CONDITIONING ASSEMBLY, METHOD FOR MANUFACTURING THE SAME, AND ASSEMBLED CONDITIONER USING THE SAME

Abstract

A conditioning assembly, a method for manufacturing the same, and an assembled conditioner using the same are provided. The conditioning assembly includes a composite substrate and a dressing part. The composite substrate includes a porous reinforced structure and a filling material. The filling material covers the porous reinforced structure and fills into the inside of the porous reinforced structure. The dressing part is combined with the composite substrate.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of priority to Taiwan Patent Application No. 111124695, filed on Jul. 1, 2022. The entire content of the above identified application is incorporated herein by reference.

Some references, which may include patents, patent applications and various publications, can be cited and discussed in the description of this disclosure. The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a conditioning assembly, a method for manufacturing the same, and an assembled conditioner using the same, and more particularly to a conditioning assembly suitable for conditioning polishing pads, a method for manufacturing the same, and an assembled conditioner using the same.

BACKGROUND OF THE DISCLOSURE

In a chemical mechanical polishing (CMP) process, a polishing pad and a polishing slurry are usually used to polish the surface of a semiconductor wafer. In the chemical mechanical polishing process, a conditioner is used to condition, trim or dress the surface of the polishing pad, remove waste material generated during wafer polishing, and restore the roughness of the polishing pad in order to maintain stable polishing quality.

Prior conditioners generally include a substrate and a dressing layer disposed on one side of the substrate. In the prior process of manufacturing the dressing layer, a plurality of abrasive grains can be fixed on the working surface of the substrate through a solder layer by a high-temperature brazing process. However, the high-temperature brazing process is performed at temperatures around 1000° C., which not only consumes time and energy, but also deteriorates (or degrades) the abrasive grains and reduces the life of the conditioner.

Another way is to form an electroplating layer by electroplating in order to fix the abrasive grains on the substrate. However, it is difficult to avoid the situation of missing electroplating during the electroplating process, resulting in that the bonding area between some abrasive grains and the electroplating layer is too thin. Therefore, when the polishing pad is conditioned or dressed with a conditioner, the abrasive grains easily fall off. In addition, the wastewater generated after electroplating is usually strong alkali or strong acid, or contains toxic heavy metals, which causes pollution to the environment.

In order to avoid the above problems, another method is to use resin to fix the abrasive grains on the substrate. However, the rigidity and strength of the resin are still insufficient to fix the abrasive grains, so that the abrasive grains of the conditioner still fall off due to the force during the dressing process of the polishing pad. In addition, the resin is more prone to cracking due to aging or hardening, thus reducing the service life of the conditioner.

Therefore, how to improve the structure and manufacturing process of the conditioner to overcome the above-mentioned defects is still one of the important issues to be solved in this field.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacy, the present disclosure provides a conditioning assembly, a method for manufacturing the same, and an assembled conditioner using the same, which can not only reduce the manufacturing cost, reduce environmental pollution, but also prolong the service life.

In one aspect, the present disclosure provides a conditioning assembly, which includes a composite substrate and a dressing part. The composite substrate includes a porous reinforced structure and a filling material, and the filling material covers the porous reinforced structure and fills into the porous reinforced structure. The dressing part is combined with the composite substrate.

In another aspect, the present disclosure provides an assembled conditioner, which includes a base and a conditioning assembly disposed on the base. The conditioning assembly includes a composite substrate and a dressing part. The composite substrate includes a porous reinforced structure and a filling material, and the filling material covers the porous reinforced structure and fills into the porous reinforced structure. The dressing part is combined with the composite substrate.

In yet another aspect, the present disclosure provides a method for manufacturing a conditioning assembly, which includes embedding a dressing part into an uncured composite substrate, in which the uncured composite substrate includes a porous reinforced structure and a filling resin material, and the filling resin material wraps the porous reinforced structure and penetrates into the porous reinforced structure; and curing the filling resin material to form a composite substrate and fix the dressing part.

Therefore, in the conditioning assembly, the method for manufacturing the same, and the assembled conditioner using the same provided by the present disclosure, by virtue of “the composite substrate including a porous reinforced structure and a filling material” and “the filling material covering the porous reinforced structure and filling into the porous reinforced structure,” the conditioning assembly and the assembled conditioner provided by the present disclosure can have higher durability and service life. In addition, in the manufacturing method of the conditioning assembly provided by the present disclosure, the manufacturing temperature is relatively low, so that the manufacturing cost can be reduced, and the environmental pollution can be avoided.

These and other aspects of the present disclosure can become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein can be affected without departing from the spirit and scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The described embodiments can be better understood by reference to the following description and the accompanying drawings, in which:

FIG. 1 is a partial schematic cross-sectional view of a conditioning assembly according to a first embodiment of the present disclosure;

FIG. 2 is a schematic enlarged view of part II of FIG. 1;

FIG. 3 is a partial schematic enlarged view of the conditioning assembly according to another embodiment of the present disclosure;

FIG. 4 is a partial schematic enlarged view of the conditioning assembly according to another embodiment of the present disclosure;

FIG. 5 is a partial schematic enlarged view of the conditioning assembly according to another embodiment of the present disclosure;

FIG. 6 is a partial schematic cross-sectional view of the conditioning assembly according to a second embodiment of the present disclosure;

FIG. 7 is a schematic enlarged view of part VII of FIG. 6;

FIG. 8 is a partial schematic cross-sectional view of the conditioning assembly according to a third embodiment of the present disclosure;

FIG. 9 is a schematic enlarged view of part IX of FIG. 8;

FIG. 10 is a partial schematic enlarged view of the conditioning assembly according to another embodiment of the present disclosure;

FIG. 11 is a partial schematic enlarged view of the conditioning assembly according to another embodiment of the present disclosure;

