Bone conduction headphone
Description
The broken lines depict portions of the bone conduction headphone in which the claimed design resides that form no part of the claimed design.
Claims
The ornamental design for a bone conduction headphone as shown and described.
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Patent History
Patent number: D1049074
Type: Grant
Filed: Sep 28, 2022
Date of Patent: Oct 29, 2024
Inventors: Shilong Li (Beijing), Yuan Gao (Beijing), Lei Zhang (Beijing)
Primary Examiner: Paula Allen Greene
Application Number: 35/518,455
Type: Grant
Filed: Sep 28, 2022
Date of Patent: Oct 29, 2024
Inventors: Shilong Li (Beijing), Yuan Gao (Beijing), Lei Zhang (Beijing)
Primary Examiner: Paula Allen Greene
Application Number: 35/518,455
Classifications
Current U.S. Class:
Headphone Or Headset (D14/205)