ELECTROPLATING ASSEMBLY

Abstract

An electroplating assembly for holding a workpiece through a thermodynamic cycle of electroplating comprises a plating rack that supports the workpiece. An electric bus bar is disposed on the plating rack. At least one connector joins the workpiece with the plating rack. At least one flexible support joins the workpiece with the plating rack.

Description

BACKGROUND

Embodiments disclosed herein relate generally to an assembly for holding a workpiece for processing. Specifically, embodiments disclosed herein relate to an assembly used to electroplate a workpiece.

Some workpieces are processed to become items in an article of manufacture. In one exemplary process, a workpiece is electroplated to add chrome. This exemplary process is similar to that used to place a chrome finish on a bumper for a vehicle. To perform this process, a workpiece may be attached to a plating rack with at least one connector. The at least one connector may provide a substantially rigid joint of the workpiece and the plating rack. The plating rack and the at least on connector comprise one embodiment of an electroplating assembly.

Starting the chrome plating process, the workpiece and the plating rack are joined with the at least one connector, all of which are at ambient temperature. During this chrome plating process, the workpiece, the at least one connector and the plating rack are exposed to significant heat, such as within the range of 50° C. to 65° C. Then, the workpiece, the at least one connector and the plating rack return to ambient temperature, i.e. a thermodynamic cycle of electroplating. This thermodynamic cycle of electroplating may induce the workpiece to deform. In some cases, the substantially rigid joint provided by the at least one connector combined with the thermodynamic cycle of electroplating may cause the workpiece to warp as the workpiece is returned to ambient temperature. This warping may damage the workpiece thereby requiring additional processing to correct the workpiece.

It is desirable to provide an improved electroplating assembly.

SUMMARY

Disclosed herein are embodiments of an electroplating assembly. According to one embodiment, an electroplating assembly holds a workpiece through a thermodynamic cycle of electroplating. The assembly comprises a plating rack that supports the workpiece. An electric bus bar is disposed on the plating rack. At least one connector joins the workpiece with the plating rack. At least one flexible support joins the workpiece with the plating rack.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view of one embodiment of an electroplating assembly described herein;

FIG. 2 is an enlarged view of a portion of the electroplating assembly of FIG. 1;

FIG. 3 is an enlarged, partially sectioned view of a portion of the electroplating assembly of FIG. 2; and

FIG. 4. is an enlarged view of a portion of the electroplating assembly viewed orthogonally from the view of FIG. 3.

DETAILED DESCRIPTION

This disclosure relates to an electroplating assembly 10, an embodiment of which is shown in FIG. 1, used for holding a workpiece 12 during a thermodynamic cycle of electroplating. It is to be understood that the electroplating assembly 10 can be modified in order to accommodate the workpiece 12. Also, multiple electroplating assemblies 10 can be used together, such as in an assembly line.

The electroplating assembly 10 generally comprises a plating rack 14, at least one connector 16 and at least one flexible support 18. The plating rack 14 includes a conductor, such an electric bus bar and the like, for conveying electric current to the workpiece 12. The at least one connector 16 can be substantially similar to a holder, a hanger and a hook currently used in electroplating. The at least one connector 16 includes a conductor for conveying electric current from the plating rack 14 to the workpiece 12. In some embodiments, an electric bus bar 19 comprising the plating rack 14 is electrically connected with the conductor comprising the at least one connector 16 such as by soldering or brazing. Compared to the at least one flexible support 18, the at least one connector 16 provides substantially rigid attachment of the workpiece 12 and the plating rack 14. A plating rack contact 20 is disposed at an end of the at least one connector 16 opposite to the end thereof connected to the electric bus bar 19. The plating rack contact 20 may be soldered or brazed to the end of the at least one connector 16.

The at least one flexible support 18 includes a conductive core 21, such as comprising beryllium copper wire and the like. A cover 24 is disposed around at least a portion of the conductive core 21. In some embodiments, the cover 24 comprises a polymer. In some embodiments, the cover 24 is at least one of chemically and electrically insulating. The cover 24 may be replaceable. One end of the conductive core 21 of the at least one flexible support 18 is electrically connected with the electric bus bar 19 comprising the plating rack 14 such as by soldering or brazing. A plating rack contact 22 is disposed on an end of the conductive core 21 of the at least one flexible support 18 opposite to the end thereof connected to the electric bus bar 19. The plating rack contact 22 may be soldered or brazed to an end of the conductive core 21.

