Case for electronic communications device

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Description

FIG. 1 is a rear perspective view of a case for electronic communications device, showing my new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines in the drawings show portions of the case for electronic communications device that form no part of the claimed design.

Claims

The ornamental design for a case for electronic communications device, as shown and described.

Referenced Cited
U.S. Patent Documents
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Foreign Patent Documents
202430408119.7 September 2025 CN
Other references
  • Leaked iPhone 17 frame shows wide, Pixel-style camera bump, publication date Dec. 12, 2024, [online] URL: https://www.macworld.com/article/2555317/leaked-iphone-17-frame-shows-wide-pixel-style-camera-bump.html (Year: 2024).
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Patent History
Patent number: D1105049
Type: Grant
Filed: Jun 27, 2025
Date of Patent: Dec 9, 2025
Assignee: SPIGEN KOREA CO., LTD. (Seoul)
Inventor: Chanyeop Jeong (Seoul)
Primary Examiner: L. A. Grabenstetter
Application Number: 30/010,618
Classifications