REFRIGERATOR

A refrigerator is provided. The refrigerator includes a main body, a thermoelectric element including a heat generating portion and a heat absorbing portion, the thermoelectric element being provided on an upper wall of the main body such that the heat generating portion faces upward of the thermoelectric element and the heat absorbing portion faces downward of the thermoelectric element, a heat sink provided on an upper side of the thermoelectric element to contact the heat generating portion, a cooling sink provided on a lower side of the thermoelectric element to contact the heat absorbing portion, and a thermoelectric element sealing portion configured to cover an outer surface of the thermoelectric element and to seal between the heat sink and the cooling sink, wherein the thermoelectric element sealing portion includes a wire cover portion configured to cover at least a portion of a wire connected to the thermoelectric element.

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Description
CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application, claiming priority under 35 U.S.C. § 365(c), of an International application No. PCT/KR2024/017716, filed on November 11, 2024, which is based on and claims the benefit of a Korean patent application number 10-2024-0002503, filed on January 5, 2024, in the Ministry of Intellectual Property (MOIP), and of a Korean patent application number 10-2024-0048347, filed on April 9, 2024, in the Ministry of Intellectual Property (MOIP), the disclosure of each of which is incorporated by reference herein in its entirety.

BACKGROUND 1. Field

The disclosure relates to a refrigerator having an improved structure.

2. Description of Related Art

A refrigerator is an appliance for keeping food fresh, including a main body having a storage compartment, a cold air supply device for supplying cold air to the storage compartment.

The cold air supply device of the refrigerator may utilize a thermoelectric cooling device that generates heating and cooling via the Peltier effect. The thermoelectric cooling device may include a thermoelectric element. The thermoelectric element has a heat generating portion formed on one side and a heat absorbing portion formed on the opposite side, and when a current is applied to the thermoelectric element, heat generation may occur at the heat generating portion and heat absorption may occur at the heat absorbing portion.

The thermoelectric element are subject to frequent temperature changes, causing condensation to occur, which may damage the thermoelectric element. Therefore, a thermoelectric element sealing portion may be provided outside the thermoelectric element to prevent moisture from penetrating into the thermoelectric element.

The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure.

SUMMARY

Aspects of the disclosure are to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide a refrigerator that more effectively prevents moisture from penetrating into a thermoelectric element.

Another aspect of the disclosure is to provide a refrigerator including a thermoelectric element sealing portion with improved durability and assemblability.

Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.

In accordance with an aspect of the disclosure, a refrigerator is provided. The refrigerator includes a main body, a thermoelectric element including a heat generating portion and a heat absorbing portion, the thermoelectric element being provided on an upper wall of the main body such that the heat generating portion faces upward of the thermoelectric element and the heat absorbing portion faces downward of the thermoelectric element, a heat sink provided on an upper side of the thermoelectric element to contact the heat generating portion, a cooling sink provided on a lower side of the thermoelectric element to contact the heat absorbing portion, and a thermoelectric element sealing portion configured to cover an outer surface of the thermoelectric element and to seal between the heat sink and the cooling sink, wherein the thermoelectric element sealing portion includes a wire cover portion configured to cover at least a portion of a wire connected to the thermoelectric element.

In accordance with another aspect of the disclosure, a refrigerator is provided. The refrigerator includes a main body, a thermoelectric element including a heat generating portion provided on an upper surface and a heat absorbing portion provided on a lower surface, a wire connected to the thermoelectric element to provide power to the thermoelectric element, a heat sink provided on an upper side of the thermoelectric element to contact the heat generating portion, a cooling sink provided on a lower side of the thermoelectric element to contact the heat absorbing portion, and a thermoelectric element sealing portion configured to cover an outer surface of the thermoelectric element to prevent moisture from penetrating into the thermoelectric element. The thermoelectric element sealing portion includes a lower sealing portion configured to cover a lower outer surface of the thermoelectric element and a lower portion of the wire, and an upper sealing portion configured to cover an upper outer surface of the thermoelectric element and an upper portion of the wire and be detachably coupled to the lower sealing portion.

Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a perspective view illustrating a refrigerator according to an embodiment of the disclosure;

FIG. 2 is a perspective view illustrating a refrigerator with doors of the refrigerator open, according to an embodiment of the disclosure;

FIG. 3 is a view illustrating an upper portion of a storage compartment of a refrigerator from below, according to an embodiment of the disclosure;

FIG. 4 is a side cross-sectional view schematically illustrating a refrigerator according to an embodiment of the disclosure;

FIG. 5 is a cross-sectional view taken along line A-A' indicated in FIG. 2 according to an embodiment of the disclosure;

FIG. 6 is a perspective view illustrating a coupling structure of a thermoelectric module and an upper wall of a main body according to an embodiment of the disclosure;

FIG. 7 is a view illustrating a heat dissipation fan and a thermoelectric module according to an embodiment of the disclosure;

FIG. 8 is an exploded view illustrating some configurations of the thermoelectric module shown in FIG. 7 according to an embodiment of the disclosure;

FIG. 9 is a view illustrating a state in which a thermoelectric element and a thermoelectric element sealing portion are disposed inside a plate opening, according to an embodiment of the disclosure;

FIG. 10 is a view illustrating a thermoelectric element sealing portion according to an embodiment of the disclosure;

FIG. 11 is a cross-sectional view taken along line B-B' indicated in FIG. 10 according to an embodiment of the disclosure;

FIG. 12 is a cross-sectional view taken along line C-C' indicated in FIG. 10 according to an embodiment of the disclosure;

FIG. 13 is an exploded view of the thermoelectric element and the thermoelectric element sealing portion shown in FIG. 9 according to an embodiment of the disclosure;

FIG. 14 is an exploded view from above of a thermoelectric element and a thermoelectric element sealing portion according to an embodiment of the disclosure;

FIG. 15 is an exploded bottom view from below of the thermoelectric element and the thermoelectric element sealing portion shown in FIG. 14 according to an embodiment of the disclosure;

FIG. 16 is a cross-sectional view illustrating a state in which a thermoelectric element sealing portion is secured within a plate opening, according to an embodiment of the disclosure;

FIG. 17 is a cross-sectional view illustrating a state in which a thermoelectric element sealing portion is secured within a plate opening, according to an embodiment of the disclosure;

FIG. 18 is a plan view illustrating a state in which a thermoelectric element is disposed on a lower sealing portion, according to an embodiment of the disclosure;

FIG. 19 is an exploded view from above of some configurations of a thermoelectric element and a thermoelectric element sealing portion, according to an embodiment of the disclosure; and

FIG. 20 is a view illustrating a thermoelectric element and a thermoelectric element sealing portion, according to an embodiment of the disclosure.

Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are not limited to the to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the disclosure. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the disclosure is provided for illustration purpose only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.

It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a component surface” includes reference to one or more of such surfaces.

In the disclosure, phrases, such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items listed together in the corresponding phrase among the phrases.

As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

Terms such as “1st,” “2nd,” “primary,” or “secondary” may be used simply to distinguish an element from other elements, without limiting the element in other aspects (e.g., importance or order).

Further, as used in the disclosure, the terms “front,” “rear,” “top,” “bottom,” “side,” “left,” “right,” “upper,” “lower,” and the like are defined with reference to the drawings, and are not intended to limit the shape and position of any element.

It will be understood that when the terms “includes,” “comprises,” “including,” and/or “comprising” are used in the disclosure, they specify the presence of the specified features, figures, steps, operations, components, members, or combinations thereof, but do not preclude the presence or addition of one or more other features, figures, steps, operations, components, members, or combinations thereof.

When a given element is referred to as being “connected to,” “coupled to,” “supported by” or “in contact with” another element, it is to be understood that it may be directly or indirectly connected to, coupled to, supported by, or in contact with the other element. When a given element is indirectly connected to, coupled to, supported by, or in contact with another element, it is to be understood that it may be connected to, coupled to, supported by, or in contact with the other element through a third element.

It will also be understood that when an element is referred to as being “on” another element, it may be directly on the other element or intervening elements may also be present.

A refrigerator according to an embodiment of the disclosure may include a main body.

The “main body” may include an inner case, an outer case positioned outside the inner case, and an insulation provided between the inner case and the outer case.

The “inner case” may include a case, a plate, a panel, or a liner forming a storage compartment (also referred to as a storage room). The inner case may be formed as one body, or may be formed by assembling a plurality of plates together. The “outer case” may form an appearance of the main body, and be coupled to an outer side of the inner case such that the insulation is positioned between the inner case and the outer case.

The “insulation” may insulate an inside of the storage compartment from an outside of the storage compartment to maintain inside temperature of the storage compartment at appropriate temperature without being influenced by an external environment of the storage compartment. According to an embodiment of the disclosure, the insulation may include a foaming insulation. The foaming insulation may be molded by fixing the inner case and the outer case with jigs, etc. and then injecting and foaming urethane foam as a mixture of polyurethane and a foaming agent between the inner case and the outer case.

According to an embodiment of the disclosure, the insulation may include a vacuum insulation in addition to a foaming insulation, or may be configured only with a vacuum insulation instead of a forming insulation. The vacuum insulation may include a core material and a cladding material accommodating the core material and sealing the inside with vacuum or pressure close to vacuum. However, the insulation is not limited to the above-mentioned foaming insulation or vacuum insulation, and may include various materials capable of being used for insulation.

The “storage compartment” may include a space defined by the inner case. The storage compartment may further include the inner case defining the space corresponding to the storage compartment. The storage compartment may store a variety of items, such as food, medicines, cosmetics, and the like, and the storage compartment may be configured to be open on at least one side for insertion and removal of the items.

The refrigerator may include one or more storage compartments. In a case in which two or more storage compartments are formed in the refrigerator, the respective storage compartments may have different purposes of use, and may be maintained at different temperatures. To this end, the respective storage compartments may be partitioned by a partition wall including an insulation.

