Mold
Description
Claims
The ornamental design for a mold, as shown and described.
Referenced Cited
Patent History
Patent number: D1068869
Type: Grant
Filed: Dec 22, 2023
Date of Patent: Apr 1, 2025
Assignee: Hologram Holdings I, Inc. (San Clemente, CA)
Inventors: Danwei Ye (Solon, OH), Andrianna Niebling (Tempe, AZ)
Primary Examiner: Khawaja Anwar
Application Number: 29/922,552
Type: Grant
Filed: Dec 22, 2023
Date of Patent: Apr 1, 2025
Assignee: Hologram Holdings I, Inc. (San Clemente, CA)
Inventors: Danwei Ye (Solon, OH), Andrianna Niebling (Tempe, AZ)
Primary Examiner: Khawaja Anwar
Application Number: 29/922,552
Classifications
Current U.S. Class:
Ice Tray Or Mold (D15/90)