FIG. 12 is a partial schematic cross-sectional view of the conditioning assembly according to a fourth embodiment of the present disclosure;

FIG. 13 is a schematic top view of an assembled conditioner according to an embodiment of the present disclosure;

FIG. 14 is a flowchart of a method for manufacturing the conditioning assembly according to an embodiment of the present disclosure;

FIG. 15 is a flowchart of the step of embedding the dressing part into an uncured composite substrate according to an embodiment of the present disclosure;

FIG. 16 is a schematic cross-sectional view of the step of embedding the dressing part to the porous reinforced structure in the conditioning assembly according to the embodiment of the present disclosure;

FIG. 17 is a schematic cross-sectional view of the step of covering the porous reinforced structure with the filling resin material in the conditioning assembly according to the embodiment of the present disclosure;

FIG. 18 is a schematic cross-sectional view of the step of covering the porous reinforced structure with the filling resin material in the conditioning assembly according to the embodiment of the present disclosure;

FIG. 19 is a schematic cross-sectional view of the step of embedding the dressing part to the porous reinforced structure in the conditioning assembly according to the embodiment of the present disclosure;

FIG. 20 is a schematic cross-sectional view of the conditioning assembly after the step of curing the filling resin material according to the embodiment of the present disclosure;

FIG. 21 is a schematic cross-sectional view of the conditioning assembly after the step of forming a corrosion-resistant coating layer according to the embodiment of the present disclosure;

FIG. 22 is a schematic cross-sectional view of the conditioning assembly in the step of fixing the composite substrate to the carrier according to the embodiment of the present disclosure;

FIG. 23 is a flowchart of the steps of embedding the dressing part in the uncured composite substrate according to another embodiment of the present disclosure;

FIG. 24 is a schematic cross-sectional view of the conditioning assembly after the step of fixing the porous reinforced structure on the carrier according to the embodiment of the present disclosure;

FIG. 25 is a schematic cross-sectional view of the conditioning assembly in the step of embedding the dressing part to the porous reinforced structure according to the embodiment of the present disclosure;

FIG. 26 is a schematic cross-sectional view of the conditioning assembly in the step of covering the porous reinforced structure with the filling resin material according to the embodiment of the present disclosure;

FIG. 27 is a schematic cross-sectional view of the conditioning assembly after the step of curing the filling resin material and forming the corrosion-resistant coating layer according to the embodiment of the present disclosure;

FIG. 28 is a partial cross-sectional photomicrograph of the conditioning assembly according to an embodiment of the present disclosure;

FIG. 29 is a partial top photomicrograph of the conditioning assembly according to an embodiment of the present disclosure; and

FIG. 30 is a photomicrograph of the conditioning assembly before the filling resin material is not filled with the porous reinforced structure according to an embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein can be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of “a,” “an” and “the” includes plural reference, and the meaning of “in” includes “in” and “on.” Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as “first,” “second” or “third” can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.

Embodiments

Referring to FIG. 1 and FIG. 2, FIG. 1 is a partial schematic cross-sectional view of the conditioning assembly according to the first embodiment of the present disclosure, and FIG. 2 is a schematic enlarged view of part II of FIG. 1. The first embodiment of the present disclosure provides a conditioning assembly 1A (or a trimming assembly), which includes a composite substrate 10 and a dressing part 11 (or a grinding part, or a polishing part, or an abrasive part).

Referring to FIG. 2, the composite substrate 10 includes a porous reinforced structure 100 and a filling material 101. In other words, the material constituting the porous reinforced structure 100 is different from the material constituting the filling material 101. Furthermore, the material rigidity of the porous reinforced structure 100 is greater than the material rigidity of the filling material 101. The porous reinforced structure 100 and the filling material 101 are combined with each other to form the composite substrate 10.

In this embodiment, the porous reinforced structure 100 can be used to strengthen the mechanical strength and rigidity of the composite substrate 10. In addition, the material constituting the porous reinforced structure 100 can be metal, glass fiber, carbon fiber, polymer, or any combination thereof. The metal can be high-purity metal or alloy. In detail, the material constituting the porous reinforced structure 100 can be nickel, iron, tungsten, copper, silver, magnesium, aluminum, titanium, nickel alloy, iron alloy, tungsten alloy, copper alloy, silver alloy, magnesium alloy, aluminum alloy, titanium alloy or stainless steel. In a preferred embodiment, the porous reinforced structure 100 can be nickel, zinc, titanium or alloy thereof with foamed structures, such as foamed nickel, foamed zinc or foamed titanium, which can improve the corrosion resistance of the conditioning assembly 1A. In another embodiment, when the material constituting the porous reinforced structure 100 is a composite material, the porous reinforced structure 100 may include a porous plastic foaming body, and a metal layer (or an alloy layer) conformally covering the surface of the porous plastic foaming body, such as a porous plastic material plated by a nickel layer.

In addition, as shown in FIG. 2, in this embodiment, the porous reinforced structure 100 has a foamed structure. Furthermore, the porous reinforced structure 100 can be a porous material manufactured by powder metallurgy, hot extrusion, molten metal, electroplating, electrochemical deposition or casting, and has a plurality of openings 100h. In this embodiment, the average pore diameter (or the aperture) of the opening 100h of the porous reinforced structure 100 can range from 50 μm to 500 μm. Furthermore, at least 90% of the openings 100h have pore diameters ranging from 50 μm to 500 μm. Since the shape of the opening 100h is not necessarily circular, in the present disclosure, the pore diameter of the openings 100h refers to the average value of the largest diameter and the smallest diameter of each opening 100h. In addition, the average pore diameter refers to the average number of the pore diameters of all openings 100h.