The storage compartment may be maintained within an appropriate temperature range according to a purpose of use, and may include a “refrigerating compartment,” a “freezing compartment,” and a “temperature conversion compartment” according to purposes of use and/or temperature ranges. The refrigerating compartment may be maintained at an appropriate temperature to keep food refrigerating, and the freezing compartment may be maintained at an appropriate temperature to keep food frozen. The “refrigerating” may be keeping food cold without freezing the food, and for example, the refrigerating compartment may be maintained within a range of 0 degrees Celsius to 7 degrees Celsius. The “freezing” may be freezing food or keeping food frozen, and for example, the freezing compartment may be maintained within a range of -20 degrees Celsius to -1 degrees Celsius. The temperature conversion compartment may be used as either a refrigerating compartment or a freezing compartment according to or regardless of a user's selection.

The storage compartment may also be referred to by various terms, such as “vegetable compartment,” “freshness compartment,” “cooling compartment,” and “ice-making compartment,” in addition to “refrigerating compartment,” “freezing compartment,” and “temperature conversion compartment,” and the terms, such as “refrigerating compartment,” “freezing compartment,” “temperature conversion compartment,” etc., as used below are to be understood as representing storage compartments having the corresponding purposes of use and the corresponding temperature ranges.

The refrigerator according to an embodiment of the disclosure may include at least one door configured to open or close the open side of the storage compartment. The respective doors may be provided to open or close one or more storage compartments, or a single door may be provided to open or close a plurality of storage compartments. The door may be rotatably or slidably mounted to the front of the main body.

The “door” may seal the storage compartment in a closed state. The door, like the main body, may include an insulation to insulate the storage compartment in a closed state.

According to an embodiment, the door may include an outer door plate forming the front surface of the door, an inner door plate forming the rear surface of the door and facing the storage compartment, an upper cap, a lower cap, and a door insulation provided therein.

A gasket may be provided on the edge of the inner door plate to seal the storage compartment by coming into close contact with the front surface of the main body when the door is closed. The inner door plate may include a dyke that protrudes rearward to allow a door basket for storing items to be fitted.

According to an embodiment, the door may include a door body and a front panel that is detachably coupled to the front of the door body and forming the front surface of the door. The door body may include an outer door plate forming the front surface of the door body, an inner door plate forming the rear surface of the door body and facing the storage compartment, an upper cap, a lower cap, and a door insulator provided therein.

The refrigerator may be classified as French Door Type, Side-by-side Type, Bottom Mounted Freezer (BMF), Top Mounted Freezer (TMF), or Single Door Refrigerator according to the arrangement of the doors and the storage compartments.

The refrigerator according to an embodiment of the disclosure may include a cold air supply device for supplying cold air to the storage compartment.

The “cold air supply device” may include a machine, an apparatus, an electronic device, and/or a combination system thereof, capable of generating cold air and guiding the cold air to cool the storage compartment.

According to an embodiment of the disclosure, the cold air supply device may generate cold air through a cooling cycle including compression, condensation, expansion, and evaporation processes of refrigerants. To this end, the cold air supply device may include a refrigeration cycle device having a compressor, a condenser, an expander, and an evaporator to drive the refrigeration cycle. According to an embodiment of the disclosure, the cold air supply device may include a semiconductor, such as a thermoelectric element. The thermoelectric element may cool the storage compartment by heating and cooling actions through the Peltier effect.

The refrigerator according to an embodiment of the disclosure may include a machine compartment in which at least some components belonging to the cold air supply device are installed.

The “machine compartment” may be partitioned and insulated from the storage compartment to prevent heat generated by the components installed in the machine compartment from being transferred to the storage compartment. To dissipate heat from the components installed in the machine compartment, the machine compartment may communicate with outside of the main body.

The refrigerator according to an embodiment of the disclosure may include a dispenser provided on the door to provide water and/or ice. The dispenser may be provided on the door to allow access by the user without opening the door.

The refrigerator according to an embodiment of the disclosure may include an ice-making device that produces ice. The ice-making device may include an ice-making tray that stores water, an ice-moving device that separates ice from the ice-making tray, and an ice-bucket that stores ice produced in the ice-making tray.

The refrigerator according to an embodiment of the disclosure may include a controller for controlling the refrigerator.

The “controller” may include memory for storing and/or recording data and/or programs for controlling the refrigerator, and a processor for outputting control signals for controlling the cold air supply device, etc. in accordance with the programs and/or data stored in the memory.

The memory may store or record various information, data, instructions, programs, and the like necessary for operation of the refrigerator. The memory may store temporary data generated while generating control signals for controlling components included in the refrigerator. The memory may include at least one of a volatile memory or a non-volatile memory, or a combination thereof.

The processor may control the overall operation of the refrigerator. The processor may control the components of the refrigerator by executing programs stored in memory. The processor may include a separate neural processing unit (NPU) that performs an artificial intelligence (AI) model operation. In addition, the processor may include a central processing unit (CPU), a graphics processor (GPU), and the like. The processor may generate a control signal to control the operation of the cold air supply device. For example, the processor may receive temperature information of the storage compartment from a temperature sensor and generate a cooling control signal to control an operation of the cold air supply device based on the temperature information of the storage compartment.

Furthermore, the processor may process a user input of a user interface and control an operation of the user interface in accordance with the programs and/or data memorized/stored in the memory. The user interface may be provided with an input interface and an output interface. The processor may receive the user input from the user interface. In addition, the processor may transmit a display control signal and image data for displaying an image on the user interface to the user interface in response to the user input.

The processor and memory may be provided integrally or may be provided separately. The processor may include one or more processors. For example, the processor may include a main processor and at least one sub-processor. The memory may include one or more memories.

The refrigerator according to an embodiment of the disclosure may include a processor and memory for controlling all of the components included in the refrigerator, and may include a plurality of processors and a plurality of memories for individually controlling the components of the refrigerator. For example, the refrigerator may include a processor and memory for controlling the operation of the cold air supply device in accordance with to an output of the temperature sensor. In addition, the refrigerator may be separately provided with a processor and memory for controlling the operation of the user interface in accordance with the user input.

A communication module may communicate with external devices, such as servers, mobile devices, and other home appliances via a nearby access point (AP). The AP may connect a local area network (LAN) to which a refrigerator or a user device is connected to a wide area network (WAN) to which a server is connected. The refrigerator or the user device may be connected to the server via the WAN.

The input interface may include keys, a touch screen, a microphone, and the like. The input interface may receive the user input and pass the received user input to the processor.

The output interface may include a display, a speaker, and the like. The output interface may output various notifications, messages, information, and the like generated by the processor.

As used in the following description, the terms “front-to-back direction,” “left-to-right direction,” “upper side,” “lower side,” and the like are defined based on the drawings, and the shape and position of each configuration are not limited by these terms.

For example, an X direction may be defined as a front-to-back direction. For example, a Y direction may be defined as a lateral direction. For example, a Z direction may be defined as an up-and-down direction. For example, the +X direction may be defined as forward, and the -X direction may be defined as rearward. For example, the +Y direction may be defined as right, and the -Y direction may be defined as left. For example, the +Z direction may be defined as upward, and the -Z direction may be defined as downward.

It should be appreciated that the blocks in each flowchart and combinations of the flowcharts may be performed by one or more computer programs which include instructions. The entirety of the one or more computer programs may be stored in a single memory device or the one or more computer programs may be divided with different portions stored in different multiple memory devices.

Any of the functions or operations described herein can be processed by one processor or a combination of processors. The one processor or the combination of processors is circuitry performing processing and includes circuitry like an application processor (AP, e.g. a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless fidelity (Wi-Fi) chip, a Bluetooth® chip, a global positioning system (GPS) chip, a near field communication (NFC) chip, connectivity chips, a sensor controller, a touch controller, a finger-print sensor controller, a display driver integrated circuit (IC), an audio CODEC chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on chip (SoC), an IC, or the like.

Hereinafter, an embodiment according to the disclosure will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating a refrigerator according to an embodiment of the disclosure. FIG. 2 is a perspective view illustrating a state in which doors of a refrigerator are opened according to an embodiment of the disclosure. FIG. 3 is a view illustrating an upper portion of a storage compartment of a refrigerator from below, according to an embodiment of the disclosure. FIG. 4 is a side cross-sectional view schematically illustrating a refrigerator according to an embodiment of the disclosure. FIG. 5 is a cross-sectional view taken along line A-A' indicated in FIG. 2 according to an embodiment of the disclosure.

Referring to FIGS. 1 to 5, a refrigerator 1 may include a main body 100, a plurality of storage compartments 11, 12 and 13 provided inside the main body 100, and a plurality of doors 21, 22, 23 and 24 provided to open or close the plurality of storage compartments 11, 12 and 13.

The main body 100 may include an upper wall 110, a lower wall 120, a left wall 130, a right wall 140, and a rear wall 150. The upper wall 110, the lower wall 120, the left wall 130, the right wall 140, and the rear wall 150 may form an upper surface (+Z direction), a lower surface (-Z direction), a left surface (-Y direction), a right surface (+Y direction), and a rear wall (-X direction) of the main body 100, respectively.

Each of the plurality of storage compartments 11, 12 and 13 may accommodate items. Each of the plurality of storage compartments 11, 12 and 13 may be formed to be open at a front side to allow items to be put in or taken out.

The plurality of storage compartments 11, 12 and 13 may include a first storage compartment 11, a second storage compartment 12, and a third storage compartment 13. The first storage compartment 11 may be provided in an upper portion of the main body 100, and the second storage compartment 12 and the third storage compartment 13 may be provided in a lower portion of the main body 100. The first storage compartment 11 may be a refrigerating compartment, the second storage compartment 12 may be a freezing compartment, and the third storage compartment 13 may be a variable temperature compartment. The main body 100 may include a horizontal partition wall 160 that partitions the first storage compartment 11 from the second storage compartment 12 and the third storage compartment 13, and a vertical partition wall 161 that partitions the second storage compartment 12 from the third storage compartment 13.

