Heat conducting unit
Latest SHIN-ETSU POLYMER CO., LTD. Patents:
Description
The stippling in the drawings indicates a contrast in material.
Claims
The ornamental design for a heat conducting unit, as shown and described.
Referenced Cited
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Patent History
Patent number: D1021032
Type: Grant
Filed: Dec 28, 2021
Date of Patent: Apr 2, 2024
Assignee: SHIN-ETSU POLYMER CO., LTD. (Tokyo)
Inventor: Sokuei Motoda (Saitama)
Primary Examiner: Ania Aman
Application Number: 29/821,095
Type: Grant
Filed: Dec 28, 2021
Date of Patent: Apr 2, 2024
Assignee: SHIN-ETSU POLYMER CO., LTD. (Tokyo)
Inventor: Sokuei Motoda (Saitama)
Primary Examiner: Ania Aman
Application Number: 29/821,095
Classifications
Current U.S. Class:
Element (D23/341)