APPARATUS FOR JEWELRY SURFACE PROCESSING

An apparatus for jewelry surface processing characterized by a frame supported by a platform, of which one side is equipped with various solution containers for jewelry surface processing, further featuring a movable carbon brush capable of approaching the solution containers. The platform comprises an electroplating container station, a rinsing container station, a drying nozzle, a polishing station and an ultrasonic cleaner. A moving mechanism is mounted on the platform with a clamping mechanism that can rotate relative to the moving mechanism, allowing the clamping mechanism to shuttle between the various surface processing solution containers and the various surface processing stations.

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Description
FIELD

The present invention relates to jewelry processing equipment, and more particularly to an automatic apparatus for cleaning, polishing, and electroplating jewelry.

BACKGROUND

The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.

Jewelry surface treatment is primarily divided into mechanical and electrochemical processes. Mechanical treatment primarily uses mechanical tools to grind, polish, and sandblast jewelry to achieve the desired craftsmanship and effects. Electrochemical treatment, on the other hand, uses electrochemical methods to clean, passivate, and provide protective treatment to metal surfaces, making it especially useful for intricate jewelry designs and hard-to-reach areas.

Currently, in the jewelry industry, electrochemical treatment is mostly applied in electroplating. After grinding and polishing, jewelry undergoes pre-treatment followed by electroplating to achieve a bright, stunning finish. Existing jewelry surface treatment equipment typically consists of separate polishing and electroplating machines, requiring manual transfer from one machine to another, which complicates operation and necessitates extensive manual intervention, thus reducing processing efficiency.

SUMMARY

The objective of this invention is to provide an integrated machine capable of automatically cleaning, polishing, and electroplating jewelry, thereby addressing existing technical issues.

The technical solution for solving this problem is as follows:

The solution involves an apparatus mounted on a frame that features various modules for cleaning, electrolysis, activation, polishing, drying, and electroplating. The jewelry is held by a clamping mechanism, guided by a movable platform, allows for sequential processing at each station and module. This apparatus allows continuous surface treatment operations (cleaning, polishing, and electroplating) within a single unit, significantly reducing manual intervention and enhancing processing efficiency.

Further areas of applicability of the present disclosure will become apparent from the detailed description provided hereinafter. It should be understood that the detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

FIG. 1: A schematic diagram of the three-dimensional structure of the present invention Apparatus for Jewelry Surface Processing;

FIG. 2: A top view of the present invention;

FIG. 3: A schematic diagram of the structure on the platform plate after removing the moving mechanism;

FIG. 4: A schematic diagram of the structure of the moving mechanism;

FIG. 5: An enlarged view of the cross-sectional view along line A-A in FIG. 2;

FIG. 6: An enlarged view of the cross-sectional view along line B-B in FIG. 2, rotated 90 degrees clockwise;

FIG. 7: A schematic diagram showing push rod configuration on the moving base in the second design option of clamping mechanism structure;

FIG. 8: A schematic diagram showing the configuration of the placement tray on the platform plate;

FIG. 9: A schematic diagram showing the carbon brush installed on the mounting plate;

FIG. 10: A cross-sectional schematic diagram of the mounting plate;

FIG. 11: A schematic diagram of the clamping mechanism structure;

FIG. 12: A simplified schematic of the structure forming a path during electroplating operations;

FIG. 13: A schematic diagram of the clamping mechanism structure in the second design option;

FIG. 14: A schematic diagram showing the state of a ring hanging on the clamping mechanism in FIG. 13;

FIG. 15: A schematic diagram showing the state of a bracelet hanging on the clamping mechanism in FIG. 13; and

FIG. 16: A schematic diagram showing the operation principle of the present invention.

