CPU module
Description
The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
1. CPU module
The areas represented by the dashed lines and the areas colored in light gray do not form part of the claimed design; the present design is characterized by its flat front surface and beveled top; the present design is also characterized by the fact that the flat front surface is colored in glossy black.
Claims
The ornamental design for a CPU module as shown and described.
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Patent History
Patent number: D1140913
Type: Grant
Filed: Mar 21, 2024
Date of Patent: Aug 11, 2026
Inventors: Kazuhira Urushizaki (Tokyo), Tatsuya Kurihara (Tokyo), Liang Ma (Tokyo), Keiichi Sasaki (Tokyo), Atsushi Tsuruta (Tokyo), Yoshiya Watanabe (Tokyo), Jumpei Okamoto (Tokyo)
Primary Examiner: Ben-Yen T Nguyen
Assistant Examiner: Carrie S Gelula
Application Number: 35/524,432
Type: Grant
Filed: Mar 21, 2024
Date of Patent: Aug 11, 2026
Inventors: Kazuhira Urushizaki (Tokyo), Tatsuya Kurihara (Tokyo), Liang Ma (Tokyo), Keiichi Sasaki (Tokyo), Atsushi Tsuruta (Tokyo), Yoshiya Watanabe (Tokyo), Jumpei Okamoto (Tokyo)
Primary Examiner: Ben-Yen T Nguyen
Assistant Examiner: Carrie S Gelula
Application Number: 35/524,432
Classifications
Current U.S. Class:
Mainframe, Central Data Processing Or Server Type (D14/301)