Cooler for electronic devices

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Description

FIG. 1 is a perspective view illustrating the overall shape of the cooler for electronic devices, showing our new design;

FIG. 2 is a front view depicting the front portion of the design;

FIG. 3 is a rear view illustrating the rear portion of the design;

FIG. 4 a left side view portraying the left side portion of the design;

FIG. 5 is a right side view depicting the right side portion of the design;

FIG. 6 is a top view illustrating the top portion of the design; and,

FIG. 7 is a bottom view showing the bottom portion of the design.

The materials of this design include metal and synthetic resin.

This design serves as a cooler for electronic devices with elevated temperatures, comprising thermal components, a heat sink, and a cooling fan. The distinctive feature is the cooling fan circulating air over the heat sink, which dissipates heat conducted from the thermal components.

Claims

The ornamental design for a cooler for electronic devices as shown and described.

Referenced Cited
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Foreign Patent Documents
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Other references
  • DIY kits Thermoelectric Peltier Refrigeration Cooling System, posted date (unavailable), retrieved Apr. 23, 2025 (online), https://www.ebay.com/itm/182211688072 (Year: 2025).
Patent History
Patent number: D1081606
Type: Grant
Filed: Feb 1, 2024
Date of Patent: Jul 1, 2025
Assignee: Industry-University Cooperation Foundation Sunmoon University (Asan-si)
Inventors: Min Soo Kang (Asan-si), Jong Hwan Yun (Pyeongtaek-si)
Primary Examiner: Justin M Jonaitis
Assistant Examiner: Bria' L Simmons-Holloway
Application Number: 29/926,984