Blister packaging
Description
Claims
The ornamental design for a blister packaging, as shown and described.
Referenced Cited
U.S. Patent Documents
D220431 | April 1971 | Arndt |
D297116 | August 9, 1988 | Fontana |
D305001 | December 12, 1989 | Hayes |
D394001 | May 5, 1998 | Vilos |
D435443 | December 26, 2000 | Maeda |
D473463 | April 22, 2003 | Armstrong |
D561020 | February 5, 2008 | Kessell |
D691880 | October 22, 2013 | Larson |
D741706 | October 27, 2015 | Astorga |
20110214398 | September 8, 2011 | Liburd |
20110233092 | September 29, 2011 | Slattery |
Patent History
Patent number: D1041323
Type: Grant
Filed: Jan 25, 2022
Date of Patent: Sep 10, 2024
Inventor: King Yuen Chau (Hong Kong)
Primary Examiner: Lauren R Calve
Application Number: 29/824,418
Type: Grant
Filed: Jan 25, 2022
Date of Patent: Sep 10, 2024
Inventor: King Yuen Chau (Hong Kong)
Primary Examiner: Lauren R Calve
Application Number: 29/824,418
Classifications
Current U.S. Class:
D9/424