Headphone

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Description

FIG. 1 is a front, right, and top side perspective view of a headphone showing the new design;

FIG. 2 is a rear, left and bottom side perspective view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines are included to depict portions of the headphone that form no part of the claimed design.

Claims

The ornamental design for a headphone as shown and described.

Referenced Cited
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Patent History
Patent number: D1092434
Type: Grant
Filed: Nov 22, 2023
Date of Patent: Sep 9, 2025
Assignee: JIANGXI MEIDONG TECHNOLOGY CO., LTD. (Yichun)
Inventor: Qingkai Mei (Yichun)
Primary Examiner: Paula Allen Greene
Application Number: 29/917,828
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)