Headphone

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Description

FIG. 1 is a front side perspective view of a headphone;

FIG. 2 is a rear side perspective view of the headphone;

FIG. 3 is a front elevational view of the headphone;

FIG. 4 is a rear elevational view of the headphone;

FIG. 5 is a top plan view of the headphone;

FIG. 6 is a bottom plan view of the headphone;

FIG. 7 is a right side elevational view of the headphone;

FIG. 8 is a left side elevational view of the headphone; and,

FIG. 9 is an enlarged partial sectional view of the headphone taken in the direction of line 9-9 of FIG. 8.

The broken lines adjacent the contour surfaces represent the bounds of the claimed design while all other broken lines are directed to portions of the headphone that form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D1031691
Type: Grant
Filed: Oct 11, 2022
Date of Patent: Jun 18, 2024
Assignee: Audio-Technica Corporation (Tokyo)
Inventors: Kodai Tsubone (Tokyo), Takashi Nara (Kanagawa), Yutaro Kumagai (Kanagawa)
Primary Examiner: Paula Allen Greene
Application Number: 29/793,453
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)