Cover for electronic device

- SPIGEN KOREA CO., LTD.
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Description

FIG. 1 is a front perspective view of a cover for an electronic device showing my new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines throughout the drawing figures depict portions of the cover for an electronic device that form no part of the claimed design. The broken lines and regions bounded by broken lines form no part of the claimed design.

Claims

The ornamental design for a cover for an electronic device, as shown and described.

Referenced Cited
U.S. Patent Documents
D741326 October 20, 2015 Bosveld
D749585 February 16, 2016 Olsson
D874459 February 4, 2020 Limaye
D990471 June 27, 2023 Leung
D1001799 October 17, 2023 Akana
D1007593 December 12, 2023 Li
D1009865 January 2, 2024 Chen
D1013687 February 6, 2024 Hsiao
D1014501 February 13, 2024 Akana
D1024069 April 23, 2024 Wang
Patent History
Patent number: D1042450
Type: Grant
Filed: Mar 5, 2023
Date of Patent: Sep 17, 2024
Assignee: SPIGEN KOREA CO., LTD. (Seoul)
Inventor: Young Kwang Hyun (Seoul)
Primary Examiner: Austin Murphy
Application Number: 29/872,043
Classifications
Current U.S. Class: Head Mounted (D14/372)