Earphone case
Description
The broken lines shown in the figures are for the purpose of illustrating portions of the article and form no part of the claimed design.
Claims
The ornamental design for an earphone case as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
| D49217 | June 1916 | King |
| D731178 | June 9, 2015 | Gorouvein |
| D929962 | September 7, 2021 | Yi |
| D929963 | September 7, 2021 | Park |
| D980798 | March 14, 2023 | Feng |
| D988983 | June 13, 2023 | Lin |
| D1024029 | April 23, 2024 | Wang |
| D1034542 | July 9, 2024 | Zhu |
| 32 2021 003323 5 | August 2021 | BR |
| 148289 | October 2024 | CH |
- Over Ear Headphones Air Conduction, announced Aug. 4, 2023 [online], [site visited Jan. 8, 2026]. Available from internet, URL: <https://www.amazon.com/dp/B0DGG5JGGS?th=1> (Year: 2023).
- Keminsung Case for Anker soundcore v20iannounced Sep. 4, 2024 [online], [site visited Jan. 8, 2026]. Available from internet, URL: <https://www.amazon.com/Keminsung-soundcore-Shockproof-Protective-Carabiner/dp/B0DG322T5L?th=1> (Year: 2024).
- Nothing Ear (Open) Open-Ear Headphones, announced Sep. 23, 2024 [online], [site visited Jan. 8, 2026]. Available from internet, URL: <https://www.amazon.com/dp/B0DGLL5CWK> (Year: 2024).
Patent History
Patent number: D1123355
Type: Grant
Filed: Aug 21, 2025
Date of Patent: Apr 28, 2026
Assignee: VISION INTELLIGENCE CO., LTD (Hefei City)
Inventor: Xiao Ma (Hefei City)
Primary Examiner: Kevin K Rudzinski
Assistant Examiner: Amber J Rabie
Application Number: 30/019,300
Type: Grant
Filed: Aug 21, 2025
Date of Patent: Apr 28, 2026
Assignee: VISION INTELLIGENCE CO., LTD (Hefei City)
Inventor: Xiao Ma (Hefei City)
Primary Examiner: Kevin K Rudzinski
Assistant Examiner: Amber J Rabie
Application Number: 30/019,300
Classifications
Current U.S. Class:
D3/212