Heat transfer machine mold for badge pattern
The broken lines shown in the drawings illustrate portions of the heat transfer machine mold for badge pattern that form no part of the claimed design.
Claims
The ornamental design for a heat transfer machine mold for badge pattern, as shown and described.
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Type: Grant
Filed: Aug 8, 2025
Date of Patent: Aug 25, 2026
Assignee: HUNAN SIJIU TECHNOLOGY CO., LTD. (Changsha)
Inventors: Wenxiong Huang (Changsha), Min Ai (Changsha)
Primary Examiner: Amber R Stiles
Assistant Examiner: Eidiol Ghigliotty Torres
Application Number: 30/017,206