Housing for electrical and electronic components

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

1. Housing for electrical and electronic components

2. Housing for electrical and electronic components

1.1 is a front view of a housing for electrical and electronic components showing our new design with a front cover open;

1.2 is a right side view thereof;

1.3 is a front, top, and right side perspective view thereof;

1.4 is a front, bottom and left side perspective view thereof;

2.1 is a front view of the housing for electrical and electronic components shown in Reproduction 1.1 with the front cover closed;

2.2 is a right side view thereof;

2.3 is a front, top, and right side perspective view thereof;

2.4 is a front, bottom and left side perspective view thereof

The broken lines shown in the drawings depict portions of the housing that form no part of the claimed design.

Claims

The ornamental design for a housing for electrical and electronic components as shown and described.

Referenced Cited
U.S. Patent Documents
D541798 May 1, 2007 Ichida
D556698 December 4, 2007 Walser
D558152 December 25, 2007 Tatsuyama
D559792 January 15, 2008 Gemme
D610096 February 16, 2010 Gemme
D642134 July 26, 2011 Walser
D653626 February 7, 2012 Grunwald
D794579 August 15, 2017 Peterson
D927432 August 10, 2021 Panseri
D933026 October 12, 2021 Sanwald
Patent History
Patent number: D1072771
Type: Grant
Filed: Feb 10, 2022
Date of Patent: Apr 29, 2025
Assignee: SEG Electronics GmbH (Kempen)
Inventors: Kolja Enrico Welchering (Viersen), Michael Geraedts (Nettetal)
Primary Examiner: Selina Sikder
Application Number: 35/517,326