Headset case
Latest Shenzhen Earfun Technology Co., Ltd. Patents:
Description
The broken lines depict portions of the headset case that form no part of the claimed design.
Claims
The ornamental design for a headset case, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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D945963 | March 15, 2022 | Wu |
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- Earfun Air Pro 2 wireless earbuds, posted at amazon.com, first available Aug. 6, 2021, retrieved on Apr. 11, 2023, online, https://www.amazon.com/EarFun-Cancelling-Earphones-Bluetooth-Headphones/dp/B09C1F6F4K (Year: 2021).
- Occiam wireless earbuds, posted at amazon.com, first available Aug. 31, 2020, retrieved on Apr. 11, 2023, online, https://www.amazon.com/dp/B08H1WNYTR (Year: 2020).
- Tozo T9 wireless earbuds, posted at amazon.com, first available Sep. 15, 2021, retrieved on Apr. 11, 2023, online, https://www.amazon.com/dp/B09G2ZN5FX (Year: 2021).
Patent History
Patent number: D1003043
Type: Grant
Filed: Dec 29, 2021
Date of Patent: Oct 31, 2023
Assignee: Shenzhen Earfun Technology Co., Ltd. (Shenzhen)
Inventor: Hao Xu (Shenzhen)
Primary Examiner: John R Yeh
Assistant Examiner: Dustin Andrew Griffith
Application Number: 29/821,324
Type: Grant
Filed: Dec 29, 2021
Date of Patent: Oct 31, 2023
Assignee: Shenzhen Earfun Technology Co., Ltd. (Shenzhen)
Inventor: Hao Xu (Shenzhen)
Primary Examiner: John R Yeh
Assistant Examiner: Dustin Andrew Griffith
Application Number: 29/821,324
Classifications
Current U.S. Class:
D3/294