Laser marking machine
Description
The broken lines in the drawings illustrate portions of the laser marking machine that form no part of the claimed design.
Claims
The ornamental design for a laser marking machine, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
| 11684090 | June 27, 2023 | Mah |
| D991990 | July 11, 2023 | Chen |
| D991991 | July 11, 2023 | Chen |
| D1013748 | February 6, 2024 | Park |
| D1112398 | February 10, 2026 | Shi |
| 20210046589 | February 18, 2021 | Mossi |
| 20250091157 | March 20, 2025 | Fasoli |
| 20250121453 | April 17, 2025 | Wang |
| 20250326054 | October 23, 2025 | Wu |
| 20260034611 | February 5, 2026 | Zhang |
| 202530008058.X | December 2025 | CN |
- Laser marking system Precision S _ Saurer MarkingSolutions, posted Sep. 27, 2023, [retrieved via Wayback Machine Mar. 19, 2026]. Retrieved from internet: https://web.archive.org/web/20230927085329/https://saurer-markingsolutions.com/en/laser-marking-systems/marking-laser-precision-ms-s/ (Year: 2023).
- Amazon.com_ xTool F1 Ultra 20W Fiber & Diode Dual Laser Engraver, posted Jul. 19, 2024, [retrieved Mar. 19, 2026]. Retrieved from internet: https://www.amazon.com/dp/B0D9Q787GN/?th=1 (Year: 2024).
- XLaserlab E3 _ the One for All Ultrafast UV Laser Engraver—YouTube, posed Oct. 4, 2025, [retrieved Mar. 19, 2026]. Retrieved from internet: https://www.youtube.com/watch?v=XqZ3XljbU84 (Year: 2025).
- Me.Carve M6 20W Fiber & Diode Dual laser—Mr Carve, posted Oct. 16, 2025, [retrieved via Wayback Machine Mar. 19, 2026]. Retrieved from internet: https://web.archive.org/web/20251016001614/https://mr-carve.com/products/m6 (Year: 2025).
Patent History
Patent number: D1142534
Type: Grant
Filed: Jul 11, 2025
Date of Patent: Aug 18, 2026
Assignee: SHENZHEN XINGHAN LASER TECHNOLOGY CO., LTD. (Shenzhen)
Inventors: Shaofeng Zhou (Shenzhen), Liang Ding (Shenzhen), Weijun Guo (Shenzhen), Tianjian Lv (Shenzhen)
Primary Examiner: Khawaja Anwar
Assistant Examiner: Karen M. Jones
Application Number: 30/012,633
Type: Grant
Filed: Jul 11, 2025
Date of Patent: Aug 18, 2026
Assignee: SHENZHEN XINGHAN LASER TECHNOLOGY CO., LTD. (Shenzhen)
Inventors: Shaofeng Zhou (Shenzhen), Liang Ding (Shenzhen), Weijun Guo (Shenzhen), Tianjian Lv (Shenzhen)
Primary Examiner: Khawaja Anwar
Assistant Examiner: Karen M. Jones
Application Number: 30/012,633
Classifications
Current U.S. Class:
Material Working, Abrading, Or Founding Machinery (D15/122)