Sensing module
Description
The broken lines are directed to environment and are for illustrative purpose only; the broken lines form no part of the claimed design.
Claims
The ornamental design for a sensing module as shown and described.
Referenced Cited
U.S. Patent Documents
| 20080061313 | March 13, 2008 | Yen |
| 20080061393 | March 13, 2008 | Yen |
| 20080251869 | October 16, 2008 | Yen |
| 20190067352 | February 28, 2019 | Wang |
| 20210313366 | October 7, 2021 | Yajima |
| 20250267977 | August 21, 2025 | Hung |
Patent History
Patent number: D1119797
Type: Grant
Filed: May 20, 2024
Date of Patent: Mar 24, 2026
Assignee: Taiwan-Asia Semiconductor Corporation (Hsinchu City)
Inventor: Chun-Chieh Lin (Hsinchu)
Primary Examiner: Antoine Duval Davis
Application Number: 29/943,151
Type: Grant
Filed: May 20, 2024
Date of Patent: Mar 24, 2026
Assignee: Taiwan-Asia Semiconductor Corporation (Hsinchu City)
Inventor: Chun-Chieh Lin (Hsinchu)
Primary Examiner: Antoine Duval Davis
Application Number: 29/943,151
Classifications
Current U.S. Class:
Element Or Attachment (D13/118)