Combined wireless headphone and headphone case
The broken lines in the drawings depict portions of the combined wireless headphone and headphone case that form no part of the claimed design.
The broken lines forming a boundary in
The second headphone depicted in
Claims
The ornamental design for a combined wireless headphone and headphone case, as shown and described.
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Type: Grant
Filed: Feb 4, 2024
Date of Patent: Jul 21, 2026
Assignee: Shenzhen Ye Yin Technology Co., LTD (Shenzhen)
Inventor: Zeyu Tang (Guangzhou)
Primary Examiner: Dana K Weiland
Assistant Examiner: David Michael Sullivan
Application Number: 29/927,359