutions of the embodiments of the present disclosure will be clearly and completely described in the following with reference to the accompanying drawings. It is obvious that the embodiments to be described are only a part rather than all of the embodiments of the present disclosure. All other embodiments obtained by persons skilled in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
It should be understood that the terms used in this specification and claims such as “comprising” and “including” refer to the existence of the described characteristics, steps, operations, elements and/or components, without excluding one or more other characteristics, steps, operations, elements and/or components, or the existence or addition of their sets.
Referring to
S101, placing and fixing one display panel in a packaging box body, and the part of the display panel having a driving circuit board faces a first direction, the part of the display panel having a panel module faces a second direction, the first direction is opposite to the second direction.
For example, the display panel includes three parts, one part is the panel module configured to display image, the panel module includes a glass substrate, an array substrate, a color filter, a polarizer, a data line, a scan line, etc. Another part is the driving circuit board, the driving circuit board includes a scan driving circuit, a data driven part, a timing control circuit, etc. The last part is a soft circuit board, such as, a chip on film (COF), which is configured to electrically connect the panel module to the driving circuit board.
S102, placing and fixing another display panel in the packaging box body, allowing the part of the another display panel having the panel module faces the first direction, the part of the another display panel having the driving circuit board faces the second direction.
The driving circuit boards of the two display panels are staggered with each other, to prevent the soft circuit board, such as the chip on film (COF) from standing against a pull. And, after multiple display panels are stacked together, two parts of the stacked display panels are at a same altitude, the height refers to the thickness of the stacked display panels, is not necessarily a physical height formed from the top to bottom.
Furthermore, the first direction is a direction from an opening of the box body to the bottom of the box body, the second direction is a direction from the bottom of the box body to the opening of the box body, the first direction and the second direction are interchangeable.
When packaging the display panels, the part of the display panel having the driving circuit board faces the bottom of the box body, the part of the another display panel having the driving circuit board faces the opening of the box body, and that cycle repeats until the box body is full-filled.
Two adjacent display panels are next to each other, while the driving circuit board and the panel module are staggered with each other, a height of an element located at the part of display panel having the driving circuit board is greater than a height of an element located at the part of the display panel having the display module, as such after the display panels are reversely stacked together, especially, there is an even number of display panels which are reversely stacked together, the thicknesses of two parts of the stacked display panels are almost the same, which can prevent the COF from standing against a pull and from being damaged which would be induced by the height of the part of the display panels having the driving circuit boards is greater than the height of the part of the display panels having the panel modules. Therefore, the yield rate of the stacked display panels can be improved. This kind of stack allows that two parts of the stacked display panels are almost at the same altitude, such that the loading quantity of the display panels in each packaging box can be improved to make a good use of the packaging box, and the cost is reduced.
When placing the display panels according to the above method, a first block of display panel is placed in the box with the driving circuit board towards the bottom of the box, that is, the driving circuit board faces downwards, then a second block of display panel is placed in the box with the display panel towards the opening of the box, that is, the driving circuit board faces upwards. Therefore, the driving circuit boards of the two adjacent display panels are staggered with each other. Or, the first block of display panel is placed in the box with the driving circuit board towards the opening of the box, then the second block of display panel is placed in the box with the display panel towards the bottom of the box. The present disclosure does not limit the order of placing the display panels.
In the method for packaging the display panels according to the exemplary embodiment of the present disclosure, two adjacent display panels are reversely stacked, the thicknesses of two parts of the display panels are almost the same, which can prevent the COF from standing against the pull and from being damaged which would be induced by the height of the part of the display panels having the driving circuit boards is greater than the height of the part of the display panels having the panel modules. Therefore, the yield rate of the stacked display panels can be improved. This kind of stack allows that two parts of the stacked display panels are almost at the same altitude, such that the loading quantity of the display panels in each packaging box can be improved to make a good use of the packaging box, and the cost is reduced.
