Sensing module

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Description

FIG. 1 is a perspective view of a sensing module showing the claimed design;

FIG. 2 is front elevational view thereof; a rear elevational view being symmetric to the front elevational view;

FIG. 3 is a left side elevational view thereof; a right side elevational view being symmetric to the left side elevational view;

FIG. 4 is a top plan view thereof; and,

FIG. 5 is a bottom plan view thereof.

The broken lines are directed to environment and are for illustrative purpose only; the broken lines form no part of the claimed design.

Claims

The ornamental design for a sensing module as shown and described.

Referenced Cited
U.S. Patent Documents
20080061313 March 13, 2008 Yen
20080061393 March 13, 2008 Yen
20080251869 October 16, 2008 Yen
20190067352 February 28, 2019 Wang
20210313366 October 7, 2021 Yajima
20250267977 August 21, 2025 Hung
Patent History
Patent number: D1119797
Type: Grant
Filed: May 20, 2024
Date of Patent: Mar 24, 2026
Assignee: Taiwan-Asia Semiconductor Corporation (Hsinchu City)
Inventor: Chun-Chieh Lin (Hsinchu)
Primary Examiner: Antoine Duval Davis
Application Number: 29/943,151
Classifications
Current U.S. Class: Element Or Attachment (D13/118)