Grounding bonding bridge

- Titan3 Technology LLC
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Description

FIG. 1 is a top, right, perspective view of a grounding bonding bridge showing the new design;

FIG. 2 is a bottom, perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left-side view thereof;

FIG. 6 is a right-side view thereof;

FIG. 7 is a top view thereof; and,

FIG. 8 is a bottom view thereof.

Claims

The ornamental design for a grounding bonding bridge as shown and described.

Referenced Cited
U.S. Patent Documents
D296546 July 5, 1988 Sachs
D414744 October 5, 1999 Surinak
D615498 May 11, 2010 Lalancette
D626087 October 26, 2010 Kiely
D648281 November 8, 2011 Cerasale
D652388 January 17, 2012 Cerasale
D660802 May 29, 2012 Quinn, Jr.
D949795 April 26, 2022 Anderson
Other references
  • Amazon.com Madison Electric Intersystem Bonding Bridge. Date first available: Dec. 2013 https://www.amazon.com/Madison-Electric-Products-MEIBB-Intersystem/dp/B00H8NVPAQ/ (Year: 2013).
  • Titan3 Bonding Bridge. Date first available Jan. 2026. https://www.titan3.com/grounding-products/intersystem-bonding-bridge (Year: 2026).
Patent History
Patent number: D1137158
Type: Grant
Filed: Nov 13, 2023
Date of Patent: Jul 28, 2026
Assignee: Titan3 Technology LLC (Tempe, AZ)
Inventor: Jeffrey P. Baldwin (Anthem, AZ)
Primary Examiner: Jennifer O King
Application Number: 29/916,532
Classifications
Current U.S. Class: Threaded Engagement (D13/151)