Referring to
S201, placing and fixing one display panel in a packaging box body, and the part of the display panel having a driving circuit board faces a first direction, the part of the display panel having a panel module faces a second direction, the first direction is opposite to the second direction.
The display panel mainly includes three parts, one part is the panel module configured to display image, the panel module includes a glass substrate, an array substrate, a color filter, a polarizer, a data line, a scan line, etc. Another part is the driving circuit board, the driving circuit board includes a scan driving circuit, a data driven part, a timing control circuit, etc. The last part is a soft circuit board, such as, a chip on film (COF), which is configured to electrically connect the panel module to the driving circuit board.
S202, placing a buffer element at the rear of the display panel, as such the buffer element is located between the display panel and the next display panel.
S203, placing and fixing the next display panel in the packaging box body, and the part of the next display panel having the panel module faces the first direction, the part of the next display panel having the driving circuit board faces the second direction.
S204, placing another buffer element at the rear of the next display panel, as such the another buffer element is located between the next display panel and another next display panel.
When packaging the display panels, the step S201 to step S204 are repeated until the packaging box is full-filled.
Two adjacent display panels are next to each other, while the driving circuit board and the panel module are staggered with each other, a height of an element located at the part of display panel having the driving circuit board is greater than a height of an element located at the part of the display panel having the display module, as such after the display panels are reversely stacked together, especially, there is an even number of display panels which are reversely stacked together, the thicknesses of two parts of the stacked display panels are almost the same, which can prevent the COF from standing against a pull and from being damaged which would be induced by the height of the part of the display panels having the driving circuit boards is greater than the height of the part of the display panels having the panel modules, Therefore, the yield rate of the stacked display panels can be improved. This kind of stack allows that two parts of the stacked display panels are almost at the same altitude, such that the loading quantity of the display panels in each packaging box can be improved to make a good use of the packaging box, and the cost is reduced. After placing each of the display panels, one buffer element is located between two adjacent display panels, to prevent the display panels from being damaged which would be induced by the shock in the transport process.
When placing the display panels according to the above method, a first block of display panel is placed in the box with the driving circuit board towards the bottom of the box, that is, the driving circuit board faces downwards, then a second block of display panel is placed in the box with the display panel towards the opening of the box, that is, the driving circuit board faces upwards. Therefore, the driving circuit boards of the two adjacent display panels are staggered with each other. Or, the first block of display panel is placed in the box with the driving circuit board towards the opening of the box, then the second block of display panel is placed in the box with the display panel towards the bottom of the box. The present disclosure does not limit the order of placing the display panels.
In the method for packaging the display panels according to the exemplary embodiment of the present disclosure, two adjacent display panels are reversely placed, the thicknesses of two parts of the display panels are almost the same, which can prevent the COF from standing against the pull and from being damaged which would be induced by the height of the part of the display panels having the driving circuit boards is greater than the height of the part of the display panels having the panel modules. Therefore, the yield rate of the stacked display panels can be improved. This kind of stack allows that two parts of the stacked display panels are almost at the same altitude, such that the loading quantity of the display panels in each packaging box can be improved to make a good use of the packaging box, and the cost is reduced.
Referring to
A part of the fixing elements 101 are configured to fix a panel module of one display panel, another part of the fixing elements are configured to fix a driving circuit board of another display panel, as such the driving circuit boards of two adjacent display panel are staggered with each other.
The display panel includes three parts, one part is the panel module configured to display image, the panel module includes a glass substrate, an array substrate, a color filter, a polarizer, a data line, a scan line, etc. Another part is the driving circuit board, the driving circuit board includes a scan driving circuit, a data driven part, a timing control circuit, etc. The last part is a soft circuit board, such as, a chip on film (COF), which is configured to electrically connect the panel module to the driving circuit board.
