Robotic head assembly
Description
The broken lines shown in the figures illustrate portions of the robotic head assembly that form no part of the claimed design.
Claims
The ornamental design for a robotic head assembly, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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Patent History
Patent number: D1142563
Type: Grant
Filed: Jul 24, 2025
Date of Patent: Aug 18, 2026
Assignee: Tangible Robots, Inc. (Palo Alto, CA)
Inventors: Thomas Vu Nguyen (Longwood, FL), Benjamin Soria (Palo Alto, CA), Bipasha Sen (Palo Alto, CA)
Primary Examiner: Khawaja Anwar
Assistant Examiner: Cheng Chen
Application Number: 30/014,887
Type: Grant
Filed: Jul 24, 2025
Date of Patent: Aug 18, 2026
Assignee: Tangible Robots, Inc. (Palo Alto, CA)
Inventors: Thomas Vu Nguyen (Longwood, FL), Benjamin Soria (Palo Alto, CA), Bipasha Sen (Palo Alto, CA)
Primary Examiner: Khawaja Anwar
Assistant Examiner: Cheng Chen
Application Number: 30/014,887
Classifications
Current U.S. Class:
Miscellaneous (D15/199)