Headset
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Description
The broken lines in the drawings illustrate the portions of the headset, which form no part of the claimed design.
Claims
The ornamental design for a headset, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
D470478 | February 18, 2003 | Kohli |
D487077 | February 24, 2004 | Obata |
D512990 | December 20, 2005 | Yang |
D533868 | December 19, 2006 | Koizumi |
D659125 | May 8, 2012 | Katsuraku |
D695723 | December 17, 2013 | Nakagawa |
D907008 | January 5, 2021 | Yao |
308020288 | May 2023 | CN |
- Wireless Ear Clip, first available Mar. 22, 2023 [online], [retrieved Aug. 17, 2023]. Available from the Internet, URL:<https://a.co/d/ilHdefi>. (Year: 2023).
Patent History
Patent number: D1005993
Type: Grant
Filed: Jun 14, 2023
Date of Patent: Nov 28, 2023
Assignee: (Xi'an)
Inventor: Yifei Wu (Xi'an)
Primary Examiner: Dana K Weiland
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/878,002
Type: Grant
Filed: Jun 14, 2023
Date of Patent: Nov 28, 2023
Assignee: (Xi'an)
Inventor: Yifei Wu (Xi'an)
Primary Examiner: Dana K Weiland
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/878,002
Classifications
Current U.S. Class:
Headphone (D14/223)