Package

- SPIGEN KOREA CO., LTD.
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Description

FIG. 1 is a front perspective view of the package, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a front elevation view of the package, shown in an environment.

According to the second embodiment of our design, the only difference from the first embodiment is that it contains an illustrative image of a product on the front surface of the package, it being understood that all other surfaces are the same as those of the first embodiment.

The broken lines throughout the drawing figures depict portions of the package that form no part of the claimed design. The broken lines and regions bounded by broken lines form no part of the claimed design.

Claims

The ornamental design for a package, as shown and described.

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Patent History
Patent number: D1007294
Type: Grant
Filed: Jul 28, 2020
Date of Patent: Dec 12, 2023
Assignee: SPIGEN KOREA CO., LTD. (Seoul)
Inventors: Hyunjun Yang (Seoul), Yunhwan Kim (Seoul), Deokhun Moon (Seoul), Goeun Lee (Seoul)
Primary Examiner: Rhea Shields
Application Number: 29/652,371
Classifications
Current U.S. Class: D9/415