Nomenclature 1 Frame 2 Platform 3 Initial Cleaning Solution Container 4 Electrolyte Container 5 Activation Solution Container 6 Electroplating Solution Container 7 Carbon Brush 8 Drying Pipe Nozzle 9 Ultrasonic Cleaning Machine 10 Cleaning Solution Container 11 Polishing Rotary Motor 12 Polishing Bowl 13 Control Screen 14 X-Axis Motor 15 Y-Axis Motor 16 Z-Axis Motor 17 Ball Screw 18 Lateral Guide Rail 19 Lateral Slide Base 20 Ball Nut 21 Timing Pulley 22 Timing Belt 23 Cross Slide Assembly 24 Jewelry Holder Rotary Motor 25 Flip Rod 26 Flip Plate 27 Solution Container Lid 28 First Tension Spring 29 Push Plate 30 Push Rod 31 Rolling Bearing 32 Placement Tray 33 Heating Plate 34 Container Holder Ring 35 Clamp 36 Mounting Plate 37 Guide Rail Base 38 Slider 39 Electromagnet 40 Vertical Support 41 Iron Block 42 Second Tension Spring 43 Height Adjustment Screw 44 First Nut 45 Second Nut 46 First Electric Conduction Pillar (i.e., First Copper Pillar) 47 Round Electric Conduction Plate 48 Universal Joint (i.e., Round Copper Plate) 49 Second Electric Conduction Pillar 50 Insulating Grease (i.e., Second Copper Pillar) 51 Hook 52 Guard Member 53 Torsion Spring 54 Conductive Mesh 55 Air Pump 56 Blow Pipe 57 Nonconductive Material Holder 58 Slot (i.e., Plastic Holder) 59 Electric Hook 60 Electroplating Container Station 61 Polishing Station 62 Moving Mechanism 63 Clamping Mechanism 64 Control System 65 Detection mechanism 66 Rinsing Container Station 100 Apparatus for Jewelry Surface Processing

DETAILED DESCRIPTION

The following description is merely exemplary in nature and is in no way intended to limit the disclosure, its application, or uses. For purposes of clarity, the same reference numbers with or without a single or multiple prime symbols appended thereto will be used in the drawings to identify similar elements. It should be understood that steps within a method may be executed in different order without altering the principles of the present disclosure unless otherwise specified.

Referring to FIG. 1, an apparatus for jewelry surface processing (100) is shown. This apparatus for jewelry surface processing as described in more details collectively in FIGS. 1-3 includes a frame (1), which serves as the structural foundation for the entire apparatus. A horizontally arranged platform (2) is installed on the frame (1), acting as the base for mounting various mechanisms.

On the front side of the platform (2), an initial cleaning solution container (3), electrolyte container (4), activation solution container (5), and several electroplating solution containers (6) are mounted on an electroplating container station (60). The initial cleaning solution container (3) is filled with a cleaning solution to perform preliminary cleaning of the jewelry before further processing. The electrolyte container (4) contains an electrolyte solution, which can perform electrolysis on the jewelry, removing impurities such as oil and other contaminants on the surface. The activation solution container (5) holds an activating agent, which serves to activate the surface of the jewelry, improving the subsequent electroplating process. The electroplating solution containers (6) are provided in multiple units, allowing the use of different electroplating solutions based on the specific plating requirements, thus facilitating electroplating treatment for the jewelry.

In addition to the electrolyte container (4), activation solution container (5), and electroplating solution containers (6), carbon brush (7) plays a crucial role in the electroplating process. A carbon brush (7) is mounted onto the mounting plate (36) of the platform (2), which can control the distance between the carbon brush and the jewelry or clamping mechanism. The carbon brush (7) helps establish an electrical circuit during processing, ensuring proper electroplating and other surface treatment operations.

On the rear side of the carbon brush (7), the platform (2) is equipped with rinsing container station (66), a drying pipe outlet (8), a polishing station (61), and an ultrasonic cleaning machine (9). The rinsing container station (66) consists of several cleaning solution containers (10), each containing liquids with progressively higher impurity concentrations, such as tap water, mineral water, and purified water, arranged in sequence. This setup satisfies varying cleaning requirements and enables stepwise cleaning of the jewelry to ensure no residual contaminants remain on the jewelry's surface. The polishing station (61) includes a first polishing rotary motor (11), with the output shaft of the motor connected to a polishing bowl (12), which contains polishing abrasives. When the jewelry is placed inside the polishing bowl (12), it undergoes the polishing operation.

To achieve the hanging and gripping of jewelry as well as its transfer between workstations, a moving mechanism (62), referring to FIG. 4 and FIG. 7, is also installed on the platform (2). The moving mechanism (62) is equipped with a clamping mechanism (63), referring to FIGS. 11, 13, 14, 15, capable of holding jewelry. The moving mechanism (62) can be a conventional rack-and-pinion mechanism, lead screw-nut mechanism, telescopic rod mechanism, and XYZ high-precision moving platform, capable of moving in three-axis directions to facilitate the transfer of jewelry between different mechanisms and workstations.

The clamping mechanism (63) can be a conventional gripper, clamp, or robotic arm, capable of holding jewelry for transport. Under the drive of the moving mechanism (62), the clamping mechanism (63) can grip the jewelry to be processed and move it accordingly. The clamping mechanism (63) can rotate relative to the moving mechanism (62), allowing the jewelry to rotate during cleaning, polishing, or electroplating operations, ensuring better contact between the jewelry's surface and the processing medium, thereby improving the surface treatment effectiveness.