Each of the plurality of doors 21, 22, 23 and 24 may be provided to open or close corresponding to each of the plurality of storage compartments 11, 12 and 13.

The plurality of doors 21, 22, 23 and 24 may include a first door 21, a second door 22, and a third door 23, and a fourth door 24. The first door 21 and the second door 22 may open or close the first storage compartment 11, the third door 23 may open or close the second storage compartment 12, and the fourth door 24 may open or close the third storage compartment 13.

Each of the plurality of doors 21, 22, 23 and 24 may be rotatably coupled to the main body 100. Specifically, each of the plurality of doors 21, 22, 23 and 24 may be rotatably coupled to the main body 100 by a hinge.

For example, the first door 21 and the second door 22 may each be rotatably coupled to the main body 100 by a hinge 31 provided at an upper portion of the main body 100 and a hinge (not shown) provided at a middle of the main body 100. The hinge 31 may be covered by a top cover 200 provided to cover a front portion of an upper surface of the main body 100.

The refrigerator 1 may include a rotating bar 40. The rotating bar 40 may be configured to cover a gap formed between the first door 21 and the second door 22 when the first door 21 and the second door 22 are closed. The rotating bar 40 may have a rod shape elongated in the up-and-down direction (Z-axis direction). The rotating bar 40 may also be referred to as a pillar, a mullion, or the like.

The rotating bar 40 may be rotatably provided on one of the first door 21 and the second door 22. While the rotating bar 40 is shown in the drawings as being rotatably provided on the first door 21, the rotating bar 40 may also be rotatably provided on the second door 22.

The rotating bar 40 may include a guide protrusion 41 provided on an upper end of the rotating bar 40. A rotation guide 42 for guiding rotation of the guide protrusion 41 may be provided on the upper portion of the main body 100. When the first door 21 and the second door 22 are closed, the rotation guide 42 may guide the rotation of the guide protrusion 41, thereby allowing the rotating bar 40 to rotate. This may allow the gap formed between the first door 21 and the second door 22 to be covered.

Each of the plurality of doors 21, 22, 23 and 24 may include a gasket 51. The gasket 51 may be in close contact with a front surface of the main body 100 when each of the plurality of doors 21, 22, 23 and 24 is closed.

Each of the plurality of doors 21, 22, 23 and 24 may include a dyke 52 protruding rearwardly. The dyke 52 may be equipped with a door shelf 53 for storing items. The rotating bar 40 may be rotatably mounted on the dyke 52.

Although the number and arrangement of the storage compartments and the number and arrangement of the doors have been described above, there is no limitation on the number and arrangement of the storage compartments and the number and arrangement of the doors of the refrigerator according to an embodiment of the disclosure.

The refrigerator 1 may include a thermoelectric cooling device 300 provided to cool the first storage compartment 11.

The thermoelectric cooling device 300 may be provided on an upper side of the first storage compartment 11 to cool the first storage compartment 11. In other words, the thermoelectric cooling device 300 may be arranged on the upper wall 110 of the main body 100.

The thermoelectric cooling device 300 may include a thermoelectric element 410. The thermoelectric element 410 may be a semiconductor element that utilize thermoelectric effects to convert thermal energy into electrical energy, and may also be referred to as a thermoelectric semiconductor element, a Peltier element, or the like. The thermoelectric element 410 may have a thin hexahedral shape.

The thermoelectric element 410 may include a heat generating portion 411 and a heat absorbing portion 412. When a current is applied to the thermoelectric element 410, a heat generating action may occur at the heat generating portion 411 and a heat absorbing action may occur at the heat absorbing portion 412. The heat generating portion 411 may be provided on one side of the thermoelectric element 410, and the heat absorbing portion 412 may be provided on the opposite side.

The thermoelectric element 410 may be provided on the upper wall 110. The thermoelectric element 410 may be arranged such that the heat generating portion 411 faces upward of the thermoelectric element 410 and the heat absorbing portion 412 faces downward of the thermoelectric element 410. In other words, the heat generating portion 411 may be provided on an upper surface of the thermoelectric element 410, and the heat absorbing portion 412 may be provided on a lower surface of the thermoelectric element 410. The heat generating portion 411 may face an outside of the main body 100, and the heat absorbing portion 412 may face an inside of the first storage compartment 11. Thus, air warmed by heat exchange with the heat generating portion 411 may be discharged to the outside of the main body 100, and air cooled by heat exchange with the heat absorbing portion 412 may be supplied to the first storage compartment 11.

The thermoelectric cooling device 300 may include a heat sink 420 in contact with the heat generating portion 411 to allow efficient heat exchange between the heat generating portion 411 and air from outside the main body 100. The heat sink 420 may be provided on an upper side of the thermoelectric element 410 to contact the heat generating portion 411.

The heat sink 420 may be provided on the outside of the main body 100. The heat sink 420 may contact the heat generating portion 411 to absorb heat from the heat generating portion 411 and dissipate heat to the outside of the main body 100. The heat sink 420 may also be referred to as a dissipate sink, a hot sink, a dissipating heat sink, a hot heat sink, or the like.

The heat sink 420 may be formed of a metal material having good thermal conductivity. For example, the heat sink 420 may be formed of aluminum or copper.

The heat sink 420 may include a heat sink base 421 that contacts the heat generating portion 411, and a plurality of heat sink fins 422 that protrude from the heat sink base 421 to increase a heat transfer area. The plurality of heat sink fins 422 may protrude upwardly from the heat sink base 421.

The thermoelectric cooling device 300 may include a cooling sink 430 in contact with the heat absorbing portion 412 to allow efficient heat exchange between the heat absorbing portion 412 and air from inside the first storage compartment 11. The cooling sink 430 may be provided on a lower side of the thermoelectric element 410 to contact the heat absorbing portion 412.

The cooling sink 430 may be provided inside the first storage compartment 11. The cooling sink 430 may cool the first storage compartment 11 by taking heat from the first storage compartment 11 and transferring the heat to the heat absorbing portion 412. The cooling sink 430 may also be referred to as a cold sink, a chilling sink, a cooling heat sink, a cold heat sink, a chilling heat sink, or the like.

The cooling sink 430 may be formed of a metal material having good thermal conductivity. For example, the cooling sink 430 may be formed of aluminum or copper.

The cooling sink 430 may include a cooling sink base 431 that contacts the heat absorbing portion 412, and a plurality of cooling fins 432 that protrude from the cooling sink base 431 to increase the heat transfer area. The plurality of cooling fins 432 may protrude downwardly from the cooling sink base 431. The cooling sink base 431 and the plurality of cooling fins 432 may be integrally formed.

The thermoelectric cooling device 300 may include a thermoelectric element sealing portion 500 that covers an outer surface of the thermoelectric element 410. As described above, the heat sink 420 may be provided on the upper side of the thermoelectric element 410, the cooling sink 430 may be provided on the lower side of the thermoelectric element 410, and the thermoelectric element sealing portion 500 may be provided on the outer surface of the thermoelectric element 410. The thermoelectric element sealing portion 500 may cover the outer surface of the thermoelectric element 410, and may seal between the heat sink 420 and the cooling sink 430. With such a configuration, the thermoelectric element sealing portion 500 may prevent moisture from penetrating into the thermoelectric element 410. This will be discussed in more detail later.

The thermoelectric cooling device 300 may include a heat dissipation fan 600 that flows air to allow efficient heat exchange between the heat sink 420 and air from outside the main body 100.

The heat dissipation fan 600 may be configured to draw in air from outside the main body 100 and blow the air toward the heat sink 420. The heat dissipation fan 600 may be arranged to be positioned in a horizontal direction of the heat sink 420. The heat dissipation fan 600 may be arranged on an outer side of the main body 100. The heat dissipation fan 600 may be arranged on an upper side of the upper wall 110.

The heat dissipation fan 600 may be a centrifugal fan that draws in air in an axial direction and discharges the drawn-in air in a radial direction. The centrifugal fan may include a blower fan. A rotational shaft 610 of the heat dissipation fan 600 may be disposed perpendicular to an upper surface of the upper wall 110.

The thermoelectric cooling device 300 may include a heat dissipation duct 700 configured to guide air flowing by the heat dissipation fan 600. The heat dissipation duct 700 may draw in air from outside the main body 100 and guide the drawn-in air to heat exchange with the heat sink 420, and may discharge the air that has exchanged heat with the heat sink 420 back to the outside of the main body 100.

The heat dissipation duct 700 may draw in air from an external space on an upper side of the main body 100. The heat dissipation duct 700 may discharge the air that has exchanged heat with the heat sink 420 to the external space on the upper side of the main body 100. The heat dissipation fan 600 may be located inside the heat dissipation duct 700. The heat sink 420 may be located inside the heat dissipation duct 700. The heat dissipation duct 700 may be provided on the upper surface of the upper wall 110.

The heat dissipation duct 700 may include an outside air inlet 710 that draws in air from outside the main body 100 into an interior of the heat dissipation duct 700, and an outside air outlet 720 that discharges air that has exchanged heat with the heat sink 420 to the outside of the main body 100.

The thermoelectric cooling device 300 may include a cooling fan 800 that flows air to allow efficient heat exchange between the cooling sink 430 and air inside the first storage compartment 11.

The cooling fan 800 may be configured to draw in air within the first storage compartment 11 and blow the air toward the cooling sink 430. The cooling fan 800 may be positioned in a horizontal direction of the cooling sink 430. The cooling fan 800 may be provided inside the first storage compartment 11. The cooling fan 800 may be provided on a lower side of the upper wall 110.

The cooling fan 800 may be a centrifugal fan that draws in air in an axial direction and discharges the drawn-in air in a radial direction. A rotational shaft 810 of the cooling fan 800 may be disposed perpendicular to a lower surface of the upper wall 110.

The thermoelectric cooling device 300 may include a cooling duct 900 configured to guide air flowing by the cooling fan 800. The cooling duct 900 may draw in air from inside the first storage compartment 11 and guide the drawn-in air to heat exchange with the cooling sink 430, and may discharge the air that has exchanged heat with the cooling sink 430 back into the interior of the first storage compartment 11.

