Grounding bonding bridge
Latest Titan3 Technology LLC Patents:
Description
Claims
The ornamental design for a grounding bonding bridge as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
| D296546 | July 5, 1988 | Sachs |
| D414744 | October 5, 1999 | Surinak |
| D615498 | May 11, 2010 | Lalancette |
| D626087 | October 26, 2010 | Kiely |
| D648281 | November 8, 2011 | Cerasale |
| D652388 | January 17, 2012 | Cerasale |
| D660802 | May 29, 2012 | Quinn, Jr. |
| D949795 | April 26, 2022 | Anderson |
- Amazon.com Madison Electric Intersystem Bonding Bridge. Date first available: Dec. 2013 https://www.amazon.com/Madison-Electric-Products-MEIBB-Intersystem/dp/B00H8NVPAQ/ (Year: 2013).
- Titan3 Bonding Bridge. Date first available Jan. 2026. https://www.titan3.com/grounding-products/intersystem-bonding-bridge (Year: 2026).
Patent History
Patent number: D1137158
Type: Grant
Filed: Nov 13, 2023
Date of Patent: Jul 28, 2026
Assignee: Titan3 Technology LLC (Tempe, AZ)
Inventor: Jeffrey P. Baldwin (Anthem, AZ)
Primary Examiner: Jennifer O King
Application Number: 29/916,532
Type: Grant
Filed: Nov 13, 2023
Date of Patent: Jul 28, 2026
Assignee: Titan3 Technology LLC (Tempe, AZ)
Inventor: Jeffrey P. Baldwin (Anthem, AZ)
Primary Examiner: Jennifer O King
Application Number: 29/916,532
Classifications
Current U.S. Class:
Threaded Engagement (D13/151)