When the clamping mechanism (63) moves the jewelry into the electroplating solution container (6), the carbon brush (7) moves closer to contact with the clamping mechanism (63), forming an electrical circuit between the jewelry and the electroplating liquid, thus enabling the electroplating process. A control screen (13) is installed at the front end of the frame (1). The control screen (13) is connected to the control system (64) and the components of each workstation via control circuits. By inputting different surface treatment parameters for jewelry using the control screen (13), the jewelry can be moved back and forth between the initial cleaning solution container (3), electrolyte container (4), activation solution container (5), electroplating solution containers (6), over the electroplating container station (60), drying pipe outlet (8), polishing station (61), and ultrasonic cleaning machine (9) under the guidance of the clamping (63) and moving (62) mechanisms, enabling cleaning, polishing, and electroplating processes.

The apparatus includes a detection mechanism (65), referring to FIG. 16, which requires at least four optoelectronic switches installed on the guide rails to determine the starting position of the moving mechanism. If an error occurs, the controller will operate the moving mechanism to return to the machine's designated starting position for that step. The apparatus also has a power supply that provides energy to the various components, along with other necessary elements.

To further achieve lateral, longitudinal, and vertical movement of jewelry between different processing stations, as shown in FIGS. 3, 4 and 5, the moving mechanism (62) includes X-axis motor (14), Y-axis motor (15), and Z-axis motor (16). Both sides of the platform (2) are equipped with ball screws (17) and lateral guide rails (18). A lateral slide base (19) is mounted on the lateral guide rails (18), with a ball nut (20) that meshes with the ball screw (17) installed inside the lateral slide base (19). The output shaft of the X-axis motor (14) is connected to one of the ball screws (17). When the X-axis motor (14) is activated, it drives the lateral slide base (19) to move laterally along the lateral guide rails (18).

To achieve synchronized movement of the two lateral slide bases (19), each end of the two ball screws (17) is equipped with a timing pulley (21). A timing belt (22) is installed between the two timing pulleys (21) to ensure synchronization. When the X-axis motor (14) operates, it drives both lateral slide bases (19) to move simultaneously.

A cross-slide assembly (23) is mounted on both lateral slide bases (19). The Y-axis motor (15) and Z-axis motor (16) provide the driving force for the longitudinal and vertical movement of the cross-slide assembly (23), respectively. A jewelry holder rotary motor (24) is installed on the slide of the cross-slide assembly (23), with the output shaft of the jewelry holder rotary motor (24) connected to the clamping mechanism (63). The installation of the jewelry holder rotary motor (24) allows the jewelry to rotate relative to the moving mechanism, thereby enabling more effective cleaning, polishing, and electroplating operations.

To achieve the sealing of the openings of the initial cleaning solution container (3), electrolyte container (4), activation solution container (5), and several electroplating solution containers (6), and to prevent solution volatilization when the cups are not in use, the initial cleaning solution container (3), electrolyte container (4), activation solution container (5), and several electroplating solution containers (6) are arranged side by side.

Referring to FIG. 6. a flip rod (25) is installed at the front end of the frame (1), with a flip plate (26) mounted on the flip rod (25). The inner side of the flip plate (26) is equipped with solution container lids (27) corresponding to the initial cleaning solution container (3), electrolyte container (4), activation solution container (5), and electroplating solution containers (6).

On both sides of the flip rods (25), push plates (29) are also installed, with a first tension spring (28) mounted between the push plate (29) and the frame (1). The first tension spring (28) constantly exerts a force that tends to rotate the solution container lids (27) away from the cup opening. A push rod (30) is installed on the lateral slide base (19), with a rolling bearing (31) mounted at the end of the push rod (30). The rolling bearing (31) is positioned to correspond with the push plate (29). When the lateral slide base (19) moves closer to the flip rod (25), the push rod (30) makes contact with the push plate (29) and drives the solution container lids (27) to rotate and seal the cup opening.

When the apparatus is in an unused state, the lateral slide base (19) is positioned close to the flip rod (25). The push rod (30) exerts a force on the push plate (29), causing the solution container lids (27) on the flip plate (26) to rotate and seal the cup opening, preventing volatilization of the internal solution. When the apparatus is needed for use, after the jewelry is mounted on the clamping mechanism (63) and the specified parameters are input using the control screen (13), the lateral slide base (19) moves away from the flip rod (25). Under the tension of the first tension spring (28), the solution container lids (27) are flipped open and remains in the open position, allowing subsequent surface processing. The rolling bearing (31) is positioned at the front end of the push rod (30), converting the sliding friction between the push rod (30) and the push plate (29) into rolling friction. This effectively reduces friction during contact and extends the lifespan of the components.