The cooling duct 900 may be located on the upper side of the first storage compartment 11. Specifically, the cooling duct 900 may be provided on the lower surface of the upper wall 110.

The cooling fan 800 may be located inside the cooling duct 900. The cooling sink 430 may be located inside the cooling duct 900.

The cooling duct 900 may include an inside air inlet 991 configured to draw in air from inside the first storage compartment 11 into an interior of the cooling duct 900, and an inside air outlet 992 configured to discharge air that has exchanged heat with the cooling sink 430 into the interior of the first storage compartment 11.

Referring to FIG. 4, the refrigerator 1 may include a refrigeration cycle device to cool the storage compartments through a refrigeration cycle. The refrigeration cycle device may include a compressor 2, a condenser (not shown), an expansion device (not shown), and an evaporator 3. The evaporator 3 may be provided at a rear side of the second storage compartment 12 and the third storage compartment 13.

The refrigerator 1 may include evaporator ducts 60 and 70 that guide cold air generated by the evaporator 3. The evaporator ducts 60 and 70 may include a first evaporator duct 60 and a second evaporator duct 70. The first evaporator duct 60 may be arranged at a rear side of the second storage compartment 12 and the third storage compartment 13. The second evaporator duct 70 may be arranged at a rear side of the first storage compartment 11.

The cold air generated by the evaporator 3 may be drawn into the interior of the first evaporator duct 60 by an evaporator fan 80. The cold air drawn into the interior of the first evaporator duct 60 may be discharged to the second storage compartment 12 or the third storage compartment 13 through a cold air outlet (not shown) formed in the front. In addition, the cold air drawn into the interior of the first evaporator duct 60 may be guided to an inner flow path 71 of the second evaporator duct 70. The first evaporator duct 60 may be provided with a damper 61 that controls the supply of cold air from the interior of the first evaporator duct 60 to the second evaporator duct 70. A connection duct 90 may be provided between the first evaporator duct 60 and the second evaporator duct 70 to connect the first evaporator duct 60 and the second evaporator duct 70.

The cold air introduced into the inner flow path 71 of the second evaporator duct 70 may be supplied to the first storage compartment 11 through a cold air outlet 72 formed at the front of the second evaporator duct 70.

However, unlike the embodiment described above, the cold air generated by the evaporator 3 may be supplied directly to the second evaporator duct 70 without passing through the first evaporator duct 60. In addition, a separate evaporator 3 may be provided at the rear of the first storage compartment 11 to supply cold air to the second evaporator duct 70.

As such, since the refrigerator 1 according to an embodiment of the disclosure may include a thermoelectric cooling device and a refrigeration cycle device for cooling the first storage compartment 11, a method of supplying cold air to the first storage compartment 11 may include a first method of supplying only cold air generated by the thermoelectric cooling device 300, a second method of supplying only cold air generated by the refrigeration cycle device, and a third method of supplying both cold air generated by the thermoelectric cooling device and cold air generated by the refrigeration cycle device.

The refrigerator 1 may supply cold air to the first storage compartment 11 by any suitable method depending on external and internal conditions. For example, the refrigerator 1 may cool the first storage compartment 11 in either method depending on the temperature of the room in which the refrigerator 1 is installed. In other words, in a case where the room temperature is higher than a predetermined temperature so that cooling by the refrigeration cycle is more efficient than cooling by the thermoelectric cooling device, the first storage compartment 11 may be cooled only with cold air generated by the refrigeration cycle device. Conversely, in a case the room temperature is lower than the predetermined temperature so that cooling by the thermoelectric cooling device is more efficient than cooling by the refrigeration cycle device, the first storage compartment 11 may be cooled only with cold air generated by the thermoelectric cooling device. The refrigerator 1 may operate only the thermoelectric cooling device when it is necessary to reduce noise. The refrigerator 1 may simultaneously supply cold air generated by the thermoelectric cooling device and cold air generated by the refrigeration cycle device to the first storage compartment 11 when it is necessary to cool the first storage compartment 11 rapidly.

As such, according to an embodiment of the disclosure, the refrigerator may include the thermoelectric cooling device and the refrigeration cycle device, but is not limited thereto, and the refrigerator may include simply the thermoelectric cooling device 300.

FIG. 6 is a perspective view illustrating a coupling structure of a thermoelectric module and an upper wall of a main body according to an embodiment of the disclosure. FIG. 7 is a view illustrating a heat dissipation fan and a thermoelectric module according to an embodiment of the disclosure. FIG. 8 is an exploded view illustrating some configurations of the thermoelectric module shown in FIG. 7 according to an embodiment of the disclosure.

Referring to FIGS. 6 to 8, the thermoelectric cooling device 300 may include a thermoelectric module 400. The thermoelectric module 400 may be configured with the thermoelectric element 410, the heat sink 420, the cooling sink 430, and the thermoelectric element sealing portion 500 assembled as a unit. Stated differently, the thermoelectric module 400 may include the thermoelectric element 410, the heat sink 420, the cooling sink 430, and the thermoelectric element sealing portion 500.

The thermoelectric module 400 may be coupled to the upper wall 110 of the main body 100 via a separate coupling member S. The thermoelectric module 400 may be configured to penetrate a through-hole 111 of the upper wall 110 such that the heat sink 420 is located on the outside of the main body 100 and the cooling sink 430 is located on the inside of the first storage compartment 11. A sealing member 450 for sealing may be provided between a plate portion 440, which will be described later, and the upper surface of the upper wall 110.

The thermoelectric module 400 may include a wire 413 connected to the thermoelectric element 410 to provide power to the thermoelectric element 410. One end of the wire 413 may be coupled to one surface of the thermoelectric element 410.

The wire 413 may include a first wire 4131 and a second wire 4132. One end 4131a (see FIG. 13) of the first wire 4131 may be coupled to one end of one surface of the thermoelectric element 410. One end 4132a(see FIG. 13) of the second wire 4132 may be coupled to the other end of one surface of the thermoelectric element 410.

The thermoelectric module 400 may include the plate portion 440 disposed between the heat sink 420 and the cooling sink 430. The plate portion 440 may serve as a framework of the thermoelectric module 400. The plate portion 440 may be formed of a resin material with low thermal conductivity. The plate portion 440 may maintain a gap between the heat sink 420 and the cooling sink 430, and may support the heat sink 420 and the cooling sink 430. The plate portion 440 may be integrally formed with a fan case 620, which will be described later. However, it is also possible for the plate portion 440 to be provided separately from the fan case 620.

The plate portion 440 may include a first base plate 441 configured to support the heat sink 420. The first base plate 441 may be provided in a substantially flat shape.

The plate portion 440 may include a plate opening 442 that is open and formed in the up-and-down direction. The plate opening 442 may be provided in a central portion of the first base plate 441. The thermoelectric element 410 may be disposed inside the plate opening 442. The thermoelectric element sealing portion 500 may be disposed inside the plate opening 442. The thermoelectric element sealing portion 500 may be secured by a protrusion 443 protruding from an inner surface of the plate opening 442. This will be described in more detail later.

A length of the plate opening 442 in the up-and-down direction may be larger than a length of the thermoelectric element 410 in the up-and-down direction, and the thermoelectric element 410 may be disposed at an upper end portion of the plate opening 442. The reason why the thermoelectric element 410 is disposed at the upper end portion of the plate opening 442 is that a heat generation amount of the thermoelectric element 410 is typically higher than a heat absorption amount, and the positioning of the thermoelectric element 410 at the upper end portion side of the plate opening 442 may be advantageous for heat dissipation of the heat generating portion 411.

As such, since the thermoelectric element 410 is disposed on the upper end portion side of the plate opening 442, the cooling sink 430 may include a cooling conduction portion 433 protruding from the cooling sink base 431 toward the heat absorbing portion 412 for contact with the heat absorbing portion 412 of the thermoelectric element 410.

The plate portion 440 may include a second base plate 444. The second base plate 444 may be provided in step with the first base plate 441. The second base plate 444 may be provided on one side of the plate opening 442.

The thermoelectric module 400 may include a sink insulation 460 provided between the plate portion 440 and the cooling sink 430. The sink insulation 460 may prevent heat from being transferred between the heat sink 420 and the cooling sink 430 through the plate portion 440.

The sink insulation 460 may include a sink insulation opening 461. The cooling conduction portion 433 may be disposed in the sink insulation opening 461. The thermoelectric element sealing portion 500 may be disposed in the sink insulation opening 461.

The sink insulation 460 may be eliminated. In this case, the heat sink 420 may be supported on an upper surface of the plate portion 440, and the cooling sink 430 may be supported on a lower surface of the plate portion 440.

The thermoelectric cooling device 300 may include the fan case 620 in which the heat dissipation fan 600 is installed and which guides air blown by the heat dissipation fan 600. The fan case 620 may be integrally formed with the plate portion 440 or may be provided separately.

The fan case 620 may include a case bottom 621 on which the heat dissipation fan 600 is rotatably mounted, and a case scroll portion 622 extending upwardly from a rim of the case bottom 621 to guide air blown from the heat dissipation fan 600 toward the heat sink 420. The heat dissipation fan 600 may be a centrifugal fan, and may be mounted to the case bottom 621 such that the rotational shaft 610 is perpendicular to the case bottom 621. In addition, the heat dissipation fan 600 may be provided such that the heat sink 420 is positioned in a radial direction of the heat dissipation fan 600. With such a structure, the overall vertical length of the thermoelectric cooling device 300 may be compact.

The case scroll portion 622 may be formed to surround the heat dissipation fan 600. The fan case 620 may include a case guide 623 configured to guide air flowing from the heat dissipation fan 600 around a downstream end 622a of the case scroll portion 622. The case guide 623 may guide air blown by the heat dissipation fan 600 to flow in a direction substantially toward the thermoelectric element 410.