A segment 26 of the at least one flexible support 18, e.g. a portion of the at least one flexible support 18 occupied by the cover 24, is fashioned, twisted, heat treated and/or folded into a spring-like shape. This configuration allows adequate attachment of the workpiece 12 to the plating rack 14 while permitting limited movement or distortion of the workpiece 12 when the workpiece 12 is exposed to temperatures inherent in electroplating as well as subsequent cooling of the workpiece 12 to ambient temperature, i.e. a thermodynamic cycle of electroplating. The segment 26 may be formed by extrusion, casting, progressive die stamping, CNC bending and the like to obtain an initial shape, and then at least one of age hardened and heat-treated using industry-accepted methods inherent to processing of spring copper and the like to set the configuration of the segment 26. Without the segment 26 of the at least one flexible support 18 joining the workpiece 12 to the plating rack 14, the thermodynamic cycle of electroplating may cause the workpiece 12 may warp unacceptably. Unacceptable warping of the workpiece 12 can add to costs associated with providing the workpiece 12 for subsequent use.

To reduce likelihood of unacceptable warping of the workpiece 12 due to the thermodynamic cycle of electroplating, the at least one connector 16 and the at least one flexible support 18 joins the workpiece 12 with the plating rack 14. Locations and numbers of the at least one connector 16 and the at least one flexible support 18 can be determined empirically, using computer-aided engineering and the like. The locations and numbers of the at least one connector 16 and the at least one flexible support 18 may depend on size, weight, and configuration of the workpiece 12. In this manner, the segment 26 allows controlled, consistent movement of the workpiece 12 during the thermodynamic cycle of the electroplating process. This reduces likelihood that the workpiece 12 warps unacceptably.

In another embodiment shown in FIG. 4, the flexible support 18, or just the segment 26, has a configuration that allows for movement or shifting of the flexible support 18 due to exposure of the flexible support 18 to the thermodynamic cycle of the electroplating process. In this embodiment of flexible support 18, movement the flexible support 18 and therefore of workpiece 12 is limited in directions indicated by the arrows shown in FIG. 4. Movement or shifting of the flexible support 18 and the associated workpiece 12 are directed in chosen direction or directions. This configuration of flexible support 18 can be achieved by using extrusion, casting, progressive die stamping, CNC bending and the like. In this embodiment, the flexible support 18, or just the segment 26, has a first dimension, such as a height, and a second dimension, such as a width. The first dimension is larger than the second dimension. Movement or shifting of the flexible support 18 or the segment 26 due to exposure to the thermodynamic cycle of the electroplating process is in a first direction substantially orthogonal to a first plane defined by the first dimension is favored over movement or shifting of the flexible support 18 in a second direction substantially orthogonal to a second plane defined by defined by the second dimension. In another embodiment, movement of the flexible support 18 and therefore of the workpiece 12 can be limited in another direction by axially rotating the flexible support 18 by ninety (90) degrees with respect to the orientation shown in FIG. 4.

Claims

1. An electroplating assembly for holding a workpiece through a thermodynamic cycle of electroplating, the electroplating assembly comprising:

a plating rack that supports the workpiece;

an electric bus bar on the plating rack;

at least one connector joining the workpiece with the plating rack; and

at least one flexible support joining the workpiece with the plating rack.

2. The electroplating assembly of claim 1 further comprising:

a segment on the at least one flexible support that permits limited movement of the workpiece through a thermodynamic cycle of electroplating, wherein the segment has a first dimension and a second dimension, and the first dimension is larger than the second dimension.

3. The electroplating assembly of claim 2 wherein movement of the segment due to exposure of the segment to the thermodynamic cycle of the electroplating process in a first direction substantially orthogonal to a plane defined by the first dimension is favored over movement of the flexible support 18 in a second direction substantially orthogonal to a second plane defined by the second dimension.

4. The electroplating assembly of claim 2 further comprising:

a conductive core on the at least one flexible support.

5. The electroplating assembly of claim 4 wherein the conductive core comprises beryllium copper wire.

6. The electroplating assembly of claim 2 further comprising:

a plating rack contact disposed on an end of the at least one flexible connector opposite to an end thereof connected to the electrical bus bar.

7. The electroplating assembly of claim 1 further comprising:

a conductor for conveying electric current from the electric bus bar on the plating rack to the workpiece disposed on the at least one connector.

8. The electroplating assembly of claim 1 further comprising:

a plating rack contact disposed on an end of the conductor opposite to an end thereof connected to the electrical bus bar.