It should be noted that, in one embodiment, a part of the openings 100h can communicate with each other to form at least one channel. The channel may extend from the outer surface of the porous reinforced structure 100 to the interior of the porous reinforced structure 100, but the present disclosure does not limit the number and the location of the channel. Accordingly, in one embodiment, the porosity of the porous reinforced structure 100 can range from 40% to 97%, preferably from 50% to 70%. However, the porous reinforced structure 100 of the present disclosure is not limited to the above-mentioned structure.

Referring to FIG. 2 again, the filling material 101 covers the porous reinforced structure 100 and fills into the interior of the porous reinforced structure 100. It should be noted that, in this embodiment, the filling material 101 can cover the outer surface of the porous reinforced structure 100, but the present disclosure is not limited thereto. Metal contamination of the wafer caused by the conditioning assembly 1A can be avoided by covering the surface of the porous reinforced structure 100 with the filling material 101.

In addition, at least a part of the openings 100h of the porous reinforced structure 100 is filled with the filling material 101. Furthermore, most of the openings 100h can be filled with the filling material 101, but not all the openings 100h can be filled with the filling material 101 due to process limitation. In one embodiment, the material of the filling material 101 can be an acid and alkali resistant polymer, such as epoxy resin, polymethyl methacrylate (PMMA), polyimide (PI) resin, polyurethane (PU) resin, phenolic resin (i.e., bakelite) or polytetrafluoroethylene (PTFE).

It should be noted that, compared with the prior conditioner that only uses resin to fix the abrasive grains, in the conditioning assembly 1A of the present disclosure, the composite substrate 10 formed by combining the porous reinforced structure 100 and the filling material 101 has a larger mechanical strength. That is to say, by using the porous reinforced structure 100 to reinforce the strength of the composite substrate 10, the conditioning assembly 1A provided by the present disclosure not only does not cause metal contamination to the wafer during use, but also is not easily cracked due to aging or hardening.

In one embodiment, the total thickness of the composite substrate 10 can range from 0.1 mm to 20 mm. Furthermore, when the thickness of the composite substrate 10 is large enough to have sufficient mechanical strength, the composite substrate 10 does not need to be disposed on a rigid base or a carrier. However, when the thickness of the composite substrate 10 is small, the composite substrate 10 can then be assembled on the rigid base or the carrier. Accordingly, when the composite substrate 10 is used with the base or the carrier, the thickness of the composite substrate 10 can range from 0.1 mm to 10 mm.

Referring to FIG. 1, the dressing part 11 is combined with the composite substrate 10. In one embodiment, the dressing part 11 includes a plurality of abrasive grains or at least one blade. In this embodiment, the dressing part 11 includes a plurality of abrasive grains 110 (or grinding particles), but the present disclosure is not limited thereto. Each dressing particle 110 is partially embedded into the composite substrate 10 and protrudes from the upper surface 10S of the composite substrate 10. Furthermore, a part of each dressing particle 110 is embedded into the porous reinforced structure 100, and is combined and fixed with the porous reinforced structure 100 through the filling material 101. It should be noted that the size of the abrasive grains 110 as shown in FIG. 1 is for illustrative purposes only and is not the actual size.

Referring to FIG. 1, in one embodiment, the embedded depth d1 of the abrasive grains 110 in the composite substrate 10 and the maximum particle size d2 of the abrasive grains 110 satisfy the following relationship: (⅓)×d2<d1<(¾)×d2. In a preferred embodiment, at least ⅓ of the volume of the abrasive grains 110 is embedded into the composite substrate 10 to prevent the abrasive grains 110 from falling off (or peeling off). In addition, at least ¼ of the volume of the abrasive grains 110 is exposed outside the composite substrate 10. The exposed portion of the abrasive grains 110 is exposed outside the composite substrate 10 to form a cutting tip 11t of the dressing part 11, and the vertical height difference between any two cutting tips 11t does not exceed 20 μm. The abrasive grains 110 may include diamond, CVD diamond, adamas (indian stone), cubic boron nitride (cBN) particles, silicon carbide particles, or any combination thereof.

Since the material of the filling material 101 is mostly lipophilic and can have a strong affinity with the dressing part 11, the dressing part 11 can be fixed in the porous reinforced structure 100. It should be noted that the abrasive grains 110 are fixed by electroplating, so that the abrasive grains 110 are more likely to fall off due to missing electroplating when dressing the polishing pad, thereby reducing the reliability of the product. Compared with the method of fixing the abrasive grains by electroplating, in the embodiment of the present disclosure, the filling material 101 is used to strengthen the fixing of the abrasive grains 110, which can reduce the probability of the abrasive grains 110 falling off, thereby improving the reliability of the product.

It is worth mentioning that the structure of the porous reinforced structure 100 of the present disclosure is not limited to the embodiment as shown in FIG. 2. Referring to FIG. 3 to FIG. 5, which show partial schematic enlarged views of the conditioning assembly according to different embodiments of the present disclosure, respectively. In the embodiment as shown in FIG. 3, the porous reinforced structure 100 may also have a fibrous structure. That is to say, the porous reinforced structure 100 includes a plurality of fibers which are stacked in a staggered manner, the fibers are matched with each other to define a plurality of openings 100h, and the openings 100h can communicate with each other to form a channel.

Referring to FIG. 4, in another embodiment, the porous reinforced structure 100 may have a mesh structure. When the porous reinforced structure 100 has a mesh structure, such as a plain mesh, a twilled mesh, a dutch mesh, or a dutch twilled mesh, which is not limited in the present disclosure. In this embodiment, the filling material 101 can be filled in the meshes of the mesh structure.