FIG. 9 is a view illustrating a state in which a thermoelectric element and a thermoelectric element sealing portion are disposed inside a plate opening, according to an embodiment of the disclosure. FIG. 10 is a view illustrating a thermoelectric element sealing portion according to an embodiment of the disclosure. FIG. 11 is a cross-sectional view taken along line B-B' indicated in FIG. 10 according to an embodiment of the disclosure. FIG. 12 is a cross-sectional view taken along line C-C' indicated in FIG. 10 according to an embodiment of the disclosure. FIG. 13 is an exploded view of the thermoelectric element and the thermoelectric element sealing portion shown in FIG. 9 according to an embodiment of the disclosure. FIG. 14 is an exploded view from above of a thermoelectric element and a thermoelectric element sealing portion, according to an embodiment of the disclosure. FIG. 15 is an exploded view from below of the thermoelectric element and the thermoelectric element sealing portion shown in FIG. 14 according to an embodiment of the disclosure.

Referring to FIGS. 9 to 15, the thermoelectric element sealing portion 500 may include a lower sealing portion 530 and an upper sealing portion 540. The lower sealing portion 530 and the upper sealing portion 540 may be coupled to each other to form a thermoelectric element cover portion 510 that covers an outer surface of the thermoelectric element 410 and a wire cover portion 520 that covers the wires 413, respectively. In other words, the thermoelectric element sealing portion 500 may include the lower sealing portion 530 and the upper sealing portion 540 configurationally, and may include the thermoelectric element cover portion 510 and the wire cover portion 520 functionally. In the following, the function of the thermoelectric element sealing portion 500 will be discussed first, with a description of the thermoelectric element cover portion 510 and the wire cover portion 520.

Referring to FIGS. 9 to 12, the thermoelectric element sealing portion 500 may include the thermoelectric element cover portion 510. The thermoelectric element cover portion 510 may be provided on the outer surface of the thermoelectric element 410 to cover the thermoelectric element 410. Specifically, the thermoelectric element 410 may be inserted into an element insertion hole 511 formed in a central portion of the thermoelectric element cover portion 510.

The thermoelectric element cover portion 510 may seal between the heat sink 420 and the cooling sink 430. With such a configuration, the thermoelectric element 410 may be received in an enclosed space in the front-to-back (X-axis direction), left-to-right (Y-axis direction), and up-and-down (Z-axis direction) directions. Specifically, the thermoelectric element 410 may be sealed by the thermoelectric element cover portion 510 in the front-to-back and left-to-right directions, and may be sealed by the heat sink 420 and the cooling sink 430 in the up-and-down direction.

The thermoelectric element sealing portion 500 may include the wire cover portion 520 that covers at least a portion of the wires 413. The wire cover portion 520 may cover one end of the wires 413. The wire cover portion 520 may include a first wire cover portion 521 that covers the one end 4131a of the first wire 4131 and a second wire cover portion 522 that covers the one end 4132a of the second wire 4132.

The first wire cover portion 521 may be integrally formed with the thermoelectric element cover portion 510. Stated differently, the first wire cover portion 521 may be connected to the thermoelectric element cover portion 510. With such a configuration, the thermoelectric element sealing portion 500 may cover a portion where the thermoelectric element 410 and the first wire 4131 are connected.

The second wire cover portion 522 may be integrally formed with the thermoelectric element cover portion 510. Stated differently, the second wire cover portion 522 may be connected to the thermoelectric element cover portion 510. With such a configuration, the thermoelectric element sealing portion 500 may cover a portion where the thermoelectric element 410 and the second wire 4132 are connected.

A substrate, an electrode, and the like may be provided inside the thermoelectric element 410, and a sealing member (not shown) may be applied for primary protection of the configurations described above. Such sealing member (not shown) may include a material different from a material of the wires 413 connected to the thermoelectric element 410. For example, the material of the sealing member (not shown) may include silicone, and the material of the wires 413 may include Teflon.

Because the sealing member (not shown) and the wires 413 are made of different materials, in a process of coupling one end of the wire 413 to one surface of the thermoelectric element 410, the thermoelectric element 410 and the wire 413 may not be properly connected. When the thermoelectric element 410 and the wire 413 are not properly connected, a gap may be formed between the thermoelectric element 410 and the wire 413, and moisture from the surroundings may penetrate into the gap and damage the thermoelectric element 410 or the wire 413.

According to the concept of the disclosure, the thermoelectric element sealing portion 500 may cover a portion where the thermoelectric element 410 and the wire 413 are connected, thereby preventing moisture from penetrating into a gap that may be formed between the thermoelectric element 410 and the wire 413.

The first wire cover portion 521 may include a wire insertion hole 521a into which the first wire 4131 is arranged to be inserted. A cross-section of the first wire insertion hole 521a may be substantially circular. However, the disclosure is not limited thereto.

The first wire cover portion 521 may include a first inner protrusion 521b protruding from an inner circumferential surface of the first wire insertion hole 521a. The first inner protrusion 521b may be configured to hold the first wire 4131 inserted into the first wire cover portion 521. In addition, the first inner protrusion 521b may seal between the first wire 4131 and the first wire insertion hole 521a. With such a configuration, the first inner protrusion 521b may prevent moisture from penetrating into the thermoelectric element 410 through the first wire insertion hole 521a.

The first inner protrusion 521b may be provided in a plurality. The plurality of first inner protrusions 521b may be arranged to be spaced apart from each other along a direction in which the first wire insertion hole 521a extends. With such a configuration, even though one portion of the first wire 4131 has a relatively thin thickness, when another portion of the first wire 4131 has a relatively thick thickness, the thicker portion of the first wire 4131 may be held by some of the plurality of first inner protrusions 521b, so that the first wire 4131 may be firmly held within the first wire insertion hole 521a.

The second wire cover portion 522 may include a wire insertion hole 522a into which the second wire 4132 is arranged to be inserted. A cross-section of the second wire insertion hole 522a may be substantially circular. However, the disclosure is not limited thereto.

The second wire cover portion 522 may include a second inner protrusion 522b protruding from an inner circumferential surface of the second wire insertion hole 522a. The second inner protrusion 522b may be configured to hold the second wire 4132 inserted into the second wire cover portion 522. In addition, the second inner protrusion 522b may seal between the second wire 4132 and the second wire insertion hole 522a. With such a configuration, the second inner protrusion 522b may prevent moisture from penetrating into the thermoelectric element 410 through the second wire insertion hole 522a.

The second inner protrusions 522b may be provided in a plurality. The plurality of second inner protrusions 522b may be arranged to be spaced apart from each other along a direction in which the second wire insertion hole 522a extends. With such a configuration, even though one portion of the second wire 4132 has a relatively thin thickness, when another portion of the second wire 4132 has a relatively thick thickness, the thicker portion of the second wire 4132 may be held by some of the plurality of second inner protrusions 522b, so that the second wire 4132 may be firmly held within the second wire insertion hole 522a.

The thermoelectric element sealing portion 500 may include an elastic material. With such a configuration, the sealing effect of the thermoelectric element sealing portion 500 may be improved. The thermoelectric element sealing portion 500 may include a material having a low thermal conductivity. With such a configuration, heat conduction from the thermoelectric element 410 to the plate portion 440 may be reduced. For example, the thermoelectric element sealing portion 500 may include ethylene propylene diene monomer (EPDM) or silicone. However, the disclosure is not limited thereto.

Referring to FIGS. 13 to 15, the thermoelectric element sealing portion 500 may include the lower sealing portion 530 and the upper sealing portion 540. As described above, the lower sealing portion 530 and the upper sealing portion 540 may be coupled to each other to form the thermoelectric element cover portion 510 and the wire cover portion 520.

The lower sealing portion 530 may be provided on a lower side of the upper sealing portion 540. The lower sealing portion 530 may be supported by the cooling sink 430. Specifically, the lower sealing portion 530 may be supported by the cooling sink base 431. The lower sealing portion 530 may cover an outer surface of a lower portion of the thermoelectric element 410 and a lower portion of the wire 413.

The lower sealing portion 530 may include a lower sealing body 531 that forms an overall appearance of the lower sealing portion 530. The lower sealing body 531 may include a lower element insertion hole 531a opened in a central portion.

In the lower element insertion hole 531a, a lower portion of the thermoelectric element 410 may be inserted. With such a configuration, the lower sealing body 531 may cover the outer surface of the lower portion of the thermoelectric element 410. In addition, the cooling conduction portion 433 may be inserted into the lower element insertion hole 531a. With such a configuration, the lower sealing body 531 may cover an outer surface of the cooling conduction portion 433.

Specifically, the cooling conduction portion 433 may be disposed to contact the lower portion of the thermoelectric element 410 by protruding from the cooling sink base 431 toward the heat absorbing portion 412 of the thermoelectric element 410, and the lower sealing body 531 may cover both the lower portion of the thermoelectric element 410 and the cooling conduction portion 433, which are disposed to be in contact with each other.

The lower sealing portion 530 may include a lower protrusion 532 protruding downwardly from a lower surface of the lower sealing body 531. The lower protrusion 532 may be formed along a rim of the lower element insertion hole 531a. The lower protrusion 532 may be configured to seal between the cooling sink 430 and the lower sealing body 531.

The lower protrusion 532 may have one end in contact with the cooling sink base 431. A length of the lower protrusion 532 in the up-and-down direction may be smaller than a width between the lower surface of the lower sealing body 531 and the cooling sink base 431, and accordingly, the lower protrusion 532 may be compressed between the lower sealing body 531 and the cooling sink base 431. With such a configuration, the lower protrusion 532 may seal between the cooling sink 430 and the lower sealing body 531.

The lower protrusion 532 may be provided in a plurality. The plurality of lower protrusions 532 may be disposed spaced apart from each other. While only two lower protrusions 532 are shown in the drawings, the number of lower protrusions 532 is not limited thereto.

