Blister pack packaging

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Description

1. Blister pack packaging

2. Blister pack packaging

3. Blister pack packaging

1.1 : Perspective

1.2 : Front

1.3 : Back

1.4 : Top

1.5 : Bottom

1.6 : Left

1.7 : Right

2.1 : Perspective

2.2 : Front

2.3 : Back

2.4 : Top

2.5 : Bottom

2.6 : Left

2.7 : Right

3.1 : Perspective

3.2 : Front

3.3 : Back

3.4 : Top

3.5 : Bottom

3.6 : Left

3.7 : Right

The claimed design in this application is a blister pack for packing an auxiliary module used for a cosmetic or medical device; the broken lines illustrate portions of the blister pack that form no part of the claimed design; the dash-single dotted lines indicate boundaries between the claimed design and unclaimed design and form no part of the claimed design.

Claims

The ornamental design for a blister pack packaging as shown and described.

Referenced Cited
U.S. Patent Documents
D244429 May 24, 1977 Gardner
D351554 October 18, 1994 Kim
5418022 May 23, 1995 Anderson
D370625 June 11, 1996 Kelsey
D538676 March 20, 2007 Millen
D659550 May 15, 2012 Mazor
D675088 January 29, 2013 West
D729636 May 19, 2015 Steinberger
D807741 January 16, 2018 Heidel
D951768 May 17, 2022 Hinkle
D952471 May 24, 2022 Fox
20120298545 November 29, 2012 Denzler
20170096272 April 6, 2017 Coon
20180162619 June 14, 2018 Kocur
20190175868 June 13, 2019 Spens
Patent History
Patent number: D1070603
Type: Grant
Filed: Oct 26, 2023
Date of Patent: Apr 15, 2025
Inventor: Daehyun Kim (Hwaseong-si)
Primary Examiner: Lauren R Calve
Application Number: 35/520,388
Classifications
Current U.S. Class: D9/600; D9/414; D9/434