Heat transfer machine mold assembly for badge pattern

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Description

FIG. 1 is a front, right and top perspective view of a heat transfer machine mold assembly for badge pattern, showing our new design;

FIG. 2 is a rear, left and top perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof; and,

FIG. 9 is a perspective view of a heat transfer machine mold assembly for badge pattern in a state of use thereof.

The broken lines shown in the drawings illustrate portions of the heat transfer machine mold assembly for badge pattern that form no part of the claimed design.

Claims

The ornamental design for a heat transfer machine mold assembly for badge pattern, as shown and described.

Referenced Cited
U.S. Patent Documents
D300240 March 14, 1989 Sakuma
D370031 May 21, 1996 Dabrowski
D460468 July 16, 2002 Powers
D688667 August 27, 2013 Gander
D695174 December 10, 2013 Kang
D830769 October 16, 2018 Wang
D863168 October 15, 2019 Lin
D896715 September 22, 2020 Bellaflor
D917676 April 27, 2021 Freeman
D936411 November 23, 2021 Assis
D1040877 September 3, 2024 Zhang
D1073561 May 6, 2025 Tortorella, Jr.
D1108514 January 6, 2026 Ai
Patent History
Patent number: D1142541
Type: Grant
Filed: Aug 8, 2025
Date of Patent: Aug 18, 2026
Assignee: HUNAN SIJIU TECHNOLOGY CO., LTD. (Changsha)
Inventors: Wenxiong Huang (Changsha), Min Ai (Changsha)
Primary Examiner: Amber R Stiles
Assistant Examiner: Eidiol Ghigliotty Torres
Application Number: 30/017,239
Classifications
Current U.S. Class: Mold Or Die (D15/136)