Referring to FIG. 5, the porous reinforced structure 100 may have a fin structure. In this embodiment, the porous reinforced structure 100 may include a bottom plate 100a and a plurality of fins 100f protruding from one side of the bottom plate 100a. In different embodiments, each of the fins 100f can be shaped as a sheet shape or a column shape, which is not limited in the present disclosure. That is to say, as long as a part of the openings 100h of the porous reinforced structure 100 can communicate with each other to form at least one channel to connect the inner openings 100h of the porous reinforced structure 100 with the external space, the present disclosure does not limit the porous reinforced structure 100.

Referring to FIG. 6 and FIG. 7, which are partial schematic cross-sectional view and partial enlarged view of the conditioning assembly according to the second embodiment of the present disclosure, respectively. The same components of the conditioning assembly 1B of the present embodiment and the conditioning assembly 1A of the first embodiment have the same reference numerals, and the same parts will not be repeated. As shown in FIG. 6, in the conditioning assembly 1B of the present embodiment, the dressing part 11 further includes a corrosion-resistant coating layer 111, and the corrosion-resistant coating layer 111 at least covers the upper surface 10S of the composite substrate 10. In this embodiment, the corrosion-resistant coating layer 111 only covers the upper surface 10S of the composite substrate 10 and does not cover the abrasive grains 110, but the present disclosure is not limited thereto. In another embodiment, the corrosion-resistant coating layer 111 conformally covers the surface of the abrasive grains 110 and the upper surface 10S of the composite substrate 10.

The material of the corrosion-resistant coating layer 111 may include Teflon©, metal, alloy, diamond-like carbon (DLC), oxide, carbide, nitride or any combination thereof. The metal or alloy is, for example, nickel, titanium, tungsten, chromium, palladium, tantalum, molybdenum, or alloys thereof or any combination thereof. The corrosion-resistant coating layer 111 can be formed by a wet or dry film-forming method. In one embodiment, the corrosion-resistant coating layer 111 can be formed by electroplating, and the electroplating material is mainly nickel-phosphorus, and Teflon©, silicon carbide or diamond can be selectively added to obtain the corrosion-resistant coating layer 111 with anti-corrosion and wear-resistant function, but the present disclosure is not limited thereto. Other ways of forming the corrosion-resistant coating layer 111 can be further described later, and will not be repeated here.

Referring to FIG. 7 again, when the corrosion-resistant coating layer 111 is formed by electroplating, the filling material 101 may include a plurality of conductive particles p1 dispersed therein to facilitate the formation of the corrosion-resistant coating layer 111 on the composite substrate 10. In detail, the filling material 101 may include a polymer matrix and a plurality of conductive particles p1 dispersed in the polymer matrix. The material of the conductive particles p1 is, for example, metal powder or graphite, which is not limited in the present disclosure.

Referring to FIG. 8, which is a partial schematic cross-sectional view of the conditioning assembly according to the third embodiment of the present disclosure. The same components of the conditioning assembly 1C of the present embodiment and the conditioning assembly 1B of the second embodiment have the same reference numerals, and the same parts will not be repeated. As shown in FIG. 8, in the conditioning assembly 1C of the present embodiment, the corrosion-resistant coating layer 111 conformally covers the upper surface 10S of the composite substrate 10 and the abrasive grains 110.

In addition, the conditioning assembly 1C of this embodiment further includes a carrier 12. The material of the carrier 12 can be metal, ceramic, polymer material or composite material, such as stainless steel, alumina (or aluminium oxide) or zirconia (or zirconium oxide), but the present disclosure is not limited thereto. Referring to FIG. 9, which is a schematic enlarged view of part IX of FIG. 8. The carrier 12 has a joint surface 12S (or a bonding surface), and the composite substrate 10 is fixed on the joint surface 12S of the carrier 12. In this embodiment, the joint surface 12S is a rough structured surface. In this way, the bonding strength between the filling material 101 and the carrier 12 can be increased, but the present disclosure is not limited thereto. In another embodiment, the joint surface 12S may also be a flat surface.

In the embodiment as shown in FIG. 9, the joint surface 12S of the carrier 12 has a zigzag structure, but the present disclosure is not limited thereto. Referring to FIG. 10, in another embodiment, the joint surface 12S of the carrier 12 may also have an irregular-shaped concave-convex structure. Referring to FIG. 11, in another embodiment, the joint surface 12S of the carrier 12 may also have a concave structure.

Referring to FIG. 12, which is a partial schematic cross-sectional view of the conditioning assembly according to the fourth embodiment of the present disclosure. The same components of the conditioning assembly 1D of the present embodiment and the conditioning assembly 1C of the third embodiment have the same reference numerals, and the same parts will not be repeated.

In the conditioning assembly 1D of the present embodiment, the carrier 12 has a positioning structure 120 disposed on the joint surface 12S, and the composite substrate 10 is combined with the carrier 12 through the positioning structure 120. The positioning structure 120 can be a groove, an engaging portion, a convex column, a stepped structure, a zigzag structure (or sawtooth structure) or any combination thereof located on the joint surface 12S. As long as the shear strength of the composite substrate 10 can be increased (that is to say, the bonding force between the composite substrate 10 and the carrier 12 can be increased), the present disclosure does not limit the shape of the positioning structure 120.

In this embodiment, the positioning structure 120 is a groove, and defines an accommodating space for accommodating the composite substrate 10, but the present disclosure is not limited thereto. The height H1 of the positioning structure 120 relative to the joint surface 12S can be smaller than the thickness T of the composite substrate 10. That is to say, the top side of the positioning structure 120 is lower than the upper surface 10S of the composite substrate 10. Accordingly, when the composite substrate 10 is disposed in the accommodating space that is defined by the positioning structure 120, the upper surface 10S of the composite substrate 10 and the dressing part 11 can protrude from the top side of the positioning structure 120 of the carrier 12. It should be noted that although the carrier 12 of the embodiment has the positioning structure 120, the composite substrate 10 can be further fixed on the carrier 12 by other fixing methods. For example, the composite substrate 10 can be fixed on the carrier 12 by means of sintering, welding, gluing, mechanical clamping, screws, or the like.

