Pair of earphones
Description
The broken lines depict portions of the pair of earphones that form no part of the claimed design.
Claims
The ornamental design for a pair of earphones as shown and described.
Referenced Cited
U.S. Patent Documents
| D863265 | October 15, 2019 | Hu |
| D939476 | December 28, 2021 | Lee |
| D967807 | October 25, 2022 | Lyu |
| D997136 | August 29, 2023 | Hong |
| D1005268 | November 21, 2023 | Deng |
| D1024028 | April 23, 2024 | Li |
| D1034539 | July 9, 2024 | Yang |
| D1038916 | August 13, 2024 | Hong |
| D1040140 | August 27, 2024 | Hong |
| D1040785 | September 3, 2024 | Lin |
| D1042407 | September 17, 2024 | Peng |
| D1056874 | January 7, 2025 | Peng |
| 20030044038 | March 6, 2003 | Shirata |
Patent History
Patent number: D1068740
Type: Grant
Filed: Jan 2, 2024
Date of Patent: Apr 1, 2025
Assignee: Shenzhen Yisi Technology Co., Ltd. (Shenzhen)
Inventor: Shihao Liang (Shenzhen)
Primary Examiner: Katie Jane Stofko
Application Number: 29/923,861
Type: Grant
Filed: Jan 2, 2024
Date of Patent: Apr 1, 2025
Assignee: Shenzhen Yisi Technology Co., Ltd. (Shenzhen)
Inventor: Shihao Liang (Shenzhen)
Primary Examiner: Katie Jane Stofko
Application Number: 29/923,861
Classifications
Current U.S. Class:
Headphone (D14/223)