Headset

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Description

FIG. 1 is a front perspective view of a headset, showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines in the drawings illustrate the portions of the headset, which form no part of the claimed design.

Claims

The ornamental design for a headset, as shown and described.

Referenced Cited
U.S. Patent Documents
D470478 February 18, 2003 Kohli
D487077 February 24, 2004 Obata
D512990 December 20, 2005 Yang
D533868 December 19, 2006 Koizumi
D659125 May 8, 2012 Katsuraku
D695723 December 17, 2013 Nakagawa
D907008 January 5, 2021 Yao
Foreign Patent Documents
308020288 May 2023 CN
Other references
  • Wireless Ear Clip, first available Mar. 22, 2023 [online], [retrieved Aug. 17, 2023]. Available from the Internet, URL:<https://a.co/d/ilHdefi>. (Year: 2023).
Patent History
Patent number: D1005993
Type: Grant
Filed: Jun 14, 2023
Date of Patent: Nov 28, 2023
Assignee: (Xi'an)
Inventor: Yifei Wu (Xi'an)
Primary Examiner: Dana K Weiland
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/878,002
Classifications
Current U.S. Class: Headphone (D14/223)