By disposing the positioning structure 120 on the joint surface 12S, the joint area between the composite substrate 10 and the carrier 12 can be increased, and the composite substrate 10 can be prevented from sliding laterally relative to the carrier 12 when the composite substrate 10 is subjected to shear stress. That is to say, compared with the conditioning assembly 1C of the third embodiment, in the conditioning assembly 1D of the present embodiment, both the side surface and the bottom surface of the composite substrate 10 can be connected to the carrier 12 so as to obtain a higher bond strength between the composite substrate 10 and the carrier 12. In addition, in this embodiment, the joint surface 12S can be a flat surface or a rough structured surface, which is not limited in the present disclosure.

It should be noted that the conditioning assemblies 1A-1D provided by the present disclosure can be used alone or assembled on another base. Referring to FIG. 13, which is a schematic top view of the assembled conditioner according to an embodiment of the present disclosure.

The assembled conditioner M1 (or the assembled conditioner) includes a base M10 and a plurality of conditioning assemblies M11. The base M10 has an assembly side. The material constituting the base M10 can be stainless steel, die steel, metal alloy, ceramic, polymer or composite material. In this embodiment, the top view shape of the base M10 is circular, but the present disclosure is not limited thereto.

The conditioning assembly M11 may select any one or more of the conditioning assemblies 1A-1D of the first to fourth embodiments. In addition, the conditioning assemblies M11 are distributed on the base M10. In this embodiment, the conditioning assemblies M11 are arranged around the center of the base M10. However, in another embodiment, the conditioning assemblies M11 may also be arranged on the base M10 in a matrix. Each conditioning assembly M11 is disposed on the base M10 in such a manner that the dressing part faces upwardly.

It should be noted that, FIG. 13 has simplified the detailed structure of each conditioning assembly M11, and only illustrates the arrangement of the conditioning assemblies M11 on the base M10. For the method of disposing the conditioning assemblies M11 on the base M10 and the variation of the embodiment, the contents disclosed in the published patent of the Republic of China (Patent No. 1647070) can be provided for reference. It will not be described in detail in the present disclosure.

Referring to FIG. 14, which is a flowchart of a manufacturing method of the conditioning assembly according to an embodiment of the present disclosure. The manufacturing method shown in FIG. 14 can be used to manufacture the aforementioned conditioning assemblies 1A-1D or variations thereof. In the step S1, a dressing part is embedded into an uncured composite substrate. In the step S2, the filling resin material is cured to form a composite substrate and fix the dressing part. In the step S3, a corrosion-resistant coating layer is formed.

Referring to FIG. 15, which is a flowchart of the steps of embedding the dressing part in the uncured composite substrate. In the step S11, a porous reinforced structure is provided. In the step S13, the dressing part is embedded into the porous reinforced structure, and the horizontal height positions (or the level positions) of the cutting tips of the dressing part are adjusted. In the step S15, the filling resin material is provided, so that the filling resin material can wrap and penetrate into the porous reinforced structure.

Referring to FIG. 16, the porous reinforced structure 100 has a first surface S1 and a second surface S2 opposite to the first surface S1. In one embodiment, the thickness of the porous reinforced structure 100 can range from 0.1 mm to 20 mm. The porous reinforced structure 100 can be a porous material manufactured by powder metallurgy, hot extrusion, molten metal, electroplating, electrochemical deposition, or casting. As mentioned above, the porous reinforced structure 100 has a plurality of openings 100h, and some of the openings 100h can communicate with each other to form at least one channel. The channel may extend from the outer surface of the porous reinforced structure 100 to the interior of the porous reinforced structure 100, but the present disclosure does not limit the number and the location of the channel.

Referring to FIG. 15 and FIG. 16, the dressing part 11 of this embodiment includes a plurality of abrasive grains 110 to form a plurality of cutting tips 11t, respectively. As shown in FIG. 16, the abrasive grains 110 are embedded into the porous reinforced structure 100.

Specifically, the abrasive grains 110 can be pressed into the porous reinforced structure 100 and embedded into the first surface S1 by applying pressure to the abrasive grains 110. The porous reinforced structure 100 may have a mesh structure, a foamed structure, a fiber structure or a fin structure. Accordingly, when the abrasive grains 110 are pressed, a plurality of local areas of the first surface S1 of the porous reinforced structure 100 are also pressed to be concave and plastically deformed, so that the abrasive grains 110 can be embedded into the first surface S1 of the porous reinforced structure 100. In another embodiment, when the pore size of the openings (not shown in FIG. 16) of the porous reinforced structure 100 is large enough, the abrasive grains 110 can also be embedded into the openings of the porous reinforced structure 100.

In one embodiment, the pressure mechanism and the flat plate B1 can be used to apply pressure to the abrasive grains 110, and to adjust the horizontal height positions of the cutting tips 11t of the dressing part 11, so that the vertical height difference between any two cutting tips lit does not exceed 20 μm. However, at this time, the vertical height positions of the cutting tips lit of the abrasive grains 110 have not yet been fixed.

Referring to FIG. 15 and FIG. 17, FIG. 17 is a schematic view of the step S15 of the manufacturing method of the conditioning assembly of the present disclosure. The filling resin material 101A is provided, so that the filling resin material 101A covers the porous reinforced structure 100 and penetrates into the porous reinforced structure 100. In one embodiment, the porous reinforced structure 100 can be contained in the container CA in advance, and then the filling resin material 101A can be injected into the container CA. It should be noted that the container CA can be an open container or a closed container.