The lower sealing portion 530 may include a first wire insertion groove 533a into which a lower portion of the first wire 4131 is arranged to be inserted. The first wire insertion groove 533a may be formed by recessing into an upper surface of the lower sealing body 531. A cross-section of the first wire insertion groove 533a may be substantially semicircular in shape. As will be described later, the first wire insertion groove 533a may form the first wire insertion hole 521a together with a third wire insertion groove 543a.

The lower sealing portion 530 may include a first protrusion 534a protruding from an inner surface of the first wire insertion groove 533a. On the first protrusion 534a, the lower portion of the first wire 4131 may be disposed. As will be described later, the first protrusion 534a may form the first inner protrusion 521b together with a third protrusion 544a.

The first protrusion 534a may be provided in a plurality. Each of the plurality of first protrusions 534a may be arranged to be spaced apart from each other along a direction in which the first wire insertion groove 533a extends.

The lower sealing portion 530 may include a second wire insertion groove 533b into which a lower portion of the second wire 4132 is arranged to be inserted. The second wire insertion groove 533b may be formed by recessing into the upper surface of the lower sealing body 531. A cross-section of the second wire insertion groove 533b may be substantially semicircular in shape. As will be described later, the second wire insertion groove 533b may form the second wire insertion hole 522a together with a fourth wire insertion groove 543b.

The lower sealing portion 530 may include a second protrusion 534b protruding from an inner surface of the second wire insertion groove 533b. On the second protrusion 534b, the lower portion of the second wire 4132 may be disposed. As will be described later, the second protrusion 534b may form the second inner protrusion 522b together with a fourth protrusion 544b.

The second protrusions 534b may be provided in a plurality. Each of the plurality of second protrusions 534b may be arranged to be spaced apart from each other along a direction in which the second wire insertion groove 533b extends.

The upper sealing portion 540 may be provided on an upper side of the lower sealing portion 530. The upper sealing portion 540 may be supported by the heat sink 420. Specifically, the upper sealing portion 540 may be supported by the heat sink base 421. The upper sealing portion 540 may cover an upper outer surface of the thermoelectric element 410 and an upper portion of the wire 413.

The upper sealing portion 540 may include an upper sealing body 541 that forms an overall appearance of the upper sealing portion 540. The upper sealing body 541 may include an upper element insertion hole 541a opened in a central portion.

In the upper element insertion hole 541, an upper portion of the thermoelectric element 410 may be inserted. With such a configuration, the upper sealing body 541 may cover the upper outer surface of the thermoelectric element 410.

The upper sealing portion 540 may include an upper protrusion 542 protruding upwardly from an upper surface of the upper sealing body 541. The upper protrusion 542 may be formed along a rim of the upper element insertion hole 541a. The upper protrusion 542 may be configured to seal between the heat sink 420 and the upper sealing body 541.

The upper protrusion 542 may have one end in contact with the heat sink base 421. A length of the upper protrusion 542 in the up-and-down direction may be smaller than a width between the upper surface of the upper sealing body 541 and the heat sink base 421, and accordingly, the upper protrusion 542 may be compressed between the upper sealing body 541 and the heat sink base 421. With such a configuration, the upper protrusion 542 may seal between the heat sink 420 and the upper sealing body 541.

The upper protrusions 542 may be provided in a plurality. The plurality of upper protrusions 542 may be disposed spaced apart from each other. While only two upper protrusions 542 are shown in the drawings, the number of upper protrusions 542 is not limited thereto.

The upper sealing portion 540 may include the third wire insertion groove 543a into which an upper portion of the first wire 4131 is arranged to be inserted. The third wire insertion groove 543a may be formed by recessing into a lower surface of the upper sealing body 541. A cross-section of the third wire insertion groove 543a may be substantially semicircular in shape. The third wire insertion groove 543amay form the first wire insertion hole 521atogether with the first wire insertion groove 533a.

The upper sealing portion 540 may include the third protrusion 544a protruding from an inner surface of the third wire insertion groove 543a. On the third protrusion 544a, the lower portion of the first wire 4131 may be disposed. The third protrusion 544a may form the first inner protrusion 521b together with the first protrusion 534a.

The third protrusion 544a may be provided in a plurality. Each of the plurality of third protrusions 544a may be arranged to be spaced apart from each other along a direction in which the third wire insertion groove 543a extends. Each of the plurality of third protrusions 544a may be disposed at a position corresponding to a position of each of the plurality of first protrusions 534a.

The upper sealing portion 540 may include the fourth wire insertion groove 543b into which an upper portion of the second wire 4132 is arranged to be inserted. The fourth wire insertion groove 543b may be formed by recessing into the lower surface of the upper sealing body 541. A cross-section of the fourth wire insertion groove 543b may be substantially semicircular in shape. The fourth wire insertion groove 543b may form the second wire insertion hole 522a together with the second wire insertion groove 533b.

The upper sealing portion 540 may include the fourth protrusion 544bprotruding from an inner surface of the fourth wire insertion groove 543b. On the fourth protrusion 544, the lower portion of the second wire 4132 may be disposed. The fourth protrusion 544bmay form the second inner protrusion 522btogether with the second protrusion 534b.

The fourth protrusions 544b may be provided in a plurality. Each of the plurality of fourth protrusions 544bmay be arranged to be spaced apart from each other along a direction in which the fourth wire insertion groove 543b extends. Each of the plurality of fourth protrusions 544b may be disposed at a position corresponding to a position of each of the plurality of second protrusions 534b.

As used herein, the ordinals “first,” “second,” “third” and “fourth” of the first wire insertion groove 533a, the second wire insertion groove 533b, the third wire insertion groove 543a, and the fourth wire insertion groove 543b do not limit the configuration. In addition, the ordinals “first,” “second,” “third” and “fourth” of the first protrusion 534a, the second protrusion 534b, the third protrusion 544a, and the fourth protrusion 544b do not limit the configuration.

The lower sealing portion 530 and the upper sealing portion 540 may be detachably coupled to each other. Specifically, the lower sealing portion 530 may include a sealing body coupling portion 535 formed to be recessed on the upper surface of the lower sealing body 531. The upper sealing portion 540 may include a coupling protrusion 545 protruding downwardly from the lower surface of the upper sealing body 541. The coupling protrusion 545 of the upper sealing portion 540 may be inserted into the sealing body coupling portion 535 of the lower sealing portion 530, and accordingly, the upper sealing portion 540 may be coupled to the lower sealing portion 530.

According to the spirit of the disclosure, the thermoelectric element sealing portion 500 may be formed by the coupling of the lower sealing portion 530 and the upper sealing portion 540, and does not require a separate conformal coating. Therefore, damage to the thermoelectric element sealing portion 500 due to volume changes of the coating may not occur, and the entire assembly process may be accelerated by omitting a process of curing the coating. In other words, durability and assemblability of the thermoelectric element sealing portion 500 may be further improved.

The lower sealing portion 530 and the upper sealing portion 540, which are coupled to each other, may be secured between the heat sink 420 and the cooling sink 430. Stated differently, the mutually coupled lower sealing portion 530 and upper sealing portion 540 may be secured within the plate opening 442. A further description how the mutually coupled lower sealing portion 530 and upper sealing portion 540 are secured will be described later.

FIG. 16 is a cross-sectional view illustrating a state in which a thermoelectric element sealing portion is secured within a plate opening, according to an embodiment of the disclosure. FIG. 17 is a cross-sectional view illustrating a state in which a thermoelectric element sealing portion is secured within a plate opening, according to an embodiment of the disclosure.

Referring to FIGS. 16 and 17, the plate portion 440 may include the protrusion 443 protruding from the inner surface of the plate opening 442. The protrusion 443 may be provided at a central portion of the inner surface of the plate opening 442. A direction in which the protrusion 443 protrudes may be inwardly of the plate opening 442. The protrusion 443 may extend in a direction parallel to the thermoelectric element 410. Stated differently, the protrusion 443 may extend in a direction parallel to the cooling sink base 431.

The lower sealing portion 530 may include a recessed portion 536 formed to be recessed on an outer surface of the lower sealing body 531. The protrusion 443 may be inserted into the recessed portion 536. As the recessed portion 536 is inserted into the protrusion 443, the lower sealing portion 530 may be secured within the plate opening 442. Furthermore, as the upper sealing portion 540 is coupled to the lower sealing portion 530, the upper sealing portion 540 may also be secured within the plate opening 442. In other words, the lower sealing portion 530 and the upper sealing portion 540, which are coupled to each other, may be secured inside the plate opening 442.

As described above, with the protrusion 443 inserted into the recessed portion 536, an upper surface of the protrusion 443 may press against an upper portion of the lower sealing body 531, and a lower surface of the protrusion 443 may press against a lower portion of the lower sealing body 531. When the protrusion 443 presses the lower sealing body 531 in the up-and-down direction, both the lower sealing portion 530 and the upper sealing portion 540, which are coupled to each other, may be compressed in the up-and-down direction. Accordingly, the thermoelectric element sealing portion 500 may more effectively seal between the heat sink 420 and the cooling sink 430.

FIG. 18 is a plan view illustrating a state in which a thermoelectric element is disposed on a lower sealing portion, according to an embodiment of the disclosure.

Referring to FIGS. 13 and 18, the plate portion 440 may include a first seating portion 445ain which the first wire cover portion 521 is arranged to be seated. The first seating portion 445a may be provided on one side on the second base plate 444. The shape and size of the first seating portion 445amay correspond to the shape and size of a cross-section of the first wire cover portion 521.

The plate portion 440 may include a second seating portion 445bin which the second wire cover portion 522 is arranged to be seated. The second seating portion 445b may be provided on the other side on the second base plate 444. The shape and size of the second seating portion 445bmay correspond to the shape and size of a cross-section of the second wire cover portion 522.

The plate portion 440 may include a rib 446 that forms the first seating portion 445a and the second seating portion 445b. The rib 446 may protrude upwardly from the second base plate 444. Each of the first seating portion 445a and the second seating portion 445b may be disposed between the rib 446 and the plate opening 442.

