Package

- SPIGEN KOREA CO., LTD.
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Description

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a front perspective view of a package showing our new design according to a first embodiment of our design;

FIG. 2 is a front elevational viewthereof;

FIG. 3 is a rear elevational viewthereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a front elevational view of the package according to a second embodiment of our design.

According to the second embodiment of our design, the only difference from the first embodiment is the front surface of the package, it being understood that all other surfaces are the same as those of the first embodiment.

The broken lines throughout the drawing figures depict portions of the package that form no part of the claimed design.

Claims

The ornamental design for a package, as shown and described.

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Patent History
Patent number: D1021617
Type: Grant
Filed: Jul 28, 2020
Date of Patent: Apr 9, 2024
Assignee: SPIGEN KOREA CO., LTD. (Seoul)
Inventors: Hyunjun Yang (Seoul), Yunhwan Kim (Seoul), Deokhun Moon (Seoul), Goeun Lee (Seoul)
Primary Examiner: Rhea Shields
Application Number: 29/652,365
Classifications
Current U.S. Class: D9/415