Furthermore, as shown in FIG. 4, FIG. 6 and FIG. 7, to facilitate the assembly and disassembly of the push rod (30) on the lateral slide base (19), one end of the push rod (30) is equipped with a rolling bearing (31), and the other end has a stud bolt. A threaded hole is provided on the lateral slide base (19 lateral slide base (19) to correspond with the stud bolt. By rotating the stud bolt, the initial extended length of the push rod (30), relative to the lateral slide base (19), can be adjusted, altering the distance between the lateral slide base (19) and the push plate (29) when the device is not in use. This adjustment changes the initial reset position of the lateral slide base (19) in the unused state.

To further implement the installation of the initial cleaning solution container (3), electrolyte container (4), activation solution container (5), and electroplating solution containers (6) on the platform (2), as shown in FIG. 8, a vertically adjustable placement tray (32) is installed on the front side of the platform (2). The vertical lift of the placement tray (32) can be achieved through an electric push rod or a telescopic cylinder. A heating plate (33) is mounted on the upper side of the placement tray (32), which includes container holder rings (34) corresponding to the initial cleaning solution container (3), electrolyte container (4), activation solution container (5), and electroplating solution containers (6) for secure positioning. To achieve fixed installation of the container holder rings (34) on the placement tray (32), several clamps (35) are installed between adjacent containers to secure the heating plate (33), container holder rings (34), and placement tray (32) in position.

Additionally, to drive the movement of the carbon brush (7) towards and into contact with the clamping mechanism (63) to form an electrical circuit, as shown in FIGS. 9 and 10, the carbon brush (7) is secured on a mounting plate (36). The lower side of the mounting plate (36) is equipped with a slide rail base (37), while its bottom includes a slider (38) that mates with the guide rail base (37), allowing movement of the mounting plate (36) and its attached carbon brush (7) along the rail.

An electromagnet (39) is also installed at the bottom of the mounting plate (36), with a vertical support (40) on its front end that includes an iron block (41) aligned with the electromagnet (39). A second tension spring (42) is placed between the mounting plate (36) and the guide rail base (37), which naturally biases the carbon brush (7) away from the electroplating solution containers (6). When the clamping mechanism (63) positions the jewelry within the electroplating solution container (6), the electromagnet (39) is energized, attracting the iron block (41) and overcoming the force of the second tension spring (42), allowing the carbon brush (7) to contact the clamping mechanism (63) and complete the electrical circuit.

Moreover, for vertical height adjustment of the mounting plate (36) to accommodate various types of clamping mechanisms (63) and ensure circuit formation upon contact, a height adjustment screw (43) is mounted at the base of the guide rail base (37), with a through-hole on the platform (2) that matches the height adjustment screw (43). The height adjustment screw (43) is fitted with a first nut (44) and a second nut (45) positioned on the upper and lower sides of the platform (2), respectively, allowing for precise positioning of the screw rod's height by clamping it between the two nuts.

By rotating the first nut (44) and the second nut (45) away from the platform (2), the height adjustment screw (43) can move vertically relative to the platform (2). After completing adjustments, the nuts are re-tightened on either side of the platform (2) to lock the position. This configuration enables adjustment of the height distance between the guide rail base (37) and the platform (2), which translates to precise vertical positioning of the mounting plate (36) and the carbon brush (7) relative to the platform (2).

To further facilitate the mounting of jewelry on the clamping mechanism (63) and enable its rotational movement relative to the moving mechanism (62), enhancing the effectiveness of jewelry cleaning, polishing, and electroplating, as shown in FIG. 11, the clamping mechanism (63) includes a first electric conduction pillar (i.e., first copper pillar) (46) attached to the output shaft of the jewelry holder rotary motor (24). The bottom of the first electric conduction pillar (i.e., first copper pillar) (46) is fitted with a round electric conduction plate (i.e. round copper plate) (47), which makes contact with the carbon brush (7) to complete the electrical circuit. The round electric conduction plate (i.e. round copper plate) (47) has a circular outer circumference, allowing it to form an electrical connection with the carbon brush (7) without obstructing the rotation of the clamping mechanism (63).