The plate portion 440 may include a first wire retaining portion 447aconfigured to retain the first wire 4131. The first wire retaining portion 447amay be provided on the second base plate 444. The first wire retaining portion 447amay be disposed adjacent to the first seating portion 445a. Specifically, the first wire retaining portion 447amay be disposed adjacent to the first wire insertion hole 521a of the first wire cover portion 521 seated on the first seating portion 445a. The first wire retaining portion 447a may be connected to the rib 446.

The plate portion 440 may include a second wire retaining portion 447b configured to retain the second wire 4132. The second wire retaining portion 447b may be provided on the second base plate 444. The second wire retaining portion 447b may be disposed adjacent to the second seating portion 445b. Specifically, the second wire retaining portion 447b may be disposed adjacent to the second wire insertion hole 522a of the second wire cover portion 522 seated on the second seating portion 445b. The second wire retaining portion 447b may be connected to the rib 446.

The first wire retaining portion 447a and the second wire retaining portion 447b may facilitate a process of assembling the thermoelectric element 410 and the thermoelectric element sealing portion 500 to the plate portion 440. Hereinafter, with reference to FIGS. 13 and 18, the process of assembling the thermoelectric element 410 and the thermoelectric element sealing portion 500 to the plate portion 440 will be briefly discussed.

First, the lower sealing portion 530 may be coupled to the plate portion 440. Specifically, the lower sealing portion 530 may be coupled to the plate portion 440 by inserting the protrusion 443 of the plate portion 440 into the recessed portion 536 of the lower sealing portion 530. At this time, the thermoelectric element cover portion 510 may be disposed inside the plate opening 442, the first wire cover portion 521 may be disposed on the first seating portion 445a, and the second wire cover portion 522 may be disposed on the second seating portion 445b.

Then, the thermoelectric element 410, to which the wire 413 is connected, may be disposed on the lower sealing portion 530. The thermoelectric element 410 may be disposed to be placed on an upper side of the plate opening 442, the first wire 4131 may be disposed on the first wire insertion groove 533a, and the second wire 4132 may be disposed on the second wire insertion groove 533b.

At this time, the first wire retaining portion 447a may retain the first wire 4131, and the second wire retaining portion 447b may retain the second wire 4132, so that the first wire 4131 and the second wire 4132 may always be disposed at the same position. Thus, the process of assembling the thermoelectric element 410 and the thermoelectric element sealing portion 500 to the plate portion 440 may be facilitated.

The upper sealing portion 540 may then be coupled to the lower sealing portion 530. Specifically, the upper sealing portion 540 and the lower sealing portion 530 may be coupled by inserting the coupling protrusion 545 of the upper sealing portion 540 into the sealing body coupling portion 535 of the lower sealing portion 530.

FIG. 19 is an exploded view from above of some configurations of a thermoelectric element and a thermoelectric element sealing portion, according to an embodiment of the disclosure.

Hereinafter, with reference to FIG. 19, a thermoelectric element sealing portion 501 according to an embodiment of the disclosure will be described. In describing the thermoelectric element sealing portion 501, the same reference numerals are assigned to configurations substantially the same as those illustrated in FIGS. 1 to 18, and further description thereof may be omitted.

Referring to FIG. 19, the wire cover portion 520 may include a lower wire cover 5201 that covers a lower portion of the wire 413 and an upper wire cover 5202 that covers an upper portion of the wire 413. Specifically, the lower wire cover 5201 may cover a lower portion of each of the first wire 4131 and the second wire 4132, and the upper wire cover 5202 may cover an upper portion of each of the first wire 4131 and the second wire 4132.

The lower wire cover 5201 may be integrally formed with the thermoelectric element cover portion 510. In other words, whereas the thermoelectric element cover portion 510 shown in FIGS. 1 to 18 may be formed by the coupling of the lower sealing portion 530 and the upper sealing portion 540, the thermoelectric element cover portion 510 shown in FIG. 19 may be integrally formed, rather than separated into different configurations.

The upper wire cover 5202 may be detachably coupled to the lower wire cover 5201. Specifically, the upper wire cover 5202 may include an upper wire cover coupling portion 5202a protruding downwardly from a lower surface, and the lower wire cover 5201 may include a lower wire cover coupling portion 5201a formed to be recessed on an upper surface. By inserting the upper wire cover coupling portion 5202a into the lower wire cover coupling portion 5201a, the upper wire cover 5202 may be coupled to the lower wire cover 5201. When the upper wire cover 5202 and the lower wire cover 5201 are coupled, the wire cover portion 520 may completely cover the wire 413.

FIG. 20 is a view illustrating a thermoelectric element and a thermoelectric element sealing portion, according to an embodiment of the disclosure.

Hereinafter, a thermoelectric element sealing portion 502 according to an embodiment of the disclosure will be described with reference to FIG. 20. In describing the thermoelectric element sealing portion 502, the same reference numerals are assigned to configurations substantially the same as those illustrated in FIGS. 1 to 18, and further description thereof may be omitted.

Referring to FIG. 20, the thermoelectric element sealing portion 502 may be integrally formed. In other words, whereas the thermoelectric element sealing portion 500 shown in FIGS. 1 to 18 may be separated into the lower sealing portion 530 and the upper sealing portion 540, the thermoelectric element sealing portion 502 shown in FIG. 20 may be integrally formed, rather than separated into different configurations.

The thermoelectric element sealing portion 502 may include a cutout portion 502ainto which the thermoelectric element 410 is arranged to be inserted. The cutout portion 502amay be formed by an incision in one surface of the thermoelectric element sealing portion 502. Specifically, the cutout portion 502amay be formed by cutting out one surface on which the wire cover portion 520 is provided.

The cutout portion 502a may be open or closed in the up-and-down direction. When the cutout portion 502ais opened in the up-and-down direction, the thermoelectric element 410 may be inserted into the thermoelectric element sealing portion 500 and covered by the thermoelectric element cover portion 510. When the thermoelectric element 410 is fully inserted into the thermoelectric element sealing portion 500, the cutout portion 502a may be closed, thereby preventing ambient moisture from penetrating into the thermoelectric element 410 through the cutout portion 502a.

The refrigerator 1 according to an embodiment may include the main body 100, the thermoelectric element 410 including the heat generating portion 411 and the heat absorbing portion 412, the thermoelectric element 410 being provided on the upper wall 110 of the main body 100 such that the heat generating portion 411 faces upward of the thermoelectric element 410 and the heat absorbing portion 412 faces downward of the thermoelectric element 410, the heat sink 420 provided on an upper side of the thermoelectric element 410 to contact the heat generating portion 411, the cooling sink 430 provided on a lower side of the thermoelectric element 410 to contact the heat absorbing portion 412, and the thermoelectric element sealing portion 500 or 501 or 502 configured to cover an outer surface of the thermoelectric element 410 and to seal between the heat sink 420 and the cooling sink 430. The thermoelectric element sealing portion 500 or 501 or 502 may include the wire cover portion 520 or 521 or 522 configured to cover the wires 4131 and 4132 connected to the thermoelectric element 410.

One end 4131a or 4132a of the wire 4131 or 4132 may be coupled to one surface of the thermoelectric element 410. The wire cover portion 521 or 522 may cover the one end 4131a or 4132a of the wire 4131 or 4132.

The wire cover portion 521 or 522 may include the wire insertion hole 521aor 522ainto which the wire 4131 or 4132 is arranged to be inserted, and the inner protrusion 521b or 522b protruding from an inner circumferential surface of the wire insertion hole 521a or 522a.

The inner protrusion 521bor 522b may be provided in a plurality. The plurality of inner protrusions 521b or 522bmay be arranged to be spaced apart from each other along a direction in which the wire insertion hole 521a or 522a extends.

The thermoelectric element sealing portion 500 may further include the lower sealing portion 530 supported by the cooling sink 430, and the upper sealing portion 540 supported by the heat sink 420 and detachably coupled to the lower sealing portion 530. The wire cover portion 520 may be formed by coupling of the lower sealing portion 530 and the upper sealing portion 540.

The lower sealing portion 530 may include the lower sealing body 531 configured to cover an outer surface of a lower portion of the thermoelectric element 410, and the lower protrusion 532 protruding downwardly from a lower surface of the lower sealing body 531, the lower protrusion 532 being configured to seal between the cooling sink 430 and the lower sealing body 531.

The cooling sink 430 may include the cooling sink base 431 in contact with one end of the lower protrusion 532, and the cooling conduction portion 433 protruding from the cooling sink base 431 toward the heat absorbing portion 412. The lower sealing body 531 may cover an outer surface of the cooling conduction portion 433.

The upper sealing portion 540 may include the upper sealing body 541 configured to cover an outer surface of an upper portion of the thermoelectric element 410, and the upper protrusion 542 protruding upwardly from an upper surface of the upper sealing body 541, the upper protrusion 542 being configured to seal between the heat sink 420 and the upper sealing body 541.

The lower sealing portion 530 may include the lower sealing body 531 configured to cover an outer surface of a lower portion of the thermoelectric element 410, and the sealing body coupling portion 535 formed to be recessed on an upper surface of the lower sealing body 531. The upper sealing portion 540 may include the upper sealing body 541 configured to cover an upper outer surface of the thermoelectric element 410, and the coupling protrusion 545 protruding downwardly from a lower surface of the upper sealing body 541, the coupling protrusion 545 being inserted into the sealing body coupling portion to couple the upper sealing portion 540 to the lower sealing portion 530.

The refrigerator may further include the plate portion 440 disposed between the heat sink 420 and the cooling sink 430. The plate portion 440 may include the base plate 441 configured to support the heat sink 420, and the plate opening 442 provided in a central portion of the base plate 441. The lower sealing portion 530 may be secured within the plate opening 442.

The plate portion 440 may further include the protrusion 443 protruding from an inner surface of the plate opening 442. The lower sealing portion 530 may include the lower sealing body 531 configured to cover an outer surface of a lower portion of the thermoelectric element 410, and the recessed portion 536 formed to be recessed on an outer surface of the lower sealing body 531, wherein the protrusion 443 is inserted into the recessed portion 536 to secure the lower sealing portion 530 within the plate opening 442.

