Cooler for electronic devices
Latest Industry-University Cooperation Foundation Sunmoon University Patents:
The materials of this design include metal and synthetic resin.
This design serves as a cooler for electronic devices with elevated temperatures, comprising thermal components, a heat sink, and a cooling fan. The distinctive feature is the cooling fan circulating air over the heat sink, which dissipates heat conducted from the thermal components.
Claims
The ornamental design for a cooler for electronic devices as shown and described.
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Type: Grant
Filed: Feb 1, 2024
Date of Patent: Jul 1, 2025
Assignee: Industry-University Cooperation Foundation Sunmoon University (Asan-si)
Inventors: Min Soo Kang (Asan-si), Jong Hwan Yun (Pyeongtaek-si)
Primary Examiner: Justin M Jonaitis
Assistant Examiner: Bria' L Simmons-Holloway
Application Number: 29/926,984