At the base of the round electric conduction plate (i.e. round copper plate) (47), a second electric conduction pillar (i.e., second copper pillar) (49) is mounted via a universal joint (48), which is covered with insulating grease (50). This connection via the universal joint (48) enables the round electric conduction plate (i.e. round copper plate) (47) to drive the second electric conduction pillar (i.e., second copper pillar) (49) in unrestricted circular oscillation. The insulating grease (50) limits this oscillation, allowing the second electric conduction pillar (i.e., second copper pillar) (49) to perform minor oscillations relative to the first electric conduction pillar (i.e., first copper pillar) (46). This configuration promotes slight oscillatory motion of the jewelry, improving the surface treatment during cleaning, polishing, and electroplating while restricting the oscillation range to prevent collision or interference with other components, thereby protecting the jewelry.

For secure jewelry mounting, the base of the second electric conduction pillar (i.e., second copper pillar) (49) is equipped with a hook (51) and a guard member (52). A torsion spring (53) is attached to the pivot of the guard member (52), which biases the guard member (52) towards closing the opening of the hook (51). During jewelry installation, the guard member (52) is simply rotated against the torsion force of the torsion spring (53) to expose the opening of the hook (51). Once the jewelry is mounted onto the hook (51), releasing the guard member (52) secures the jewelry firmly on the clamping mechanism (63). The hook (51), second electric conduction pillar (i.e., second copper pillar) (49), universal joint (48), and round electric conduction plate (i.e. round copper plate) (47) within the clamping mechanism (63) are all made of conductive material to ensure a closed electrical circuit is maintained.

Furthermore, another structural form of the clamping mechanism (63) is shown in FIG. 13. It includes a first electric conduction pillar (i.e., first copper pillar) (46) mounted on the output shaft of the jewelry holder rotary motor (24). The bottom of the first electric conduction pillar (i.e., first copper pillar) (46) is fitted with a round electric conduction plate (i.e. round copper plate) (47), which makes contact with the carbon brush (7) to complete the electrical circuit. The bottom of the round electric conduction plate (i.e. round copper plate) (47) is connected by a copper shaft to a nonconductive material holder (i.e. plastic holder) (57), whose outer perimeter is equipped with a slot (58). An electric hook (59) is also mounted on the nonconductive material holder (i.e. plastic holder) (57), which is electrically connected to the round electric conduction plate (i.e. round copper plate) (47) via a wire.

As shown in FIGS. 14 and 15, various electric hook (59) can be used to directly mount small jewelry items, such as rings, which will rotate along with the jewelry holder rotary motor (24) while completing the electrical circuit. A plurality of the electric hooks (59) may also be installed in the clamping mechanism (63) to enhance productivity. For larger jewelry items such as bracelets, they can be positioned and mounted in the slot (58) of the nonconductive material holder (i.e. plastic holder) (57). Since the nonconductive material holder (i.e. plastic holder) (57) itself is not electrically conductive, the electric hook (59) must be mounted onto the bracelet to ensure the electrical connection required for the electroplating process.

An illustration of the state of a ring hanging on the clamping mechanism described above is shown in FIG. 14.

Another illustration of the state of a bracelet hanging on the clamping mechanism described above is shown in FIG. 15.

Additionally, to create an electrical circuit during processes such as electrolysis, activation, and electroplating, as shown in FIG. 12, a conductive mesh (54) is installed inside the electrolyte container (4), activation solution container (5), and electroplating solution containers (6). The conductive mesh (54) is connected by wires to the carbon brush (7) and jointly connects to the electroplating power source. The carbon brush (7) makes contact with the clamping mechanism (63), and when the jewelry enters the electrolyte container (4), an electrical circuit is formed between the jewelry, electrolyte, conductive mesh (54), clamping mechanism (63), and carbon brush (7).

Moreover, to blow away surface impurities that may remain on the jewelry during processing, an air pump (55) is installed on the platform (2), and a blow pipe (56) is installed next to the clamping mechanism (63). The blow pipe (56) is connected to the air pump (55) via a line, and the blow pipe (56) can emit high-pressure air towards the position where the jewelry is mounted. This will blow away any impurities adhering to or remaining on the jewelry surface without damaging it.