A height of an element located at the part of display panel having the driving circuit board is different from a height of an element located at the part of the display panel having the display module. When packaging the display panels, if the display panels are placed in this same direction, which may cause thicknesses of two parts of the display panels (vertically placed) are inconsistency, and the COF of the display panel is prone to stand against a pull. The above problem can be avoided by reversely placing each two adjacent display panels.
Furthermore, the fixing elements 101 include a plurality of first protrusions 1011 and a plurality of second protrusions 1012, which are all located at an up end of the side wall, that is, the first protrusions 1011 and the second protrusions 1012 are all adjacent to the opening of the box body.
The first protrusions 1011 and the second protrusions 1012 are all located on the side wall, and the first protrusions 1011 are staggered with the second protrusions 1012, the first protrusion 1011 and the second protrusion 1012 adjacent to the first protrusion 1011 cooperatively fix the panel module of one display panel, the second protrusion 1012 and the next first protrusion 1011 adjacent to the second protrusion 1012 cooperatively fix the driving circuit board of the next display panel.
In the exemplary embodiment, one fixing element 101 includes two inner sides, apart from the fixing elements 101 located at the head and the tail of the display panel, one inner side of each of the remaining fixing elements 101 is configured to fix the driving circuit board, the other inner side of each of the remaining fixing elements 101 is configured to fix the panel module. That is, two sides of one fixing element 101 can both be used for fixing element, as such the number of the fixing elements 101 can be reduced.
As the thickness of the driving circuit board substrate is different from the thickness of the panel module substrate, the thickness of the first protrusion 1011 is also different from the thickness of the second protrusion 1012.
In another exemplary embodiment, the fixing elements 101 can be the same (including the thickness), while, the fixing elements 101 cannot be reused when the fixing elements 101 are used for fixing the display panel.
In the exemplary embodiment, the packaging box further includes a cover which is configured to seal the packaging box body 100.
The cover can seal the opening, as such the cover can prevent the display panels from been poured out from the packaging box body 100.
In the exemplary embodiment, the packaging box further includes a plurality of buffer elements, the buffer element is placed between two display panels, and is configured to separate the two display panels.
The two adjacent display panels are separated from each other through the buffer element, which can avoid the components of the two adjacent display panels from scratching with each other, further avoid the display panels from been damaged.
In the exemplary embodiment, the buffer element is a foam pad.
In another exemplary embodiment of the present disclosure, the buffer element is defined as an air bubble buffer bag.
The foam pad and the buffer bag both have good buffering function, and can protect the display panel.
In another exemplary embodiment of the present disclosure, the packaging box body 100 further includes a plurality of first receiving grooves 102 and a plurality of second receiving grooves 103. Referring to
The first receiving grooves 102 are located at a bottom of the packaging box body 100, and the first receiving grooves 102 are configured to fix the part of the display panel having the driving circuit board.
The second receiving grooves 103 are located at the bottom of the packaging box body 100, the second receiving grooves 103 are staggered with the first receiving grooves 102, the second receiving grooves 103 are configured to fix the part of the display panel having the panel module, a width of the second receiving groove 103 is greater than a width of the first receiving groove 102.
The width of the first receiving groove 102 is equated to a width of the driving circuit board substrate, as such the first receiving groove 102 can be configured to tightly fix the driving circuit board substrate. The width of the second receiving groove 103 is equated to a width of the panel module, as such the second receiving groove 103 can be configured to tightly fix the panel module.
In the exemplary embodiment, the packaging box body 100 has an integrated structure made of foam material.
The foam material can be an EPO material (a mixture of styrene and polyethylene), an EPP material (polypropylene plastic), or other soft material. The foam material can provide a buffer for the display panels. The EPO material, the EPP material, and other soft material, all have good buffering effect, as such the EPO material, the EPP material, and other soft material would not cause damage to the display panel.
During the transport process, the display panels are easily to be impacted due to an external force, or an falling down of the packaging box body 100. The packaging box body 100 made of the EPO material or EPP material can disperse the external force and the impact energy when packaging box body 100 falls down, as such, the packaging box body 100 can effectively protect the display panel.
