Headphone

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Description

FIG. 1 is a front, top perspective view of a headphone, showing my new design;

FIG. 2 is a rear, bottom perspective view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines in the figures illustrate portions of the headphone that form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

Referenced Cited
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Other references
  • AIAIAI TMA-2 Studio, date first available: Dec. 17, 2021, [retrieved May 30, 2024], Retrieved from Internet, URL: <https://www.amazon.com/dp/B09NRQCSXT> (Year: 2021).
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Patent History
Patent number: D1038070
Type: Grant
Filed: May 17, 2024
Date of Patent: Aug 6, 2024
Inventor: Zhi Xiao (Hubei)
Primary Examiner: Messina L Smith
Assistant Examiner: Aram Kwon
Application Number: 29/942,872
Classifications