It should be noted that, since the porous reinforced structure 100 has a plurality of openings 100h connected to each other, when the filling resin material 101A is injected into the container CA, the filling resin material 101A can penetrate into the openings 100h through capillary force, and flow into the interior of the porous reinforced structure 100. In one embodiment, when injecting the filling resin material 101A, the container CA can be evacuated (pumped) to assist the filling resin material 101A to penetrate into most of the openings 100h in the porous reinforced structure 100. In addition, as shown in FIG. 17, the liquid level LS of the filling resin material 101A is higher than the first surface S1 of the porous reinforced structure 100 so as to contact the embedded portion of the abrasive grains 110. In this way, after the filling resin material 101A is cured to form the filling material 101, the abrasive grains 110 can be fixed, and the first surface S1 of the porous reinforced structure 100 can be covered.

It is worth mentioning that, when the porosity of the porous reinforced structure 100 is too low, the filling resin material 101A cannot easily penetrate into the porous reinforced structure 100 during the manufacture of the composite substrate 10. When the porosity of the porous reinforced structure 100 is too high, the pore size of the openings 100h located on the first surface S1 may be too large, so that the abrasive grains 110 are not easily held on the first surface S1 of the porous reinforced structure 100 and easily fall into the porous reinforced structure 100. Accordingly, for the method provided in this embodiment, the porosity of the porous reinforced structure 100 ranges from 50% to 70%, so that the filling resin material 101A can relatively easily penetrate into the porous reinforced structure 100, and it is also convenient for the abrasive grains 110 to be held on the first surface S1 of the porous reinforced structure 100.

The material of the filling resin material 101A can be epoxy resin, polymethyl methacrylate (PMMA), polyimide (PI) resin, polyurethane (PU) resin, phenolic resin (i.e., bakelite) or polytetrafluoroethylene (PTFE), but the present disclosure is not limited thereto.

As shown in FIG. 17, since the height positions of the abrasive grains 110 have not yet been fixed, when the filling resin material 101A covers and penetrates into the porous reinforced structure 100, a predetermined pressure is still applied to the abrasive grains 110 through the flat plate B1. In this way, the cutting tips 11t of the dressing part 11 can be maintained at a predetermined level, and the vertical height difference between any two cutting tips 11t can be prevented from increasing due to the flow of the filling resin material 101A.

In addition, it should be noted that the order of the step S13 and step S15 in FIG. 15 can be reversed. Referring to FIG. 18, before disposing the dressing part 11 on the porous reinforced structure 100, the filling resin material 101A covers the porous reinforced structure 100 and penetrates into the porous reinforced structure 100. In this embodiment, the liquid level LS of the filling resin material 101A is higher than the first surface S1 of the porous reinforced structure 100. The filling resin material 101A can penetrate into the porous reinforced structure 100 due to capillary phenomenon.

Referring to FIG. 19, the dressing part 11 is embedded into the porous reinforced structure 100, and the horizontal height positions of the cutting tips 11t of the dressing part 11 are adjusted. Similar to the previous embodiment, the abrasive grains 110 can be pressed into the porous reinforced structure 100 and embedded into the first surface S1 by applying pressure to the abrasive grains 110, or the abrasive grains 110 can be respectively clamped in the openings of the porous reinforced structure 100. After that, the pressure mechanism and the flat plate B1 are used to adjust the horizontal height positions of the cutting tips 11t of the dressing part 11, so that the vertical height difference between any two cutting tips 11t does not exceed 20 μm.

Referring to the step S2 of FIG. 14, and FIG. 20, after the steps shown in FIG. 17 or FIG. 19, the filling resin material 101A is cured to form the composite substrate 10 as shown in FIG. 1. At the same time, the abrasive grains 110 of the dressing part 11 may also be fixed on the composite substrate 10. By performing the above-mentioned steps, the conditioning assembly 1A of the first embodiment of the present disclosure can be fabricated.

Referring to FIG. 14 and FIG. 21, in the step S3, a corrosion-resistant coating layer 111 can be formed on the composite substrate 10. The method of forming the corrosion-resistant coating layer 111 can be formed by a wet or dry film-forming method. The wet film-forming method is, for example, but not limited to, electroplating, dipping coating, sol-gel, and the like. The dry film-forming method, for example, but not limited to, physical vapor deposition (PVD), chemical vapor deposition (CVD), pulsed laser deposition (PLD), atomic layer deposition (ALD), and the like.

In the embodiment as shown in FIG. 21, the corrosion-resistant coating layer 111 conformally covers the upper surface 10S of the composite substrate 10 and the surface of the abrasive grains 110, so that the conditioning assembly 1E according to another embodiment of the present disclosure can be fabricated. However, the corrosion-resistant coating layer 111 may only cover the upper surface 10S of the composite substrate 10 without covering the abrasive grains 110, so that the conditioning assembly 1B according to the second embodiment of the present disclosure can be fabricated. Furthermore, the corrosion-resistant coating layer 111 covering the abrasive grains 110 and the upper surface 10S can be formed in advance, and then a part covering the abrasive grains 110 can be removed by polishing, so that the corrosion-resistant coating layer 111 only covers the upper surface 10S of the composite substrate 10.

Referring to FIG. 22, the manufacturing method of the conditioning assembly according to the embodiment of the present disclosure may further include fixing the composite substrate 10 on the carrier 12. The material of the carrier 12 can be metal, ceramic, polymer or composite material, such as stainless steel, alumina or zirconia, but the present disclosure is not limited thereto. The carrier 12 has a joint surface 12S, and the composite substrate 10 is fixed on the joint surface 12S of the carrier 12. In one embodiment, the joint surface 12S can be a rough structured surface to increase the bonding strength between the composite substrate 10 and the carrier 12. In another embodiment, the joint surface 12S may also be a flat surface.

