Assembled electronics housing

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Description

FIG. 1 is a top front perspective view of our assembled electronics housing;

FIG. 2 is a top rear perspective thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a front side view thereof;

FIG. 6 is a rear side view thereof; and,

FIG. 7 is a side view thereof.

The right side view of the assembled electronics housing, as illustrated in FIG. 7 is a mirror image of the left side view of the assembled electronics housing.

Claims

The ornamental design for an assembled electronics housing, as shown and described.

Referenced Cited
U.S. Patent Documents
D316853 May 14, 1991 Dickey
D394262 May 12, 1998 Cross
D416558 November 16, 1999 Harrington
D482691 November 25, 2003 McClelland, II
D604706 November 24, 2009 Sato
D820202 June 12, 2018 Wolff
D943586 February 15, 2022 Jun
D951937 May 17, 2022 Jun
20090291571 November 26, 2009 Davis
Patent History
Patent number: D1082783
Type: Grant
Filed: Feb 25, 2022
Date of Patent: Jul 8, 2025
Assignee: Redarc Technologies Pty Ltd.
Inventors: James Christian Albrechtsen (Morphett Vale), Seth Michael Brady (Hindmarsh), Peter William Cosgriff (Morphett Vale)
Primary Examiner: Khawaja Anwar
Assistant Examiner: Megan Tiana Rakos
Application Number: 29/828,399
Classifications
Current U.S. Class: Peripheral Equipment (D14/356)