The base plate 441 may be the first base plate 441. The plate portion 440 may further include the second base plate 444 disposed at a different level from the first base plate 441 and provided on one side of the plate opening 442, and the wire retaining portion 447a or 447b provided on the second base plate 444 and configured to retain the wire 4131 or 4132.

The plate portion 440 may include the seating portion 445aor 445bon which the wire cover portion 521 or 522 is arranged to be seated, and the rib 446 protruding upwardly from the second base plate 444 to form the seating portion 445a or 445b. The wire retaining portion 447aor 447bmay be connected to the rib 446.

The wire cover portion 520 may include the lower wire cover 5201 configured to cover a lower portion of the wires 4131 and 4132, and the upper wire cover 5202 configured to cover an upper portion of the wires 4131 and 4132 and be detachably coupled to the lower wire cover 5201.

The thermoelectric element sealing portion 502 may include a cutout portion 502aformed by cutting out one surface on which the wire cover portion 520 is provided, the cutout portion 502a being provided for the thermoelectric element 410 to be inserted.

The refrigerator 1 according to an embodiment may include the main body 100, the thermoelectric element 410 including the heat generating portion 411 on an upper surface and the heat absorbing portion 412 on a lower surface, the wires 4131 and 4132 connected to the thermoelectric element 410 to provide power to the thermoelectric element 410, the heat sink 420 provided on an upper side of the thermoelectric element 410 to contact the heat generating portion 411, the cooling sink 430 provided on a lower side of the thermoelectric element 410 to contact the heat absorbing portion 412, and the thermoelectric element sealing portion 500 configured to cover an outer surface of the thermoelectric element 410 to prevent moisture from penetrating into the thermoelectric element 410. The thermoelectric element sealing portion 500 may include the lower sealing portion 530 configured to cover a lower outer surface of the thermoelectric element 410 and a lower portion of the wires 4131 and 4132, and the upper sealing portion 540 configured to cover an upper outer surface of the thermoelectric element 410 and an upper portion of the wires 4131 and 4132, and detachably coupled to the lower sealing portion 530.

The lower sealing portion 530 may include the lower sealing body 531 configured to cover a lower outer surface of the thermoelectric element 410, and the first wire insertion grooves 533a and 533b formed to be recessed on an upper surface of the lower sealing body 531 for a lower portion of the wires 4131 and 4132 to be inserted. The upper sealing portion 540 may include the upper sealing body 541 configured to cover an upper outer surface of the thermoelectric element 410, and the second wire insertion grooves 543a and 543b formed to be recessed on a lower surface of the upper sealing body 541 for an upper portion of the wires 4131 and 4132 to be inserted.

The lower sealing portion 530 may include the first protrusions 534aand 534b protruding from an inner surface of the first wire insertion groove 533a and 533b. The upper sealing portion 540 may include the second protrusions 544aand 544b protruding from an inner surface of the second wire insertion grooves 543a and 543b.

Each of the first protrusions 534a and 534b and the second protrusion 544a and 544b may be provided in a plurality. Each of the plurality of first protrusions 534a and 534b may be arranged to be spaced apart from each other along a direction in which the first wire insertion grooves 533a and 533b extends. Each of the plurality of second protrusions 544a and 544b may be disposed at a position corresponding to a position of each of the plurality of first protrusions 534a and 534b.

The lower sealing portion 530 may include the lower protrusion 532 protruding downwardly from a lower surface of the lower sealing body 531, the lower protrusion 532 being configured to seal between the cooling sink 430 and the lower sealing body 531. The upper sealing portion 540 may include the upper protrusion 542 protruding upwardly from an upper surface of the upper sealing body 541, the upper protrusion 542 being configured to seal between the heat sink 420 and the upper sealing body 541.

According to the concept of the disclosure, the thermoelectric element of the refrigerator may be disposed between the cooling sink and the heat sink, and the thermoelectric element sealing portion may prevent moisture from penetrating into the thermoelectric element by sealing between the cooling sink and the heat sink. Furthermore, the thermoelectric element sealing portion may also prevent moisture from penetrating into a portion where the wire and the thermoelectric element are connected by simultaneously covering the thermoelectric element and one end of the wire connected to the thermoelectric element.

According to the concept of the disclosure, since a conformal coating is not required for manufacturing the thermoelectric element sealing portion of the refrigerator, damage to the thermoelectric element sealing portion due to volume changes of the coating may be prevented, and the process of curing the coating is omitted, so that the entire assembly process may be accelerated. In other words, durability and assemblability of the thermoelectric element sealing portion may be further improved.

The effects to be obtained from the disclosure are not limited to the effects mentioned above, and other unmentioned effects may be clearly understood by those of ordinary skill in the art to which the disclosure pertains from the description below.

While the disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.

Claims

1. A refrigerator, comprising:

a main body;
a thermoelectric element comprising a heat generating portion and a heat absorbing portion, the thermoelectric element being provided on an upper wall of the main body such that the heat generating portion faces upward of the thermoelectric element and the heat absorbing portion faces downward of the thermoelectric element;
a heat sink provided on an upper side of the thermoelectric element to contact the heat generating portion;
a cooling sink provided on a lower side of the thermoelectric element to contact the heat absorbing portion; and
a thermoelectric element sealing portion configured to cover an outer surface of the thermoelectric element and to seal between the heat sink and the cooling sink,
wherein the thermoelectric element sealing portion comprises a wire cover portion configured to cover at least a portion of a wire connected to the thermoelectric element.

2. The refrigerator of claim 1, wherein one end of the wire is coupled to one surface of the thermoelectric element, and wherein the wire cover portion covers the one end of the wire.

3. The refrigerator of claim 1, wherein the wire cover portion comprises:

a wire insertion hole into which the wire is arranged to be inserted, and
an inner protrusion protruding from an inner circumferential surface of the wire insertion hole.

4. The refrigerator of claim 3, wherein the inner protrusion is provided in a plurality, and wherein the plurality of inner protrusions are arranged to be spaced apart from each other along a direction in which the wire insertion hole extends.

5. The refrigerator of claim 1, wherein the thermoelectric element sealing portion further comprises:

a lower sealing portion supported by the cooling sink, and
an upper sealing portion supported by the heat sink and detachably coupled to the lower sealing portion, and
wherein the wire cover portion is formed by coupling of the lower sealing portion and the upper sealing portion.

6. The refrigerator of claim 5, wherein the lower sealing portion comprises:

a lower sealing body configured to cover an outer surface of a lower portion of the thermoelectric element, and
a lower protrusion protruding downwardly from a lower surface of the lower sealing body, the lower protrusion being configured to seal between the cooling sink and the lower sealing body.

7. The refrigerator of claim 6, wherein the cooling sink comprises:

a cooling sink base in contact with one end of the lower protrusion, and
a cooling conduction portion protruding from the cooling sink base toward the heat absorbing portion, and
wherein the lower sealing body covers an outer surface of the cooling conduction portion.

8. The refrigerator of claim 5, wherein the upper sealing portion comprises:

an upper sealing body configured to cover an outer surface of an upper portion of the thermoelectric element, and
an upper protrusion protruding upwardly from an upper surface of the upper sealing body, the upper protrusion being configured to seal between the heat sink and the upper sealing body.

9. The refrigerator of claim 5, wherein the lower sealing portion comprises:

a lower sealing body configured to cover an outer surface of a lower portion of the thermoelectric element, and
a sealing body coupling portion formed to be recessed on an upper surface of the lower sealing body, and
wherein the upper sealing portion comprises: an upper sealing body configured to cover an outer surface of an upper portion of the thermoelectric element, and a coupling protrusion protruding downwardly from a lower surface of the upper sealing body, the coupling protrusion being inserted into the sealing body coupling portion to couple the upper sealing portion to the lower sealing portion.

10. The refrigerator of claim 5, further comprising: a plate portion disposed between the heat sink and the cooling sink, wherein the plate portion comprises:

a base plate configured to support the heat sink, and
a plate opening provided in a central portion of the base plate, and
wherein the lower sealing portion is secured within the plate opening.

11. The refrigerator of claim 10, wherein the plate portion further comprises a protrusion protruding from an inner surface of the plate opening, and wherein the lower sealing portion comprises:

a lower sealing body configured to cover an outer surface of a lower portion of the thermoelectric element, and
a recessed portion formed to be recessed on an outer surface of the lower sealing body, wherein the protrusion is inserted into the recessed portion to secure the lower sealing portion within the plate opening.

12. The refrigerator of claim 10, wherein the base plate is a first base plate, and wherein the plate portion further comprises:

a second base plate configured to be stepped with the first base plate and provided on one side of the plate opening, and
a wire retaining portion provided on the second base plate and configured to retain the wire.

13. The refrigerator of claim 12, wherein the plate portion comprises:

a seating portion on which the wire cover portion is arranged to be seated, and
a rib protruding upwardly from the second base plate to form the seating portion, and
wherein the wire retaining portion is connected to the rib.

14. The refrigerator of claim 1, wherein the wire cover portion comprises:

a lower wire cover configured to cover a lower portion of the wire, and
an upper wire cover configured to cover an upper portion of the wire and be detachably coupled to the lower wire cover.

15. The refrigerator of claim 1, wherein the thermoelectric element sealing portion comprises a cutout portion formed by cutting out one surface on which the wire cover portion is provided, the cutout portion being provided for the thermoelectric element to be inserted.

Patent History
Publication number: 20260258987
Type: Application
Filed: Apr 21, 2026
Publication Date: Sep 3, 2026
Inventors: Dongpil SEO (Suwon-si), Taehyun SUNG (Suwon-si), Seungjin LEE (Suwon-si), Jaebok LEE (Suwon-si)
Application Number: 19/653,812
Classifications
International Classification: F25B 21/02 (20060101);