In yet another embodiment, the carrier 12 may also have a positioning structure 120 (referring to FIG. 12). The composite substrate 10 can be assembled on the carrier 12 by the positioning structure 120. By performing the above-mentioned steps, the conditioning assembly 1D of the fourth embodiment of the present disclosure can be fabricated.

It should be noted that, in the manufacturing method provided by the present disclosure, the composite substrate 10 can also be fixed on the carrier 12 in advance, and then the corrosion-resistant coating layer 111 can be formed. It should be noted that, in the manufacturing method of the conditioning assembly according to the embodiment of the present disclosure, the step of forming the corrosion-resistant coating layer (the step S3) and the step of fixing the composite substrate 10 to the carrier 12 are optional steps, and one of them can be selected, or both can be omitted.

Referring to FIG. 23, the step (S1) of embedding the dressing part in the uncured composite substrate may further include: in the step S12, fixing the porous reinforced structure on a carrier. After the step S12, the step S13 and the step S15 can be executed.

Referring to FIG. 24 and FIG. 25, the porous reinforced structure 100 is fixed on the carrier 12. The porous reinforced structure 100 can be combined with the carrier 12 by means of sintering, welding, gluing, mechanical clamping, etc., which is not limited in the present disclosure. In addition, the porous reinforced structure 100 is provided in such a manner that the second surface S2 faces the carrier 12.

Referring to the step S13 of FIG. 23, and FIG. 24, the abrasive grains 110 are embedded into the porous reinforced structure 100. As described above, by applying pressure to the abrasive grains 110, the abrasive grains 110 can be pressed into the porous reinforced structure 100 and embedded into the first surface S1. In one embodiment, the pressure mechanism and the flat plate B1 can be used to apply pressure to the abrasive grains 110, and to adjust the horizontal height positions of the cutting tips 11t of the dressing part 11, so that the vertical height difference between any two cutting tips 11t does not exceed 20 μm.

Referring to the step S15 of FIG. 23, and FIG. 26, the filling resin material 101A covers the porous reinforced structure 100 and the carrier 12, and the filling resin material 101A penetrates into the porous reinforced structure 100. In one embodiment, both the porous reinforced structure 100 and the carrier 12 can be placed into the container CA, and then the filling resin material 101A can be poured into the container CA. It is worth mentioning that the first surface S1 of the porous reinforced structure 100 is lower than the liquid level LS of the filling resin material 101A. In this way, after the filling resin material 101A is cured to form the filling material 101, the abrasive grains 110 can be fixed, and the first surface S1 of the porous reinforced structure 100 can be covered. In this way, the present disclosure can avoid metal contamination on the wafer during use.

In this embodiment, when the porous reinforced structure 100 is soaked in the filling resin material 101A, a pressure is still applied to the abrasive grains 110 through the flat plate B1. In this way, the cutting tips 11t of the dressing part 11 can be maintained at a predetermined level, and the vertical height difference between any two cutting tips 11t can be prevented from increasing due to the flow of the filling resin material 101A.

It should be noted that the order of the step S12 and step S13 as shown in FIG. 23 can be reversed. That is to say, the dressing part 11 is embedded into the porous reinforced structure 100, the horizontal height positions of the cutting tips 11t of the dressing part 11 are adjusted, and then the porous reinforcing structure 100 is fixed on the carrier 12. Afterwards, the porous reinforced structure 100 and the carrier 12 are covered with the filling resin material 101A. In the manufacturing method of another embodiment, after the step S12 is performed, the order of the step S13 and the step S15 as shown in FIG. 25 can also be reversed. That is to say, the porous reinforced structure 100 and the carrier 12 are covered with the filling resin material 101A, and then the dressing part 11 is arranged on the porous reinforced structure 100.

Referring to FIG. 27, the filling resin material 101A is cured to form the composite substrate 10, and the composite substrate 10 has been fixed on the carrier 12. In addition, after the filling resin material 101A is cured, the height positions of the abrasive grains 110 of the dressing part 11 can also be fixed.

Referring to FIG. 28 to FIG. 30, FIG. 28 and FIG. 29 are respectively a partial cross-sectional photomicrograph and a partial top photomicrograph of the conditioning assembly according to an embodiment of the present disclosure, and FIG. 30 is a photomicrograph of the conditioning assembly according to an embodiment of the present disclosure when the filler material is not filled with the porous reinforced structure. The photomicrographs of FIG. 28 and FIG. 30 are photographs taken by a digital microscope (model VHX-2000W) of Keyence company at 50× magnification, and the photomicrograph of FIG. 29 is a photograph taken by the above-mentioned digital microscope at 100× magnification. After the conditioning assembly is fabricated, the cross section is ground and then photographed, and the image shown in FIG. 28 can be obtained.

Referring to FIG. 28 and FIG. 30, both the porous reinforced structure 100 and the filling material 101 are disposed on the carrier 12. It can be seen from FIG. 30 that the porous reinforced structure 100 itself has a plurality of openings 100h communicated with each other. In addition, as shown in FIG. 28, after the porous reinforced structure 100 is filled with the filling material 101, the filling material 101 covers the porous reinforced structure 100 and fills up the openings 100h to form the composite substrate 10 having a strong mechanical strength.

In addition, referring to FIG. 29 and FIG. 30, the filling material 101 covers the surface of the porous reinforced structure 100, and the abrasive grains 110 are embedded into the filling material 101 and are fixed in the filling material 101. As shown in FIG. 29, since the surface of the porous reinforced structure 100 has a plurality of openings 100h, after the filling material 101 covers the porous reinforced structure 100, the surface of the filling material 101 will also be uneven. However, in other embodiments, the filling material 101 also has a planarized surface, which is not limited in the present disclosure.

