Casing for a device
Description
Claims
The ornamental design for a casing for a device as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D1051604
Type: Grant
Filed: Apr 5, 2023
Date of Patent: Nov 19, 2024
Assignee: Wai Kin Daniel KO (Hong Kong)
Inventor: Wai Kin Daniel Ko (Hong Kong)
Primary Examiner: Kimberly Barnes
Assistant Examiner: Alexandria Dubus
Application Number: 29/873,664
Type: Grant
Filed: Apr 5, 2023
Date of Patent: Nov 19, 2024
Assignee: Wai Kin Daniel KO (Hong Kong)
Inventor: Wai Kin Daniel Ko (Hong Kong)
Primary Examiner: Kimberly Barnes
Assistant Examiner: Alexandria Dubus
Application Number: 29/873,664
Classifications
Current U.S. Class:
D3/294;
Headphone (D14/223)