While each part of the mechanization of the jewelry surface processing equipment is described in detail above, FIG. 16 shows an overall system schematic diagram depicting the operation principle of the present invention as follows:

The frame (1) and the platform (2) are mechanically connected together. The control screen (13) and the control system (64) are mounted on the frame (1) while the control screen (13) and the control system (64) maintain electrical communication. The control system (64) is further in electrical communication with the electric motors such as the X-axis motor (14), the Y-axis motor (15), the Z-axis motor (16), the polishing rotary motor (11) and the jewelry holder rotary motor (24). The control system (64) is also in electrical communication with the rinsing container station (66) and the polishing station (61) as well as the electromagnet (39) so as to operate these parts of the jewelry surface cleaning mechanism.

The moving mechanism (62) is mechanically connected to the clamping mechanism (63) further in mechanical connection with the jewelry to be processed. The lateral slide base is (19) slidably connected to the platform (2) via the lateral guide rail (18), and is mechanically connected with the moving mechanism (62).

The detection mechanisms (65) are mechanically connected with the moving mechanism (62) and the clamping mechanism (63) and are in electrical communication with the control system (64) to send the state of the detection to the control system (64)

Based on the described system construction, the jewelry being processed can be transferred between various stations as needed, including the rinsing container station (66), polishing station, electroplating container station (60), ultrasonic cleaning machine (10), and drying pipe nozzle (8), following instructions received from the control screen (13).

The operational process for surface treatment of jewelry using the apparatus described in the present invention is as follows:

1. First, the jewelry to be processed is hung on the hook (51), and relevant parameters are selected on the control screen (13), such as the movement distance and speed of the x, y, z axes of the moving mechanism (62), as well as the time requirements for cleaning, polishing, electroplating, and other operations.

2. After entering the parameters, the apparatus performs automatic operation according to the preset program. The X-axis motor (14) starts, driving the lateral slide base (19) and push rod (30) away from the push plate (29). Under the pulling force of the first tension spring (28), the solution container lids (27) rotates to open.

3. The motors on the moving mechanism (62) start and stop sequentially, moving the hook (51) with the jewelry to the position of the initial cleaning solution container (3). Under the drive of the Z-axis motor (16) and the jewelry holder rotary motor (24), the jewelry is rotated for cleaning within the cleaning solution.

4. After preliminary cleaning, the jewelry is moved to the polishing station (61), where the polishing rotary motor (11) starts to polish the jewelry.

5. After polishing, the movement mechanism (62) moves the jewelry to the ultrasonic cleaning machine (9) for comprehensive ultrasonic cleaning. After ultrasonic cleaning, the movement mechanism moves the jewelry to the rinsing container station (66), where it enters different cleaning solution container (10) in sequence for successive cleaning according to the corresponding cleaning requirements.

6. After cleaning, the jewelry is moved to the drying pipe nozzle (8) for drying. Once dried, it is moved to the electrolyte container (4) for electrolysis. After electrolysis, the jewelry is sent back to the rinsing container station (66) for cleaning again.

7. Once cleaned, it is moved to the activation solution container (5) for activation treatment. After activation, it is again sent to the rinsing container station (66) for cleaning, and after cleaning, it is moved to the corresponding electroplating solution container (6).

8. The electromagnet (39) is energized, attracting the iron block (41), driving the carbon brush (7) to contact the round electric conduction plate (i.e. round copper plate) (47) on the clamping mechanism (63), forming an electrical circuit and completing the electroplating operation.

9. After electroplating, the electromagnet (39) loses power and separates from the iron block (41), disengaging the carbon brush (7) from the clamping mechanism (63). The moving mechanism (62) then moves the jewelry back to the rinsing container station (66) for cleaning.

10. After cleaning, the jewelry is moved to the drying pipe nozzle (8) for drying. After drying, the lateral slide base (19) of the moving mechanism (62) returns to its original position, and the push rod (30) contacts the push plate (29), driving the solution container lid (27) to rotate and close.

11. The operator can then remove the processed jewelry from the hook (51).

The technical solution of the present invention is not limited to the scope of the embodiments described herein. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent to the skilled practitioner upon a study of the drawings, the specification, and the following claims.