Beneficial Effects of the Embodiments

Therefore, in the conditioning assembly, the method for manufacturing the same, and the assembled conditioner using the same provided by the present disclosure, by virtue of “the composite substrate 10 including a porous reinforced structure 100 and a filling material 101” and “the filling material 101 covering the porous reinforced structure 100 and filling into the porous reinforced structure 100,” the conditioning assembly 1A-1E and the assembled conditioner M1 provided by the present disclosure can have higher durability and service life. In addition, in the manufacturing method of the conditioning assembly 1A-1E provided by the present disclosure, the manufacturing temperature is relatively low, so that the manufacturing cost can be reduced, and the environmental pollution can be avoided.

Furthermore, compared with the prior conditioner, the dressing parts 11 are fixed on the composite substrate 10 of the dressing assemblies 1A-1E of the present disclosure by embedding and gluing, so that the composite substrate 10 and the dressing part 11 have greater bond strength. Therefore, when the dressing assemblies 1A-1E are in use, the abrasive grains 110 of the dressing part 11 are not easy to fall off and have high reliability. In addition, by using the porous reinforced structure 100, the filling material 101 can be filled into the porous reinforced structure 100, and the composite substrate 10 has greater mechanical strength and rigidity. In addition, in the conditioning assemblies (1A, 1D) provided by the present disclosure, the first surface S1 of the porous reinforced structure 100 can be covered by the filling material 101, so that when the conditioning assemblies (1A, 1D) are used, the porous reinforced structure 100 does not cause metal contamination to the wafer.

The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.

The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments can become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.

Claims

1. A conditioning assembly, comprising:

a composite substrate including a porous reinforced structure and a filling material, wherein the filling material covers the porous reinforced structure and fills into the porous reinforced structure; and

a dressing part combined with the composite substrate.

2. The conditioning assembly according to claim 1, wherein a material constituting the porous reinforced structure is different from a material constituting the filling material, and the material constituting the porous reinforced structure is metal, glass fiber, carbon fiber, polymer or any combination thereof.

3. The conditioning assembly according to claim 1, wherein a material constituting the porous reinforced structure is nickel, iron, tungsten, copper, silver, magnesium, aluminum, titanium, nickel alloy, iron alloy, tungsten alloy, copper alloy, silver alloy, magnesium alloy, aluminum alloy, titanium alloy or stainless steel.

4. The conditioning assembly according to claim 1, wherein a porosity of the porous reinforced structure ranges from 40% to 97%, the porous reinforced structure includes a plurality of openings, and an average pore diameter of the openings ranges from 50 μm to 500 μm.

5. The conditioning assembly according to claim 1, wherein the porous reinforced structure has a mesh structure, a foamed structure, a fiber structure or a fin structure.

6. The conditioning assembly according to claim 1, further comprising: a carrier, wherein the composite substrate is fixed on a joint surface of the carrier.

7. The conditioning assembly according to claim 6, wherein the carrier has a positioning structure, and the composite substrate is combined with the carrier through the positioning structure.

8. The conditioning assembly according to claim 1, wherein the dressing part includes a plurality of abrasive grains, and each of the abrasive grains is partially embedded into the composite substrate and protrudes from an upper surface of the composite substrate.

9. The conditioning assembly according to claim 1, wherein the dressing part further includes a corrosion-resistant coating layer, and the corrosion-resistant coating layer at least covers an upper surface of the composite substrate.

10. The conditioning assembly according to claim 1, wherein the filling material includes a plurality of conductive particles dispersed therein.

11. An assembled conditioner, comprising:

a base; and

a conditioning assembly disposed on the base;

wherein the conditioning assembly includes: a composite substrate including a porous reinforced structure and a filling material, wherein the filling material covers the porous reinforced structure and fills into the porous reinforced structure; and a dressing part combined with the composite substrate.

12. A method for manufacturing a conditioning assembly, comprising:

embedding a dressing part into an uncured composite substrate, wherein the uncured composite substrate includes a porous reinforced structure and a filling resin material, and the filling resin material wraps the porous reinforced structure and penetrates into the porous reinforced structure; and

curing the filling resin material to form a composite substrate and fix the dressing part.

13. The method for manufacturing the conditioning assembly according to claim 12, wherein the step of embedding the dressing part into the uncured composite substrate further includes:

providing the porous reinforced structure, wherein the porous reinforced structure has a first surface and a second surface opposite the first surface;

embedding the dressing part into the porous reinforced structure, and adjusting horizontal height positions of a plurality of cutting tips of the dressing part, wherein the cutting tips protrude from the uncured composite substrate, and a vertical height difference between any two of the cutting tips does not exceed 20 μm; and

providing the filling resin material to cover the porous reinforced structure and penetrate into the porous reinforced structure, wherein the first surface of the porous reinforced structure is lower than a liquid level of the filling resin material.

14. The method for manufacturing the conditioning assembly according to claim 13, wherein after the step of providing the filling resin material to cover the porous reinforced structure and penetrate into the porous reinforced structure, embedding the dressing part into the porous reinforced structure.

15. The method for manufacturing the conditioning assembly according to claim 13, wherein the step of embedding the dressing part into the uncured composite substrate further includes: fixing the porous reinforced structure on a carrier, wherein the porous reinforced structure is provided in such a manner that the second surface faces the carrier.

16. The method for manufacturing the conditioning assembly according to claim 12, further comprising: after the step of curing the filling resin material, forming a corrosion-resistant coating layer.

17. The method for manufacturing the conditioning assembly according to claim 12, wherein the filling resin material contains a plurality of conductive particles dispersed therein.

18. The method for manufacturing the conditioning assembly according to claim 12, further comprising: fixing the composite substrate on a carrier.