Wire frame

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Description

FIG. 1 is a perspective view of a wire frame showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines shown in the figures are for the purpose of illustrating portions of the wire frame which form no part of the claimed design.

Claims

The ornamental design for a wire frame, as shown and described.

Referenced Cited
U.S. Patent Documents
4234865 November 18, 1980 Shigehara
D455715 April 16, 2002 Sakai
D474150 May 6, 2003 Amago
D532747 November 28, 2006 Ricci
D613245 April 6, 2010 Honna
D644605 September 6, 2011 Shaw
D644608 September 6, 2011 Kobayashi
D768518 October 11, 2016 Shamir
D790468 June 27, 2017 Kokura
Patent History
Patent number: D1117042
Type: Grant
Filed: Sep 12, 2024
Date of Patent: Mar 10, 2026
Assignee: YU JING TECHNOLOGY CO., LTD. (Taoyuan)
Inventor: Sen-tai Yang (Taoyuan)
Primary Examiner: Derrick E Holland
Application Number: 29/962,715
Classifications