Claims

1. An apparatus for jewelry surface processing comprising a frame (1) and a platform (2) wherein the frame (1) is configured to be supported by the platform (2) horizontally;

and the platform (2) is further characterized by: a front side of the platform (2) equipped with an electroplating container station (60) comprising an initial cleaning solution container (3), an electrolyte container (4), an activation solution container (5), and several electroplating solution containers (6); the platform (2) configured to feature a movable carbon brush (7) capable of approaching at least the electrolyte container (4), activation solution container (5), and electroplating solution containers (6); wherein: on a rear side of the carbon brush (7), the platform (2) is configured to include a rinsing container station (66), a drying nozzle (8), a polishing station (61), and an ultrasonic cleaner (9); the rinsing container station (66) comprises several cleaning solution containers (10) arranged sequentially based on increasing impurity concentration of the cleaning solution contained in the cleaning solution containers (10); and the polishing station (61) comprises a polishing rotary motor (11) with a polishing bowl (12) where polishing media are housed, the polishing bowl (12) is configured to be attached to an output shaft of the polishing rotary motor (11); and a moving mechanism (62) further is configured to be mounted on the platform (2), with a clamping mechanism (63) for securing jewelry wherein the clamping mechanism (63) is configured to rotate relative to the moving mechanism (62); the clamping mechanism (63) is configured to bring the jewelry into an electroplating solution container (6); and the carbon brush (7) is configured to approach and contact the clamping mechanism (63), creating an electrical circuit between the jewelry and the electroplating solution; and
the frame (1) is further characterized by: a front end of the frame (1) configured to be fitted with a control screen (13) wherein the control screen (13) is electrically connected to a control system (64) in electrical communication with the control system (64); the control system (64) being configured to be in electrical communication with the rinsing container station (66) and the polishing station (61) on the platform (2); wherein the moving mechanism (62) is configured to operate the clamping mechanism (63) to shuttle between the initial cleaning solution container (3), the electrolyte container (4), the activation solution container (5), the electroplating solution containers (6), the rinsing container station (66), the drying pipe nozzle (8), the polishing station (61), and the ultrasonic cleaner (9) to perform jewelry cleaning, polishing, and electroplating.

2. The Apparatus for Jewelry Surface Processing according to claim 1, further characterized by:

the moving mechanism (62) comprising an X-axis motor (14), a Y-axis motor (15), and a Z-axis motor (16), and both sides of the platform (2) equipped with ball screws (17) and lateral guide rails (18), with lateral slide bases (19) mounted on the lateral guide rails (18);
wherein each of the lateral slide base (19) is configured to include a cross-slide assembly (23) and a ball nut (20) that engages with the ball screw (17), and an output shaft of the X-axis motor (14) is configured to connect to one of the ball screws (17), and both ball screws (17) include timing pulleys (21) at their ends, joined by a timing belt (22), so configured that activation of the X-axis motor (14) enables synchronized movement of both lateral slide bases (19), and
wherein the cross-slide assembly (23) is so configured that the Y-axis motor (15) and the Z-axis motor (16) provide power for longitudinal and vertical movement, respectively, and comprises a sliding platform equipped with a jewelry holder rotary motor (24), of which an output shaft is configured to be attached to the clamping mechanism (63).

3. The Apparatus for Jewelry Surface Processing according to claim 2, further characterized by:

the initial cleaning solution container (3), electrolyte container (4), activation solution container (5), and several electroplating solution containers (6) configured to be arranged in parallel, wherein:
a flip rod (25) is configured to be installed at the front end of the frame (1), with a flip plate (26) attached to the flip rod (25); an inner side of the flip plate (26) further fitted with a solution container lid (27) corresponding to each cleaning, electrolyte, activation, and electroplating container;
a plurality of push plates (29) are configured to be mounted on either side of the flip rod (25), with a first tension spring (28) positioned between each push plate (29) and the frame (1);
the first tension spring (28) is configured to continually exert force, pulling the solution container lid (27) away from the cup opening; and
a push rod (30) with a rolling bearing (31) at its end is configured to be installed on the lateral slide base (19), and the rolling bearing (31) is configured to align with the push plates (29) so configured that when the lateral slide base (19) moves close to the flip rod (25), the push rod (30) contacts the push plates (29), thereby driving the solution container lid (27) to rotate and align with the cup opening.

4. The Apparatus for Jewelry Surface Processing according to claim 3, further characterized by:

one end of the push rod (30) being fitted with a rolling bearing (31), while the opposite end of the push rod (30) includes a threaded stud; the lateral slide base (19) being configured to have a threaded hole that accommodates the threaded stud.

5. The Apparatus for Jewelry Surface Processing according to claim 1, further characterized by:

comprising a vertically movable placement tray (32) configured to be mounted on the front side of the platform (2);
comprising an upper side of the placement base (32) configured to hold a heating plate (33), which has container holder rings (34) that correspond to the initial cleaning solution container (3), electrolyte container (4), activation solution container (5) and electroplating solution containers (6); and
comprising several clamps (35) configured to be installed between the heating plate (33), placement base (32), and adjacent cups to secure the arrangement.

