Headphone

- SONY GROUP CORPORATION
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Description

FIG. 1 is a perspective view of a headphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines illustrating portions of the headphone form no part of the claimed design. The dot-dash broken lines defining boundaries of the claimed design form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D1034514
Type: Grant
Filed: Mar 16, 2022
Date of Patent: Jul 9, 2024
Assignee: SONY GROUP CORPORATION (Tokyo)
Inventors: Taichi Nokuo (Tokyo), Ippei Tanaka (Tokyo), Ayumi Nakamura (Tokyo)
Primary Examiner: Paula Allen Greene
Application Number: 29/830,958
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)