For the display panel packaging box provided by the exemplary embodiment of the present disclosure, two adjacent display panels in the packaging box body 100 are reversely placed, as such the driving circuit boards are staggered with each other, which can prevent the COF from standing against the pull and from being damaged which would be induced by the height of the part of the display panels having the driving circuit boards is greater than the height of the part of the display panels having the panel modules. Therefore, the yield rate of the stacked display panels can be improved. This kind of stack allows that two parts of the stacked display panels are almost at the same altitude, such that the loading quantity of the display panels in each packaging box can be improved to make a good use of the packaging box, and the cost is reduced.
In some exemplary embodiments, the display panel can be a twisted nematic (TN) panel, a vertical alignment (VA) panel, an in-plane switching (IPS) panel, a continuous pinwheel alignment (CPA) panel, an advanced super dimension switch (ADSDS) panel, a liquid crystal display panel, a light emitting diode (LED) panel, an organic light emitting diode (OLED) panel, a quantum dot light emitting diodes (QLED) panel, a curved panel, etc.
The exemplary embodiment of the present disclosure also provides a packaging box body, referring to
The first protrusions 1011 and the second protrusions 1012 are all located at the up end of the side wall, that is, the first protrusions 1011 and the second protrusions 1012 are adjacent to the opening of the box body.
The first protrusions 1011 and the second protrusions 1012 are all located on the side wall, and the first protrusions 1011 are staggered with the second protrusions 1012, the first protrusion 1011 and the second protrusion 1012 adjacent to the first protrusion 1011 cooperatively fix the panel module of one display panel, the second protrusion 1012 and the next first protrusion 1011 adjacent to the second protrusion 1012 cooperatively fix the driving circuit board of the next display panel.
As a thickness of a substrate of the driving circuit board is different from a thickness of a substrate of panel module, a thickness of the first protrusion 1011 is also different from a thickness of the second protrusion 1012.
The first receiving grooves 102 are located at a bottom of the packaging box body 100, and are configured to fix the part of the display panel having the driving circuit board.
The second receiving grooves 103 are located at the bottom of the packaging box body 100, the second receiving grooves 103 are staggered with the first receiving grooves 102, the second receiving grooves 103 are configured to fix the part of the display panel having the panel module, a width of the second receiving groove 103 is greater than a width of the first receiving groove 102.
The width of the first receiving groove 102 is equated to a width of the driving circuit board substrate, as such the first receiving groove 102 can be configured to tightly fix the driving circuit board substrate. The width of the second receiving groove 103 is equated to a width of the panel module, as such the second receiving groove 103 can be configured to tightly fix the panel module.
In the exemplary embodiment, the packaging box body 100 has an integrated structure made of foam material.
It is to be understood that, in the above exemplary embodiments, the above exemplary embodiments have different emphases. Any missing details in one exemplary embodiment may be found in the related description of the other exemplary embodiments.
The foregoing descriptions are merely specific implementation manners of the present application, but are not intended to limit the protection scope of the present application. Any variation or replacement readily figured out by a person skilled in the art within the technical scope disclosed in the present application shall fall within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims
1. A method for packaging a display panel, comprising:
- placing and fixing one display panel in a packaging box body, allowing the part of the display panel having a driving circuit board facing a first direction, the part of the display panel having a panel module facing a second direction, the first direction being opposite to the second direction; and
- placing and fixing another display panel in the packaging box body, allowing the part of the another display panel having the panel module facing the first direction, the part of the another display panel having the driving circuit board facing the second direction.
2. The method according to claim 1, wherein the method further comprises: placing a buffer element after placing each of the display panels, allowing the buffer element to be located between two adjacent display panels.
3. The method according to claim 2, wherein the step of placing a buffer element after placing each of the display panels, allowing the buffer element to be located between two adjacent display panels, comprises:
- placing the buffer element at the rear of the display panel, allowing the buffer element to be placed between the display panel and the next display panel.