6. The Apparatus for Jewelry Surface Processing according to claim 1, further characterized by:

the carbon brush (7) configured to be mounted on a mounting plate (36), with a guide rail base (37) positioned underneath;
the bottom of the mounting plate (36) configured to be fitted with a slider (38) that engages with the guide rail base (37);
an electromagnet (39) configured to be mounted on the bottom of the mounting plate (36), while a vertical support (40) at the front end of the mounting plate (36) has an iron block (41) aligned with the electromagnet (39);
a second tension spring (42) configured to be installed between the mounting plate (36) and the guide rail base (37), which constantly pulls the carbon brush (7) away from the electroplating solution container (6); and
the electromagnet (39) configured to be activated and to attract the iron block (41) overcoming the pull of the second tension spring (42), allowing the carbon brush (7) to contact the clamping mechanism (63) and complete the electrical circuit when the clamping mechanism (63) moves the jewelry into the electroplating solution container (6).

7. The Apparatus for Jewelry Surface Processing according to claim 6, further characterized by:

the bottom of the guide rail base (37) configured to be equipped with a height adjustment screw (43), the height adjustment screw (43) configured to pass through a through hole on the platform (2); and
the height adjustment screw (43) configured to be fitted with a first nut (44) and a second nut (45) positioned above and below the platform (2), respectively, wherein the height of the guide rail base (37) relative to the platform (2) can be adjusted by rotating the first nut (44) and second nut (45).

8. The Apparatus for Jewelry Surface Processing according to claim 2, further characterized by:

the clamping mechanism (63) comprising a first electric conduction pillar (i.e., first copper pillar) (46) mounted on the output shaft of the jewelry holder rotary motor (24);
the base of the first electric conduction pillar (i.e., first copper pillar) (46) having a round electric conduction plate (i.e. round copper plate) (47) that can contact the carbon brush (7) to complete an electrical circuit;
a second electric conduction pillar (i.e., second copper pillar) (49) configured to be mounted below the round electric conduction plate (i.e. round copper plate) (47) via a universal joint (48), which is coated with insulating grease (50);
the second electric conduction pillar (i.e., second copper pillar) (49) being characterized to be capable of oscillating slightly relative to the first electric conduction pillar (i.e., first copper pillar) (46);
the bottom of the second electric conduction pillar (i.e., second copper pillar) (49) configured to be fitted with a hook (51) and a guard member (52), with a torsion spring (53) mounted on the guard member (52) shaft; and
the torsion spring (53) configured to constantly exert force to rotate the guard member (52) to cover the opening of the hook (51).

9. The Apparatus for Jewelry Surface Processing according to claim 2, further characterized by:

the clamping mechanism (63) comprising a first electric conduction pillar (i.e., first copper pillar) (46) on an output shaft of the jewelry holder rotary motor (24), with a round electric conduction plate (i.e. round copper plate) (47) at a base of the first electric conduction pillar (i.e., first copper pillar) (46);
the carbon brush (7) configured to be able to contact the round electric conduction plate (i.e. round copper plate) (47) to form an electrical circuit; and
the round electric conduction plate (i.e. round copper plate) (47) configured to be connected to a nonconductive material holder (i.e. plastic holder) (57) through a copper shaft, an outer edge of the nonconductive material holder (i.e. plastic holder) (57) configured to have a slot (58) with an electric hook (59) mounted on the nonconductive material holder (i.e. plastic holder) (57), connected to the round electric conduction plate (i.e. round copper plate) (47) via a wire.

10. The Apparatus for Jewelry Surface Processing according to claim 1, further characterized by:

the electrolyte container (4), activation solution container (5), and electroplating solution container (6) each being equipped with a conductive mesh (54) wherein the conductive mesh (54) is configured to be connected to the carbon brush (7) through wiring and linked to the electroplating power supply.

11. The Apparatus for Jewelry Surface Processing according to claim 1, further characterized by:

an air pump (55) configured to be installed on the platform (2), with a blow pipe (56) mounted on the clamping mechanism (63) wherein the blow pipe (56) is connected to the air pump (55) via an air conduit for air supply.
Patent History
Publication number: 20260201593
Type: Application
Filed: Jan 13, 2025
Publication Date: Jul 16, 2026
Inventors: Lei Zhang (Troy, MI), Dongtian Zhang (Jinan), Zhen Zhang (San Diego, CA)
Application Number: 19/017,893
Classifications
International Classification: C25D 7/00 (20060101); A44C 27/00 (20060101); C25D 5/48 (20060101); C25D 17/00 (20060101);