Bone conduction headset

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Description

FIG. 1 is a perspective view of a bone conduction headset, showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines depict portions of the bone conduction headset that forms no part of the claimed design

Claims

The ornamental design for a bone conduction headset, as shown and described.

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Patent History
Patent number: D1025006
Type: Grant
Filed: May 30, 2022
Date of Patent: Apr 30, 2024
Assignee: Xiamen Mairdi Electronic Technology Co., Ltd. (Xiamen)
Inventor: Jiahan Wu (Xiamen)
Primary Examiner: Paula Allen Greene
Application Number: 29/840,510
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)