Earphone

- SONY GROUP CORPORATION
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Description

FIG. 1 is a front, top, right perspective view of an earphone showing our new design;

FIG. 2 is a rear, bottom, left perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines illustrating portions of the earphone form no part of the claimed design. The dot-dash broken lines defining boundaries of the claimed design form no part of the claimed design.

Claims

The ornamental design for an earphone, as shown and described.

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Patent History
Patent number: D1033394
Type: Grant
Filed: Feb 21, 2022
Date of Patent: Jul 2, 2024
Assignee: SONY GROUP CORPORATION (Tokyo)
Inventors: Takashi Sogabe (Tokyo), Naoe Imafuku (Tokyo)
Primary Examiner: Messina L Smith
Assistant Examiner: Aram Kwon
Application Number: 29/827,600
Classifications
Current U.S. Class: Headphone (D14/223)