4. The method according to claim 2, wherein the step of placing a buffer element after placing each of the display panels, allowing the buffer element to be located between two adjacent display panels, comprises:
- placing the buffer element at the rear of the next display panel, allowing the buffer element to be placed between the next display panel and another next display panel.
5. The method according to claim 2, wherein the buffer element is a foam pad.
6. The method according to claim 2, wherein the buffer element is an air bubble buffer bag.
7. The method according to claim 1, wherein the packaging box body is made of foam material.
8. The method according to claim 7, wherein the foam material is a mixture of polystyrene and polyethylene.
9. The method according to claim 7, wherein the foam material is polypropylene plastic.
10. A display panel packaging box, comprising:
- a packaging box body, the packaging box body comprising:
- a plurality of fixing elements, a part of the fixing elements being configured to fix a panel module of one display panel, another part of the fixing elements being configured to fix a driving circuit board of another display panel, allowing the driving circuit boards of two adjacent display panel being staggered with each other.
11. The display panel packaging box according to claim 10, wherein the fixing elements comprises:
- a plurality of first protrusions, defined on a side wall of the packaging box body;
- a plurality of second protrusions, defined on the side wall of the packaging box body and staggered with the first protrusions, the first protrusion and the second protrusion adjacent to the first protrusion cooperatively fix the panel module of one display panel, the second protrusion and the next first protrusion adjacent to the second protrusion cooperatively fix the driving circuit board of the next display panel, allowing the driving circuit boards of two adjacent display panels are staggered with each other.
12. The display panel packaging box according to claim 10, wherein the display panel packaging box further comprises a cover which is configured to seal the packaging box body.
13. The display panel packaging box according to claim 10, wherein the display panel packaging box further comprises a plurality of buffer elements, the buffer element is placed between two display panels, and is configured to separate two display panels.
14. The display panel packaging box according to claim 13, wherein the buffer element is a foam pad.
15. The display panel packaging box according to claim 13, wherein the buffer element is an air bubble buffer bag.
16. The display panel packaging box according to claim 10, wherein the packaging box body is made of foam material.
17. The display panel packaging box according to claim 16, wherein the foam material is a mixture of polystyrene and polyethylene.
18. The display panel packaging box according to claim 16, wherein the foam material is polypropylene plastic.
19. The display panel packaging box according to claim 10, wherein the display panel packaging box body further comprises:
- a plurality of first receiving grooves, located at a bottom of the packaging box body, the first receiving grooves are configured to fix the part of the display panel having the driving circuit board; and
- a plurality of second receiving grooves, located at the bottom of the packaging box body, the second receiving grooves are staggered with the first receiving grooves, the second receiving grooves are configured to fix the part of the display panel having the panel module, a width of the second receiving groove is greater than a width of the first receiving groove.
20. A packaging box body, comprising:
- a plurality of first protrusions, defined on a side wall of the box body;
- a plurality of second protrusions, defined on the side wall of the box body and staggered with the first protrusions, the first protrusion and the second protrusion adjacent to the first protrusion cooperatively fixing a panel module of one display panel, the second protrusion and the next first protrusion adjacent to the second protrusion cooperatively fixing a driving circuit board of the next display panel, allowing the driving circuit boards of two adjacent display panels being staggered with each other;
- a plurality of first receiving grooves, located at a bottom of the packaging box body, the first receiving grooves being configured to fix the part of the display panel having the driving circuit board; and
- a plurality of second receiving grooves, located at the bottom of the packaging box body, the second receiving grooves being staggered with the first receiving grooves, the second receiving grooves being configured to fix the part of the display panel having the panel module, a width of the second receiving groove being greater than a width of the first receiving groove.
Type: Application
Filed: Oct 23, 2017
Publication Date: Jul 9, 2020
Inventor: Shuozhen LIANG (Chongqing)
Application Number: 16/625,280
