Wire tie down

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Description

This invention was made with government support under Grant No. 1827652 awarded by the National Science Foundation. The government has certain rights in the invention.

FIG. 1 is a front perspective view of a wire tie down;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a right-side elevation view thereof;

FIG. 5 is a left-side elevation view thereof;

FIG. 6 is a top elevation view thereof; and,

FIG. 7 is a bottom elevation view thereof.

Claims

The ornamental design for a wire tie down, as shown and described.

Referenced Cited
U.S. Patent Documents
D358544 May 23, 1995 Esworthy
D446473 August 14, 2001 Chung
6477973 November 12, 2002 Kobas
D549557 August 28, 2007 Mori
D630425 January 11, 2011 Olaverri
D727787 April 28, 2015 Akana
D763126 August 9, 2016 Akana
D857545 August 27, 2019 Akana
D898556 October 13, 2020 Winekoff
D906870 January 5, 2021 Devaney
D915184 April 6, 2021 Tuthill
D933755 October 19, 2021 Ornstein
D944692 March 1, 2022 Yang
D979049 February 21, 2023 Hartman
D980116 March 7, 2023 Qu
Patent History
Patent number: D1007280
Type: Grant
Filed: May 13, 2021
Date of Patent: Dec 12, 2023
Assignee: Mississippi State University, Office of Technology Management (Mississippi State, MS)
Inventors: Will Carroll (Starkville, MS), Erin Parker (Starkville, MS), John Carver Middleton (West Point, MS), Reuben F. Burch, V (Columbus, MS), John Ball (Starkville, MS)
Primary Examiner: Karen S Acker
Assistant Examiner: Elizabeth S Ko
Application Number: 29/783,528
Classifications
Current U.S. Class: D8/354