Lay down hair clip

- Teleties, LLC

Latest Teleties, LLC Patents:

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of an embodiment of a lay down hair clip in an open position, showing my design.

FIG. 2 is a front elevation view thereof.

FIG. 3 is a rear elevation view thereof.

FIG. 4 is a left side elevation view thereof.

FIG. 5 is a right side elevation view thereof.

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines in the drawings depicting portions of the lay down hair clip are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a lay down hair clip, as shown and described.

Referenced Cited
U.S. Patent Documents
D794870 August 15, 2017 Hsu
11497289 November 15, 2022 Hsu
D1031161 June 11, 2024 Muscato
D1047275 October 15, 2024 Muscato
D1075147 May 13, 2025 Muscato
D1098588 October 14, 2025 Yang
RE50659 November 11, 2025 Muscato
Patent History
Patent number: D1149173
Type: Grant
Filed: Oct 9, 2024
Date of Patent: Sep 22, 2026
Assignee: Teleties, LLC (Maitland, FL)
Inventor: Lindsay Muscato (Maitland, FL)
Primary Examiner: Zenia I Bennett
Application Number: 29/967,248
Classifications
Current U.S. Class: Spring Clip Type (D28/40)