Thermal camera
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Description
The broken lines in the drawings depict portions of the thermal camera that form no part of the claimed design.
Claims
The ornamental design for a thermal camera, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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- “Hikmicro Mini2 Thermal Camera Android” from Amazon.com, first available Dec. 1, 2023 from the internet <https://www.amazon.com/HIKMICRO-Thermal-Android-Resolution-Infrared/dp/B0CP8SG388/> (Year: 2023).
- “Thermal Camera Android—Teslong Thermal Imaging Camera” from Amazon.com, first available May 23, 2023 from the internet <https://www.amazon.com/dp/B0C61WT4B3/> (Year: 2023).
Patent History
Patent number: D1032684
Type: Grant
Filed: Dec 16, 2022
Date of Patent: Jun 25, 2024
Assignee: SCOPEAROUND (Irvine, CA)
Inventor: Yingjie Sun (Irvine, CA)
Primary Examiner: Elizabeth J Oswecki
Assistant Examiner: Lacey Chey Bowman
Application Number: 29/863,171
Type: Grant
Filed: Dec 16, 2022
Date of Patent: Jun 25, 2024
Assignee: SCOPEAROUND (Irvine, CA)
Inventor: Yingjie Sun (Irvine, CA)
Primary Examiner: Elizabeth J Oswecki
Assistant Examiner: Lacey Chey Bowman
Application Number: 29/863,171
Classifications
Current U.S. Class:
Camera Or Body Therefor (D16/200)