Headphone

- SONY GROUP CORPORATION
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Description

FIG. 1 is a front, bottom, right perspective view of a headphone showing my new design;

FIG. 2 is a rear, bottom, left perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a front, bottom, right perspective view along sectional line 9 of FIG. 1; and,

FIG. 10 is a rear, bottom, left perspective view along sectional line 10 of FIG. 2.

The broken lines illustrating portions of the headphone form no part of the claimed design. The dot dash lines defining boundaries of enlarged views of the claimed design form no part of the claimed design.

Claims

The ornamental design for a headphone as shown and described.

Referenced Cited
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Foreign Patent Documents
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Other references
  • Beribes, “Upgraded Hybrid Active Noise . . . ”, available at amazon.com, date first available Aug. 15, 2023, site visited Mar. 17, 2026, available at URL: https://a.co/d/OcDSyUlb (Year: 2023).
  • Turtle Beach, “Recon 200 Gen 2 . . . ”, available at amazon.com, date first available Sep. 23, 2021, site visited Mar. 17, 2026, available at URL: https://a.co/d/0am7sMeb (Year: 2021).
Patent History
Patent number: D1139221
Type: Grant
Filed: Apr 30, 2025
Date of Patent: Aug 4, 2026
Assignee: SONY GROUP CORPORATION (Tokyo)
Inventor: Soichi Tanaka (Kanagawa)
Primary Examiner: Daniel J Domino
Assistant Examiner: Samina Vieth
Application Number: 30/001,910
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)