Pair of earphones

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Description

FIG. 1 is a front, right and top perspective view of a pair of earphones, showing my design;

FIG. 2 is a rear, left and bottom perspective view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines depict portions of the pair of earphones that form no part of the claimed design.

Claims

The ornamental design for a pair of earphones as shown and described.

Referenced Cited
U.S. Patent Documents
D863265 October 15, 2019 Hu
D939476 December 28, 2021 Lee
D967807 October 25, 2022 Lyu
D997136 August 29, 2023 Hong
D1005268 November 21, 2023 Deng
D1024028 April 23, 2024 Li
D1034539 July 9, 2024 Yang
D1038916 August 13, 2024 Hong
D1040140 August 27, 2024 Hong
D1040785 September 3, 2024 Lin
D1042407 September 17, 2024 Peng
D1056874 January 7, 2025 Peng
20030044038 March 6, 2003 Shirata
Patent History
Patent number: D1068740
Type: Grant
Filed: Jan 2, 2024
Date of Patent: Apr 1, 2025
Assignee: Shenzhen Yisi Technology Co., Ltd. (Shenzhen)
Inventor: Shihao Liang (Shenzhen)
Primary Examiner: Katie Jane Stofko
Application Number: 29/923,861
Classifications
Current U.S. Class: Headphone (D14/223)