Solid state relay
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Description
The dashed broken lines in the figures show portions of the solid state relay that form no part of the claimed design. The dot-dashed broken lines in the figures depict the bounds of the claim and form no part thereof.
Claims
The ornamental design for a solid state relay, as shown and described.
Referenced Cited
U.S. Patent Documents
D458924 | June 18, 2002 | Tsuyuki |
D541268 | April 24, 2007 | Frank |
D553616 | October 23, 2007 | Tosh |
D608776 | January 26, 2010 | Kang |
D702647 | April 15, 2014 | Liu |
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D743350 | November 17, 2015 | Ringer |
D745471 | December 15, 2015 | Ringer |
D776066 | January 10, 2017 | Geitner |
D776626 | January 17, 2017 | Geitner |
D783623 | April 11, 2017 | Crisp |
D804417 | December 5, 2017 | Baacke |
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D836468 | December 25, 2018 | Holmer |
D968388 | November 1, 2022 | Andersson |
D974341 | January 3, 2023 | Ju |
Patent History
Patent number: D1066266
Type: Grant
Filed: Jul 7, 2023
Date of Patent: Mar 11, 2025
Assignee: OMRON Corporation (Kyoto)
Inventors: Haruki Ayado (Kyoto), Tadahiko Ogawa (Kyoto), Sho Ogawa (Kyoto), Shinya Tsuji (Kyoto)
Primary Examiner: Rosemary K Tarcza
Assistant Examiner: Leah E Hoeferkamp
Application Number: 29/879,488
Type: Grant
Filed: Jul 7, 2023
Date of Patent: Mar 11, 2025
Assignee: OMRON Corporation (Kyoto)
Inventors: Haruki Ayado (Kyoto), Tadahiko Ogawa (Kyoto), Sho Ogawa (Kyoto), Shinya Tsuji (Kyoto)
Primary Examiner: Rosemary K Tarcza
Assistant Examiner: Leah E Hoeferkamp
Application Number: 29/879,488
Classifications
Current U.S. Class:
Relay (D13/159)