Case for electronic communication device

- SPIGEN KOREA CO., LTD.
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Description

FIG. 1 is a front, top, right side perspective view of a case for electronic communication device showing my new design;

FIG. 2 is a rear, top, left side perspective view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines in the drawings show portions of the case for electronic communication device that form no part of the claimed design.

Claims

The ornamental design for a case for electronic communication device, as shown and described.

Referenced Cited
U.S. Patent Documents
D654491 February 21, 2012 Melanson
D716783 November 4, 2014 Loncar
D840992 February 19, 2019 Kim
D905681 December 22, 2020 Kim
D907619 January 12, 2021 Ahn
D908686 January 26, 2021 Lee
D913270 March 16, 2021 Lee
D916071 April 13, 2021 Lin
D936643 November 23, 2021 Yang
D951933 May 17, 2022 Lee
D997925 September 5, 2023 Weng
D1003882 November 7, 2023 Seo
D1032586 June 25, 2024 Hu
D1032587 June 25, 2024 Weng
Other references
  • Spigen Core Armor Designed for iPh6.7P(23) Case (2023), publication date Dec. 31, 2023, [online] URL: https://www.amazon.com/Spigen-Core-Armor-Designed-iPh6-7P/dp/B0C2WY9ZSX/ (Year: 2023).
  • Spigen Core Armor Mag Designed for iPh6.7P(23) Case (2023), publication date Oct. 3, 2023, [online] URL: https://www.amazon.com/Spigen-Core-Armor-Designed-iPh6-7P/dp/B0C2XF2S1G/ (Year: 2023).
Patent History
Patent number: D1087076
Type: Grant
Filed: Jul 12, 2023
Date of Patent: Aug 5, 2025
Assignee: SPIGEN KOREA CO., LTD. (Seoul)
Inventor: Ji Hyun Kim (Seoul)
Primary Examiner: L. A. Grabenstetter
Application Number: 29/897,195
Classifications